CH503371A - Halbleiterbauelement mit Druckkontakt - Google Patents

Halbleiterbauelement mit Druckkontakt

Info

Publication number
CH503371A
CH503371A CH503469A CH503469A CH503371A CH 503371 A CH503371 A CH 503371A CH 503469 A CH503469 A CH 503469A CH 503469 A CH503469 A CH 503469A CH 503371 A CH503371 A CH 503371A
Authority
CH
Switzerland
Prior art keywords
pressure contact
semiconductor component
semiconductor
component
contact
Prior art date
Application number
CH503469A
Other languages
German (de)
English (en)
Inventor
Meyerhoff Alfred
E Blake Walter
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of CH503371A publication Critical patent/CH503371A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01042Molybdenum [Mo]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01049Indium [In]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01051Antimony [Sb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01073Tantalum [Ta]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01075Rhenium [Re]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/0132Binary Alloys
    • H01L2924/01322Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Manufacture Of Switches (AREA)
  • Die Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CH503469A 1968-04-10 1969-04-02 Halbleiterbauelement mit Druckkontakt CH503371A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US72006268A 1968-04-10 1968-04-10

Publications (1)

Publication Number Publication Date
CH503371A true CH503371A (de) 1971-02-15

Family

ID=24892482

Family Applications (1)

Application Number Title Priority Date Filing Date
CH503469A CH503371A (de) 1968-04-10 1969-04-02 Halbleiterbauelement mit Druckkontakt

Country Status (8)

Country Link
BE (1) BE731255A (fr)
CH (1) CH503371A (fr)
DE (1) DE1916699A1 (fr)
ES (1) ES365811A1 (fr)
FR (1) FR2005999A1 (fr)
GB (1) GB1258008A (fr)
IE (1) IE32747B1 (fr)
NL (1) NL6905444A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149448U (fr) * 1984-09-03 1986-04-03
JPH0642337Y2 (ja) * 1984-07-05 1994-11-02 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
IE32747B1 (en) 1973-11-14
GB1258008A (fr) 1971-12-22
IE32747L (en) 1969-10-10
FR2005999A1 (fr) 1969-12-19
BE731255A (fr) 1969-09-15
ES365811A1 (es) 1971-03-16
DE1916699A1 (de) 1969-10-30
NL6905444A (fr) 1969-10-14

Similar Documents

Publication Publication Date Title
NL162253C (nl) Halfgeleiderinrichting.
DK127766B (da) Elektrisk kontaktelement.
CH529445A (de) Halbleiteranordnung
CH511511A (de) Halbleiter-Anordnung
CH506883A (de) Halbleiterbauelement
AT350109B (de) Halbleiterbauelement mit druckkontakt
CH492302A (de) Halbleiterbauelement
DK135650B (da) Halvlederelement med mindst en trykkontaktovergang.
NL143045B (nl) Contactinrichting.
AT320025B (de) Halbleitervorrichtung
CH520403A (de) Halbleiterbauelement mit Druckkontakten
NL163672C (nl) Halfgeleiderinrichting.
AT300961B (de) Halbleiteranordnung
CH487504A (de) Halbleitervorrichtung
CH508279A (de) Halbleiterbauelement
CH522384A (de) Dampfdruckkochgerät mit Verriegelungsvorrichtung
DE1949174B2 (de) Halbleiterbauelement
NL164153C (nl) Contactinrichting.
CH537095A (de) Halbleiterbauelement mit Aluminiumkontakt
CH541351A (de) Hochdruckvorrichtung
CH503371A (de) Halbleiterbauelement mit Druckkontakt
DE1903082B2 (de) Halbleiterbauelement
CH510346A (de) Halbleiteranordnung
CH493942A (de) Halbleitervorrichtung
CH489115A (de) Zusammengesetzes Halbleiterbauelement

Legal Events

Date Code Title Description
PL Patent ceased