AT320797B - Cooling device for a disc-shaped, encapsulated semiconductor component - Google Patents

Cooling device for a disc-shaped, encapsulated semiconductor component

Info

Publication number
AT320797B
AT320797B AT367673A AT367673A AT320797B AT 320797 B AT320797 B AT 320797B AT 367673 A AT367673 A AT 367673A AT 367673 A AT367673 A AT 367673A AT 320797 B AT320797 B AT 320797B
Authority
AT
Austria
Prior art keywords
disc
shaped
cooling device
semiconductor component
encapsulated semiconductor
Prior art date
Application number
AT367673A
Other languages
German (de)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722220682 external-priority patent/DE2220682C3/en
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Application granted granted Critical
Publication of AT320797B publication Critical patent/AT320797B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT367673A 1972-04-27 1973-04-25 Cooling device for a disc-shaped, encapsulated semiconductor component AT320797B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722220682 DE2220682C3 (en) 1972-04-27 Cooling device for a disc-shaped, encapsulated semiconductor component

Publications (1)

Publication Number Publication Date
AT320797B true AT320797B (en) 1975-02-25

Family

ID=5843453

Family Applications (1)

Application Number Title Priority Date Filing Date
AT367673A AT320797B (en) 1972-04-27 1973-04-25 Cooling device for a disc-shaped, encapsulated semiconductor component

Country Status (4)

Country Link
AT (1) AT320797B (en)
CH (1) CH549869A (en)
FR (1) FR2182133B3 (en)
IT (1) IT980359B (en)

Also Published As

Publication number Publication date
DE2220682A1 (en) 1973-11-08
CH549869A (en) 1974-05-31
FR2182133A1 (en) 1973-12-07
DE2220682B2 (en) 1975-06-05
IT980359B (en) 1974-09-30
FR2182133B3 (en) 1976-07-23

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee