CH541869A - Semiconductor component - Google Patents

Semiconductor component

Info

Publication number
CH541869A
CH541869A CH1440772A CH1440772A CH541869A CH 541869 A CH541869 A CH 541869A CH 1440772 A CH1440772 A CH 1440772A CH 1440772 A CH1440772 A CH 1440772A CH 541869 A CH541869 A CH 541869A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Application number
CH1440772A
Other languages
German (de)
Inventor
Reimer Dr Emeis
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH541869A publication Critical patent/CH541869A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
CH1440772A 1972-01-31 1972-10-03 Semiconductor component CH541869A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722204490 DE2204490A1 (en) 1972-01-31 1972-01-31 SEMICONDUCTOR COMPONENT WITH PRESSURE CONTACT

Publications (1)

Publication Number Publication Date
CH541869A true CH541869A (en) 1973-09-15

Family

ID=5834583

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1440772A CH541869A (en) 1972-01-31 1972-10-03 Semiconductor component

Country Status (7)

Country Link
JP (1) JPS4885079A (en)
CH (1) CH541869A (en)
DE (1) DE2204490A1 (en)
FR (1) FR2169819B1 (en)
GB (1) GB1397430A (en)
IT (1) IT972620B (en)
NL (1) NL7217019A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2727319A1 (en) * 1977-06-16 1979-01-04 Nippon Electric Co Hump electrode for gang bonding semiconductor arrays - has two layers of gold with geometric configuration increasing tear strength
JPS55121654A (en) * 1979-03-13 1980-09-18 Toshiba Corp Compression bonded semiconductor device
JPS5871633A (en) * 1981-10-23 1983-04-28 Toshiba Corp Pressure-welded type semiconductor device
DE10330053A1 (en) * 2003-07-03 2005-02-10 Infineon Technologies Ag Semiconductor component with pressure contact and its round surround, e.g. high voltage (HV) thyristor for HV rectifier for distribution of electric energy, comprising connecting electrode on one semiconductor side
DE102004059389B4 (en) * 2004-12-09 2012-02-23 Infineon Technologies Ag Semiconductor device with compensation metallization

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS413220Y1 (en) * 1965-01-02 1966-02-23

Also Published As

Publication number Publication date
FR2169819B1 (en) 1977-12-30
GB1397430A (en) 1975-06-11
JPS4885079A (en) 1973-11-12
IT972620B (en) 1974-05-31
DE2204490A1 (en) 1973-08-09
FR2169819A1 (en) 1973-09-14
NL7217019A (en) 1973-08-02

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Legal Events

Date Code Title Description
PL Patent ceased