GB1427624A - Semiconductor cooling means - Google Patents

Semiconductor cooling means

Info

Publication number
GB1427624A
GB1427624A GB520173A GB520173A GB1427624A GB 1427624 A GB1427624 A GB 1427624A GB 520173 A GB520173 A GB 520173A GB 520173 A GB520173 A GB 520173A GB 1427624 A GB1427624 A GB 1427624A
Authority
GB
United Kingdom
Prior art keywords
tubes
cooling
members
thyristor
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB520173A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2204589A external-priority patent/DE2204589A1/en
Priority claimed from DE2208937A external-priority patent/DE2208937A1/en
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB1427624A publication Critical patent/GB1427624A/en
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Abstract

1427624 Semi-conductor devices SIEMENS AG 1 Feb 1973 [1 Feb 1972 25 Feb 1972] 5201/73 Heading H1K A disc cell thyristor 2 recessed at 3, 4 is retained by the pressure of coned shoulders 5, 6, of a Cu or Al cooling member 7, 8 receiving developed heat; each member having two longitudinal bores 11, 12 parallel to faces 9, 10 of the thyristor and disposed horizontally or vertically. Thin walled heat tubes 15, 16 of Cu extend through bores 11, 12 and are brazed in for thermal contact; sealedly containing a capillary structure of, e.g. metal gauze 17 saturated with methanol, ethanol, acetone, benzene, or water. The tubes project from both ends of cooling members 7, 8 and carry rectangular air convection cooling plates 18, 19 of, e.g. Al, which are push fitted or welded on the tubes to lie spacedly parallel; their edges being positionally located by plastic members (not shown). Alternatively the tubes may be ribbed for cooling. Securing straps 21, 22 bored at 23, 24 are machined on to cooling member 7 with similar straps on member 8, and are interconnected in pairs by screws and locknuts engaging the bores, or secured by yokes bridging the securing straps. The members 7, 8 effect electrical connections to the thyristor and have tapped bores for terminals, and in operation heat developed in the thyristor is transferred to members 7, 8 to locally evaporate the working fluid, whose vapour flows in the sense of the temperature drop to condense at the outer ends of the tubes 11, 12 from whence the heat of condensation is dissipated by the cooling plates 18, 19. In a modification (Figs. 3, 4, not shown) a thyristor is similarly held between cooling members secured together by external screws and lugs, which have therein continuous longitudinal channels of elongate cross-section. The latter may be respectively oval and rectangular, and therein thin walled heat tubes are brazed, lined with a capillary structure of, e.g. metal gauze impregnated with a working fluid, e.g. benzene, methanol, ethanol, or water. The tubes are sealed and project out of the recesses at each end and carry cooling fins thereupon, and may be fabricated of two or more sealed component tubes in abutting contact. In a further modification (Fig. 5, not shown) the channels in the cooling members have rectangular cross-sections containing correspondingly shaped heat tubes, and the members are resiliently compressed against the flat side of a thyristor by opposed bow springs connected at the ends by screws and nuts. The heat tubes may be shrunk, screwed or brazed into the cooling members. Reference has been directed by the Comptroller to Specification 1,346,157.
GB520173A 1972-02-01 1973-02-01 Semiconductor cooling means Expired GB1427624A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2204589A DE2204589A1 (en) 1972-02-01 1972-02-01 COOLING ARRANGEMENT FOR FLAT SEMICONDUCTOR COMPONENTS
DE2208937A DE2208937A1 (en) 1972-02-25 1972-02-25 HEAT PIPE COOLING ARRANGEMENT FOR FLAT SEMI-CONDUCTOR COMPONENTS

Publications (1)

Publication Number Publication Date
GB1427624A true GB1427624A (en) 1976-03-10

Family

ID=25762653

Family Applications (1)

Application Number Title Priority Date Filing Date
GB520173A Expired GB1427624A (en) 1972-02-01 1973-02-01 Semiconductor cooling means

Country Status (8)

Country Link
AT (1) AT324436B (en)
BE (1) BE794501A (en)
CH (1) CH550485A (en)
FR (1) FR2170040B1 (en)
GB (1) GB1427624A (en)
IT (1) IT978507B (en)
LU (1) LU66933A1 (en)
NL (1) NL7300759A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359329A (en) * 2001-05-30 2002-12-13 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
CH550485A (en) 1974-06-14
AT324436B (en) 1975-08-25
NL7300759A (en) 1973-08-03
FR2170040B1 (en) 1978-02-10
IT978507B (en) 1974-09-20
FR2170040A1 (en) 1973-09-14
BE794501A (en) 1973-05-16
LU66933A1 (en) 1973-04-02

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee