CH520403A - Halbleiterbauelement mit Druckkontakten - Google Patents
Halbleiterbauelement mit DruckkontaktenInfo
- Publication number
- CH520403A CH520403A CH1086071A CH1086071A CH520403A CH 520403 A CH520403 A CH 520403A CH 1086071 A CH1086071 A CH 1086071A CH 1086071 A CH1086071 A CH 1086071A CH 520403 A CH520403 A CH 520403A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor component
- pressure contacts
- contacts
- pressure
- semiconductor
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01073—Tantalum [Ta]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0495—5th Group
- H01L2924/04953—TaN
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2039806A DE2039806C3 (de) | 1970-08-11 | 1970-08-11 | Halbleiterbauelement mit Druckkontakten |
Publications (1)
Publication Number | Publication Date |
---|---|
CH520403A true CH520403A (de) | 1972-03-15 |
Family
ID=5779405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1086071A CH520403A (de) | 1970-08-11 | 1971-07-23 | Halbleiterbauelement mit Druckkontakten |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5550389B1 (de) |
CH (1) | CH520403A (de) |
DE (1) | DE2039806C3 (de) |
ES (1) | ES176807Y (de) |
FR (1) | FR2102176B1 (de) |
GB (1) | GB1336790A (de) |
NL (1) | NL7110924A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0088923A2 (de) * | 1982-03-13 | 1983-09-21 | BROWN, BOVERI & CIE Aktiengesellschaft | Sandwich für druckkontaktierbare Halbleiter-Leistungsbauelemente und Verfahren zu seiner Herstellung |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2821268C2 (de) * | 1978-05-16 | 1986-10-16 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement mit Druckkontakt |
DE2825682C2 (de) * | 1978-06-12 | 1984-09-20 | Brown, Boveri & Cie Ag, 6800 Mannheim | Halbleiterbauelement mit Isoliergehäuse |
DE2840400C2 (de) * | 1978-09-16 | 1982-04-08 | Brown, Boveri & Cie Ag, 6800 Mannheim | Steuerbares Leistungs-Halbleiterbauelement |
DE2902224A1 (de) * | 1979-01-20 | 1980-07-24 | Bbc Brown Boveri & Cie | Kontaktsystem fuer leistungs-halbleiterbauelemente |
SE420964B (sv) * | 1980-03-27 | 1981-11-09 | Asea Ab | Kompositmaterial och sett for dess framstellning |
JPS59134876A (ja) * | 1983-01-20 | 1984-08-02 | Mitsubishi Electric Corp | 半導体装置 |
JP6474790B2 (ja) | 2013-05-13 | 2019-02-27 | アーベーベー・テクノロジー・アーゲー | 半導体スイッチング素子のためのスペーサシステム |
WO2020078816A1 (en) | 2018-10-19 | 2020-04-23 | Abb Schweiz Ag | Power semiconductor device with free-floating packaging concept |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1467544A (fr) * | 1965-02-08 | 1967-01-27 | Westinghouse Electric Corp | Appareils semiconducteurs |
-
1970
- 1970-08-11 DE DE2039806A patent/DE2039806C3/de not_active Expired
-
1971
- 1971-07-23 CH CH1086071A patent/CH520403A/de not_active IP Right Cessation
- 1971-08-09 ES ES1971176807U patent/ES176807Y/es not_active Expired
- 1971-08-09 FR FR7129055A patent/FR2102176B1/fr not_active Expired
- 1971-08-09 NL NL7110924A patent/NL7110924A/xx unknown
- 1971-08-09 GB GB3734671A patent/GB1336790A/en not_active Expired
- 1971-08-10 JP JP6000671A patent/JPS5550389B1/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0088923A2 (de) * | 1982-03-13 | 1983-09-21 | BROWN, BOVERI & CIE Aktiengesellschaft | Sandwich für druckkontaktierbare Halbleiter-Leistungsbauelemente und Verfahren zu seiner Herstellung |
EP0088923A3 (de) * | 1982-03-13 | 1985-10-09 | BROWN, BOVERI & CIE Aktiengesellschaft | Sandwich für druckkontaktierbare Halbleiter-Leistungsbauelemente und Verfahren zu seiner Herstellung |
Also Published As
Publication number | Publication date |
---|---|
GB1336790A (en) | 1973-11-07 |
JPS5550389B1 (de) | 1980-12-17 |
ES176807Y (es) | 1973-05-01 |
DE2039806A1 (de) | 1972-02-24 |
DE2039806C3 (de) | 1975-05-07 |
DE2039806B2 (de) | 1974-09-05 |
ES176807U (es) | 1972-08-16 |
NL7110924A (de) | 1972-02-15 |
FR2102176A1 (de) | 1972-04-07 |
FR2102176B1 (de) | 1976-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |