CH506884A - Verfahren zum Befestigen einer Anzahl von Anschlusselementen an Kontaktflächen eines Werkstückes - Google Patents

Verfahren zum Befestigen einer Anzahl von Anschlusselementen an Kontaktflächen eines Werkstückes

Info

Publication number
CH506884A
CH506884A CH676470A CH676470A CH506884A CH 506884 A CH506884 A CH 506884A CH 676470 A CH676470 A CH 676470A CH 676470 A CH676470 A CH 676470A CH 506884 A CH506884 A CH 506884A
Authority
CH
Switzerland
Prior art keywords
workpiece
fastening
contact surfaces
connection elements
elements
Prior art date
Application number
CH676470A
Other languages
German (de)
English (en)
Inventor
Coucoulas Alexander
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of CH506884A publication Critical patent/CH506884A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H10W70/093—
    • H10W72/075—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1078—Leads having locally deformed portion, e.g. for retention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/5524—
    • H10W72/932—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
CH676470A 1969-05-07 1970-05-05 Verfahren zum Befestigen einer Anzahl von Anschlusselementen an Kontaktflächen eines Werkstückes CH506884A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82242869A 1969-05-07 1969-05-07

Publications (1)

Publication Number Publication Date
CH506884A true CH506884A (de) 1971-04-30

Family

ID=25235996

Family Applications (1)

Application Number Title Priority Date Filing Date
CH676470A CH506884A (de) 1969-05-07 1970-05-05 Verfahren zum Befestigen einer Anzahl von Anschlusselementen an Kontaktflächen eines Werkstückes

Country Status (11)

Country Link
US (1) US3625783A (index.php)
JP (1) JPS4822016B1 (index.php)
BE (1) BE750036A (index.php)
CH (1) CH506884A (index.php)
ES (1) ES380076A1 (index.php)
FR (1) FR2047347A5 (index.php)
GB (1) GB1264271A (index.php)
IE (1) IE34127B1 (index.php)
IL (1) IL34432A (index.php)
NL (1) NL7006612A (index.php)
SE (1) SE363434B (index.php)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2177639B (en) * 1985-07-08 1988-12-29 Philips Electronic Associated Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith
JPS6254937U (index.php) * 1985-09-26 1987-04-06
JPS6254938U (index.php) * 1985-09-26 1987-04-06
US5240166A (en) * 1992-05-15 1993-08-31 International Business Machines Corporation Device for thermally enhanced ultrasonic bonding with localized heat pulses
JP4233776B2 (ja) * 2001-09-12 2009-03-04 株式会社村田製作所 回路形成基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3300851A (en) * 1964-01-02 1967-01-31 Gen Electric Method of making bonded wire circuits
US3277959A (en) * 1964-08-12 1966-10-11 Du Pont Plastic tube heat exchanger and process of making
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device

Also Published As

Publication number Publication date
BE750036A (fr) 1970-10-16
FR2047347A5 (index.php) 1971-03-12
SE363434B (index.php) 1974-01-14
US3625783A (en) 1971-12-07
DE2021265B2 (de) 1972-07-20
NL7006612A (index.php) 1970-11-10
ES380076A1 (es) 1972-08-16
IL34432A (en) 1974-01-14
DE2021265A1 (de) 1971-02-04
IE34127B1 (en) 1975-02-19
GB1264271A (index.php) 1972-02-16
IL34432A0 (en) 1970-07-19
JPS4822016B1 (index.php) 1973-07-03
IE34127L (en) 1970-11-07

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Legal Events

Date Code Title Description
PL Patent ceased