IT980359B - COOLING ELEMENTS FOR SEMICONDUCTOR DISCH-SHAPED STRUCTURAL ELEMENTS - Google Patents

COOLING ELEMENTS FOR SEMICONDUCTOR DISCH-SHAPED STRUCTURAL ELEMENTS

Info

Publication number
IT980359B
IT980359B IT4967273A IT4967273A IT980359B IT 980359 B IT980359 B IT 980359B IT 4967273 A IT4967273 A IT 4967273A IT 4967273 A IT4967273 A IT 4967273A IT 980359 B IT980359 B IT 980359B
Authority
IT
Italy
Prior art keywords
elements
disch
semiconductor
shaped structural
cooling
Prior art date
Application number
IT4967273A
Other languages
Italian (it)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722220682 external-priority patent/DE2220682C3/en
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Application granted granted Critical
Publication of IT980359B publication Critical patent/IT980359B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT4967273A 1972-04-27 1973-04-26 COOLING ELEMENTS FOR SEMICONDUCTOR DISCH-SHAPED STRUCTURAL ELEMENTS IT980359B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722220682 DE2220682C3 (en) 1972-04-27 Cooling device for a disc-shaped, encapsulated semiconductor component

Publications (1)

Publication Number Publication Date
IT980359B true IT980359B (en) 1974-09-30

Family

ID=5843453

Family Applications (1)

Application Number Title Priority Date Filing Date
IT4967273A IT980359B (en) 1972-04-27 1973-04-26 COOLING ELEMENTS FOR SEMICONDUCTOR DISCH-SHAPED STRUCTURAL ELEMENTS

Country Status (4)

Country Link
AT (1) AT320797B (en)
CH (1) CH549869A (en)
FR (1) FR2182133B3 (en)
IT (1) IT980359B (en)

Also Published As

Publication number Publication date
DE2220682B2 (en) 1975-06-05
AT320797B (en) 1975-02-25
FR2182133A1 (en) 1973-12-07
FR2182133B3 (en) 1976-07-23
DE2220682A1 (en) 1973-11-08
CH549869A (en) 1974-05-31

Similar Documents

Publication Publication Date Title
CH537650A (en) Semiconductor laser
IT979071B (en) LOADER FOR UNION ELEMENTS
IT995572B (en) SEAL COMPLEX FOR COOLING
IT996886B (en) AFTER COOLER
IT976915B (en) METHOD FOR MANUFACTURING DINITRU OR SILICON PRESSED COMPONENTS
CH539914A (en) Semiconductor memory
IT982885B (en) DEVICE FOR COOLING SURFACES
AT376844B (en) SEMICONDUCTOR COMPONENT
IT993986B (en) Means of stiffening for structural elements
AT330963B (en) COOLANT
DK138248C (en) SEMICONDUCTOR ELEMENT
IT1033046B (en) PROCESS FOR MANUFACTURING SUBSTITUTED BENZIMIDAZOLES
IT976262B (en) PROCEDURE FOR THE MANUFACTURING OF SEMICONDUCTOR BODIES
AT327155B (en) COOLANT
CH541869A (en) Semiconductor component
IT980359B (en) COOLING ELEMENTS FOR SEMICONDUCTOR DISCH-SHAPED STRUCTURAL ELEMENTS
SE389783B (en) SEMICONDUCTOR INVERTER
IT977685B (en) REVERSE DEVICE FOR
IT986259B (en) COOLING TOWER
IT992819B (en) LAPPING DEVICE
IT969304B (en) DEVICE FOR MOUNTING TWO CONCENTRIC ELEMENTS
AT330362B (en) COOLANT
IT989077B (en) ELEMENTS RADIATOR
CH516874A (en) Semiconductor component
IT980226B (en) PORDO RADIOGONIOMETER