FR2169819A1 - - Google Patents

Info

Publication number
FR2169819A1
FR2169819A1 FR7245017A FR7245017A FR2169819A1 FR 2169819 A1 FR2169819 A1 FR 2169819A1 FR 7245017 A FR7245017 A FR 7245017A FR 7245017 A FR7245017 A FR 7245017A FR 2169819 A1 FR2169819 A1 FR 2169819A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7245017A
Other languages
French (fr)
Other versions
FR2169819B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2169819A1 publication Critical patent/FR2169819A1/fr
Application granted granted Critical
Publication of FR2169819B1 publication Critical patent/FR2169819B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
FR7245017A 1972-01-31 1972-12-18 Expired FR2169819B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722204490 DE2204490A1 (en) 1972-01-31 1972-01-31 SEMICONDUCTOR COMPONENT WITH PRESSURE CONTACT

Publications (2)

Publication Number Publication Date
FR2169819A1 true FR2169819A1 (en) 1973-09-14
FR2169819B1 FR2169819B1 (en) 1977-12-30

Family

ID=5834583

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7245017A Expired FR2169819B1 (en) 1972-01-31 1972-12-18

Country Status (7)

Country Link
JP (1) JPS4885079A (en)
CH (1) CH541869A (en)
DE (1) DE2204490A1 (en)
FR (1) FR2169819B1 (en)
GB (1) GB1397430A (en)
IT (1) IT972620B (en)
NL (1) NL7217019A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0077922A2 (en) * 1981-10-23 1983-05-04 Kabushiki Kaisha Toshiba Pressure-applied type semiconductor device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2727319A1 (en) * 1977-06-16 1979-01-04 Nippon Electric Co Hump electrode for gang bonding semiconductor arrays - has two layers of gold with geometric configuration increasing tear strength
JPS55121654A (en) * 1979-03-13 1980-09-18 Toshiba Corp Compression bonded semiconductor device
DE10330053A1 (en) * 2003-07-03 2005-02-10 Infineon Technologies Ag Semiconductor component with pressure contact and its round surround, e.g. high voltage (HV) thyristor for HV rectifier for distribution of electric energy, comprising connecting electrode on one semiconductor side
DE102004059389B4 (en) * 2004-12-09 2012-02-23 Infineon Technologies Ag Semiconductor device with compensation metallization

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS413220Y1 (en) * 1965-01-02 1966-02-23

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0077922A2 (en) * 1981-10-23 1983-05-04 Kabushiki Kaisha Toshiba Pressure-applied type semiconductor device
EP0077922A3 (en) * 1981-10-23 1984-05-23 Tokyo Shibaura Denki Kabushiki Kaisha Pressure-applied type semiconductor device
US4500907A (en) * 1981-10-23 1985-02-19 Tokyo Shibaura Denki Kabushiki Kaisha Pressure-applied type semiconductor device

Also Published As

Publication number Publication date
NL7217019A (en) 1973-08-02
DE2204490A1 (en) 1973-08-09
FR2169819B1 (en) 1977-12-30
GB1397430A (en) 1975-06-11
CH541869A (en) 1973-09-15
JPS4885079A (en) 1973-11-12
IT972620B (en) 1974-05-31

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Legal Events

Date Code Title Description
ST Notification of lapse