BE794501A - Dispositif de refroidissement pour composants semi-conducteurs plats - Google Patents

Dispositif de refroidissement pour composants semi-conducteurs plats

Info

Publication number
BE794501A
BE794501A BE794501DA BE794501A BE 794501 A BE794501 A BE 794501A BE 794501D A BE794501D A BE 794501DA BE 794501 A BE794501 A BE 794501A
Authority
BE
Belgium
Prior art keywords
cooling device
semiconductor components
flat semiconductor
flat
components
Prior art date
Application number
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Priority claimed from DE2204589A external-priority patent/DE2204589A1/de
Priority claimed from DE2208937A external-priority patent/DE2208937A1/de
Publication of BE794501A publication Critical patent/BE794501A/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
BE794501D 1972-02-01 Dispositif de refroidissement pour composants semi-conducteurs plats BE794501A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2204589A DE2204589A1 (de) 1972-02-01 1972-02-01 Kuehlanordnung fuer flache halbleiterbauelemente
DE2208937A DE2208937A1 (de) 1972-02-25 1972-02-25 Waermerohr-kuehlanordnung fuer flache halbleiterbauelemente

Publications (1)

Publication Number Publication Date
BE794501A true BE794501A (fr) 1973-05-16

Family

ID=25762653

Family Applications (1)

Application Number Title Priority Date Filing Date
BE794501D BE794501A (fr) 1972-02-01 Dispositif de refroidissement pour composants semi-conducteurs plats

Country Status (8)

Country Link
AT (1) AT324436B (fr)
BE (1) BE794501A (fr)
CH (1) CH550485A (fr)
FR (1) FR2170040B1 (fr)
GB (1) GB1427624A (fr)
IT (1) IT978507B (fr)
LU (1) LU66933A1 (fr)
NL (1) NL7300759A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359329A (ja) * 2001-05-30 2002-12-13 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
NL7300759A (fr) 1973-08-03
LU66933A1 (fr) 1973-04-02
GB1427624A (en) 1976-03-10
CH550485A (de) 1974-06-14
AT324436B (de) 1975-08-25
FR2170040A1 (fr) 1973-09-14
FR2170040B1 (fr) 1978-02-10
IT978507B (it) 1974-09-20

Similar Documents

Publication Publication Date Title
BE790448A (fr) Dispositif de refroidissement pour train de
AT313423B (de) Kühlvorrichtung für Leistungshalbleiterbauelemente
FR2327640A1 (fr) Dispositif pour refroidir des composants semi-conducteurs
BE791465A (fr) Dispositif de prearmement pour pastilleuse
BE784713A (fr) Dispositif de refroidissement pour brames
BE764427A (fr) Structure de connexion pour dispositif semi-conducteur
BE794105A (fr) Dispositif de dechargement
BE782635A (fr) Dispositif semi-conducteur
RO71455A (fr) Dispositif pour charger des autocamions
BE791487A (fr) Dispositif semiconducteur
BE799951A (fr) Dispositif pour rechauffer ou refroidir des plats
BE809216A (fr) Dispositif semi-conducteur
BE765375A (fr) Dispositif de refroidissement pour bobines supraconductrices
BE785747A (fr) Dispositif semiconducteur
BE774559A (fr) Dispositif pour la manoeuvre des projecteurs
BE809217A (fr) Dispositif semi-conducteur
IT956991B (it) Dispositivo di raffreddamento per convertitore
BE794501A (fr) Dispositif de refroidissement pour composants semi-conducteurs plats
BE801798A (fr) Dispositif pour bloquer des balances
BE796900A (fr) Dispositif selecteur multifonctionnel pour circuits de fluides
BE780014A (fr) Dispositif semiconducteur
BE762950A (fr) Dispositif pour le nettoyage de surfaces
IT967178B (it) Dispositivo di raffreddamento per il raffreddamento di componenti elettronici
BE792156A (fr) Dispositif de temporisation pour contacts auxiliaires
SU456390A1 (ru) Устройство дл транспортировки подложек микросхем