CH550485A - COOLING ARRANGEMENT FOR A SEMICONDUCTOR COMPONENT. - Google Patents

COOLING ARRANGEMENT FOR A SEMICONDUCTOR COMPONENT.

Info

Publication number
CH550485A
CH550485A CH132073A CH132073A CH550485A CH 550485 A CH550485 A CH 550485A CH 132073 A CH132073 A CH 132073A CH 132073 A CH132073 A CH 132073A CH 550485 A CH550485 A CH 550485A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
cooling arrangement
cooling
arrangement
semiconductor
Prior art date
Application number
CH132073A
Other languages
German (de)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2204589A external-priority patent/DE2204589A1/en
Priority claimed from DE2208937A external-priority patent/DE2208937A1/en
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH550485A publication Critical patent/CH550485A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH132073A 1972-02-01 1973-01-30 COOLING ARRANGEMENT FOR A SEMICONDUCTOR COMPONENT. CH550485A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2204589A DE2204589A1 (en) 1972-02-01 1972-02-01 COOLING ARRANGEMENT FOR FLAT SEMICONDUCTOR COMPONENTS
DE2208937A DE2208937A1 (en) 1972-02-25 1972-02-25 HEAT PIPE COOLING ARRANGEMENT FOR FLAT SEMI-CONDUCTOR COMPONENTS

Publications (1)

Publication Number Publication Date
CH550485A true CH550485A (en) 1974-06-14

Family

ID=25762653

Family Applications (1)

Application Number Title Priority Date Filing Date
CH132073A CH550485A (en) 1972-02-01 1973-01-30 COOLING ARRANGEMENT FOR A SEMICONDUCTOR COMPONENT.

Country Status (8)

Country Link
AT (1) AT324436B (en)
BE (1) BE794501A (en)
CH (1) CH550485A (en)
FR (1) FR2170040B1 (en)
GB (1) GB1427624A (en)
IT (1) IT978507B (en)
LU (1) LU66933A1 (en)
NL (1) NL7300759A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359329A (en) * 2001-05-30 2002-12-13 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
GB1427624A (en) 1976-03-10
BE794501A (en) 1973-05-16
IT978507B (en) 1974-09-20
FR2170040B1 (en) 1978-02-10
FR2170040A1 (en) 1973-09-14
NL7300759A (en) 1973-08-03
LU66933A1 (en) 1973-04-02
AT324436B (en) 1975-08-25

Similar Documents

Publication Publication Date Title
CH551836A (en) DEVICE HOLDER FOR A SOLDERING DEVICE.
CH551690A (en) SEMI-CONDUCTOR ARRANGEMENT.
CH550642A (en) TAPE-SHAPED BOLT MAGAZINE FOR A BOLT FITTING DEVICE.
CH554600A (en) SEMICONDUCTOR COMPONENT.
CH544920A (en) radiator
AT376844B (en) SEMICONDUCTOR COMPONENT
DK138248C (en) SEMICONDUCTOR ELEMENT
CH552285A (en) SEMI-CONDUCTOR ARRANGEMENT.
CH552791A (en) MULTIPLEX CIRCUIT FOR A MEASURING ARRANGEMENT.
CH549286A (en) SEMICONDUCTOR COMPONENT.
CH550485A (en) COOLING ARRANGEMENT FOR A SEMICONDUCTOR COMPONENT.
CH541869A (en) Semiconductor component
CH549868A (en) HOLDER FOR A PRESSURE CONTACTED SEMICONDUCTOR COMPONENT.
IT994322B (en) SEMICONDUCTOR INTEGRATED CIRCUIT
ES189658Y (en) CONDENSER.
BR7307396D0 (en) RADIATOR
CH546527A (en) CIRCUIT ARRANGEMENT FOR MULTIPLE TIME OPERATIONS.
CH548111A (en) SEMI-CONDUCTOR ARRANGEMENT.
TR16899A (en) 1-AMINOALKAN-1,1-IMALINE FOR DIPHOSPHONIC ACIDS
BE801030A (en) ELEMENT RADIATOR
ES198361Y (en) A BASE ELEMENT FOR CARPETS.
CH549869A (en) COOLING DEVICE FOR A DISC-SHAPED, ENCLOSED SEMI-CONDUCTOR COMPONENT.
CH550353A (en) SEALING ELEMENT FOR FLANGE CONNECTIONS.
CH558515A (en) BUMPER FOR RIFLE.
CH550493A (en) LOETOESE FOR AN ELECTRICAL DEVICE.

Legal Events

Date Code Title Description
PL Patent ceased