JPS4885079A - - Google Patents

Info

Publication number
JPS4885079A
JPS4885079A JP1282873A JP1282873A JPS4885079A JP S4885079 A JPS4885079 A JP S4885079A JP 1282873 A JP1282873 A JP 1282873A JP 1282873 A JP1282873 A JP 1282873A JP S4885079 A JPS4885079 A JP S4885079A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1282873A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4885079A publication Critical patent/JPS4885079A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
JP1282873A 1972-01-31 1973-01-31 Pending JPS4885079A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722204490 DE2204490A1 (en) 1972-01-31 1972-01-31 SEMICONDUCTOR COMPONENT WITH PRESSURE CONTACT

Publications (1)

Publication Number Publication Date
JPS4885079A true JPS4885079A (en) 1973-11-12

Family

ID=5834583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1282873A Pending JPS4885079A (en) 1972-01-31 1973-01-31

Country Status (7)

Country Link
JP (1) JPS4885079A (en)
CH (1) CH541869A (en)
DE (1) DE2204490A1 (en)
FR (1) FR2169819B1 (en)
GB (1) GB1397430A (en)
IT (1) IT972620B (en)
NL (1) NL7217019A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2727319A1 (en) * 1977-06-16 1979-01-04 Nippon Electric Co Hump electrode for gang bonding semiconductor arrays - has two layers of gold with geometric configuration increasing tear strength
JPS55121654A (en) * 1979-03-13 1980-09-18 Toshiba Corp Compression bonded semiconductor device
JPS5871633A (en) * 1981-10-23 1983-04-28 Toshiba Corp Pressure-welded type semiconductor device
DE10330053A1 (en) * 2003-07-03 2005-02-10 Infineon Technologies Ag Semiconductor component with pressure contact and its round surround, e.g. high voltage (HV) thyristor for HV rectifier for distribution of electric energy, comprising connecting electrode on one semiconductor side
DE102004059389B4 (en) * 2004-12-09 2012-02-23 Infineon Technologies Ag Semiconductor device with compensation metallization

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS413220Y1 (en) * 1965-01-02 1966-02-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS413220Y1 (en) * 1965-01-02 1966-02-23

Also Published As

Publication number Publication date
DE2204490A1 (en) 1973-08-09
FR2169819B1 (en) 1977-12-30
CH541869A (en) 1973-09-15
GB1397430A (en) 1975-06-11
IT972620B (en) 1974-05-31
NL7217019A (en) 1973-08-02
FR2169819A1 (en) 1973-09-14

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