CH549869A - COOLING DEVICE FOR A DISC-SHAPED, ENCLOSED SEMI-CONDUCTOR COMPONENT. - Google Patents

COOLING DEVICE FOR A DISC-SHAPED, ENCLOSED SEMI-CONDUCTOR COMPONENT.

Info

Publication number
CH549869A
CH549869A CH511373A CH511373A CH549869A CH 549869 A CH549869 A CH 549869A CH 511373 A CH511373 A CH 511373A CH 511373 A CH511373 A CH 511373A CH 549869 A CH549869 A CH 549869A
Authority
CH
Switzerland
Prior art keywords
disc
shaped
cooling device
conductor component
enclosed semi
Prior art date
Application number
CH511373A
Other languages
German (de)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722220682 external-priority patent/DE2220682C3/en
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH549869A publication Critical patent/CH549869A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH511373A 1972-04-27 1973-04-10 COOLING DEVICE FOR A DISC-SHAPED, ENCLOSED SEMI-CONDUCTOR COMPONENT. CH549869A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722220682 DE2220682C3 (en) 1972-04-27 Cooling device for a disc-shaped, encapsulated semiconductor component

Publications (1)

Publication Number Publication Date
CH549869A true CH549869A (en) 1974-05-31

Family

ID=5843453

Family Applications (1)

Application Number Title Priority Date Filing Date
CH511373A CH549869A (en) 1972-04-27 1973-04-10 COOLING DEVICE FOR A DISC-SHAPED, ENCLOSED SEMI-CONDUCTOR COMPONENT.

Country Status (4)

Country Link
AT (1) AT320797B (en)
CH (1) CH549869A (en)
FR (1) FR2182133B3 (en)
IT (1) IT980359B (en)

Also Published As

Publication number Publication date
DE2220682B2 (en) 1975-06-05
AT320797B (en) 1975-02-25
IT980359B (en) 1974-09-30
FR2182133A1 (en) 1973-12-07
FR2182133B3 (en) 1976-07-23
DE2220682A1 (en) 1973-11-08

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Legal Events

Date Code Title Description
PL Patent ceased