GB1336790A - Semiconductor device with pressure contacts - Google Patents

Semiconductor device with pressure contacts

Info

Publication number
GB1336790A
GB1336790A GB3734671A GB3734671A GB1336790A GB 1336790 A GB1336790 A GB 1336790A GB 3734671 A GB3734671 A GB 3734671A GB 3734671 A GB3734671 A GB 3734671A GB 1336790 A GB1336790 A GB 1336790A
Authority
GB
United Kingdom
Prior art keywords
semi
ductile
conductor
pressure pads
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3734671A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
BBC Brown Boveri France SA
Original Assignee
BBC Brown Boveri AG Switzerland
BBC Brown Boveri France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland, BBC Brown Boveri France SA filed Critical BBC Brown Boveri AG Switzerland
Publication of GB1336790A publication Critical patent/GB1336790A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

1336790 Semi-conductor devices BROWN BOVERI & CO Ltd 9 Aug 1971 [11 Aug 1970] 37346/71 Heading H1K In a semi-conductor device having two pressure pads bearing on a semi-conductor body via two ductile metal layers, the ductile layers have integral projections which engage the edges of the pressure pads. As shown, Fig. 2, a semi-conductor body 1 of Si or Ge having at least one PN junction which emerges at the edge which is double bevelled and coated with a layer 11 of epoxy resin, is contacted by two pressure pads 4, 5 of Cu, Cu alloy, Mo, W, or Ta and ductile Ag members 2, 3 which are dish shaped so that they engage the edges of the pads to locate the body between the pressure pads. The ductile members are secured to the semi-conductor body by portions 10 of elastic synthetic material such as silicone rubber. The semi-conductor device may be a thyristor in which case one pressure pad and its associated ductile member are provided with central apertures through which the control electrode extends. Preferably at least the other ductile member is also provided with an aperture to ensure pressure contact symmetry. The surfaces of the semi-conductor body may be provided with metalized layers 6, 7, e.g. Ni, which may be guilded, and mention is made of the use of sintered contacts. The faces of the pressure pads bearing on the ductile members may be hard chrome plated or nickel plated and polished.
GB3734671A 1970-08-11 1971-08-09 Semiconductor device with pressure contacts Expired GB1336790A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2039806A DE2039806C3 (en) 1970-08-11 1970-08-11 Semiconductor component with pressure contacts

Publications (1)

Publication Number Publication Date
GB1336790A true GB1336790A (en) 1973-11-07

Family

ID=5779405

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3734671A Expired GB1336790A (en) 1970-08-11 1971-08-09 Semiconductor device with pressure contacts

Country Status (7)

Country Link
JP (1) JPS5550389B1 (en)
CH (1) CH520403A (en)
DE (1) DE2039806C3 (en)
ES (1) ES176807Y (en)
FR (1) FR2102176B1 (en)
GB (1) GB1336790A (en)
NL (1) NL7110924A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014184061A1 (en) * 2013-05-13 2014-11-20 Abb Technology Ag Spacer system for a semiconductor switching device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2821268C2 (en) * 1978-05-16 1986-10-16 Siemens AG, 1000 Berlin und 8000 München Semiconductor component with pressure contact
DE2825682C2 (en) * 1978-06-12 1984-09-20 Brown, Boveri & Cie Ag, 6800 Mannheim Semiconductor component with insulating housing
DE2840400C2 (en) * 1978-09-16 1982-04-08 Brown, Boveri & Cie Ag, 6800 Mannheim Controllable power semiconductor component
DE2902224A1 (en) * 1979-01-20 1980-07-24 Bbc Brown Boveri & Cie CONTACT SYSTEM FOR PERFORMANCE SEMICONDUCTOR COMPONENTS
SE420964B (en) * 1980-03-27 1981-11-09 Asea Ab COMPOSITION MATERIAL AND SET FOR ITS MANUFACTURING
DE3209174A1 (en) * 1982-03-13 1983-09-15 Brown, Boveri & Cie Ag, 6800 Mannheim SANDWICH FOR PRINT-CONTACTABLE SEMICONDUCTOR POWER COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
JPS59134876A (en) * 1983-01-20 1984-08-02 Mitsubishi Electric Corp Semiconductor device
CN112889148B (en) 2018-10-19 2022-12-13 日立能源瑞士股份公司 Power semiconductor device with free floating package concept

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1467544A (en) * 1965-02-08 1967-01-27 Westinghouse Electric Corp Semiconductor devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014184061A1 (en) * 2013-05-13 2014-11-20 Abb Technology Ag Spacer system for a semiconductor switching device
GB2529338A (en) * 2013-05-13 2016-02-17 Abb Technology Ag Spacer system for a semiconductor switching device
US9698067B2 (en) 2013-05-13 2017-07-04 Abb Schweiz Ag Spacer system for a semiconductor switching device
GB2529338B (en) * 2013-05-13 2019-03-20 Abb Schweiz Ag Spacer system for a semiconductor switching device

Also Published As

Publication number Publication date
DE2039806B2 (en) 1974-09-05
ES176807Y (en) 1973-05-01
NL7110924A (en) 1972-02-15
CH520403A (en) 1972-03-15
JPS5550389B1 (en) 1980-12-17
FR2102176A1 (en) 1972-04-07
DE2039806A1 (en) 1972-02-24
ES176807U (en) 1972-08-16
FR2102176B1 (en) 1976-05-28
DE2039806C3 (en) 1975-05-07

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee