ES176807Y - SEMICONDUCTOR CONSTRUCTION ELEMENT. - Google Patents

SEMICONDUCTOR CONSTRUCTION ELEMENT.

Info

Publication number
ES176807Y
ES176807Y ES1971176807U ES176807U ES176807Y ES 176807 Y ES176807 Y ES 176807Y ES 1971176807 U ES1971176807 U ES 1971176807U ES 176807 U ES176807 U ES 176807U ES 176807 Y ES176807 Y ES 176807Y
Authority
ES
Spain
Prior art keywords
construction element
semiconductor construction
semiconductor
construction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES1971176807U
Other languages
Spanish (es)
Other versions
ES176807U (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AG Brown Boberi & Cie
Original Assignee
AG Brown Boberi & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AG Brown Boberi & Cie filed Critical AG Brown Boberi & Cie
Publication of ES176807U publication Critical patent/ES176807U/en
Application granted granted Critical
Publication of ES176807Y publication Critical patent/ES176807Y/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
ES1971176807U 1970-08-11 1971-08-09 SEMICONDUCTOR CONSTRUCTION ELEMENT. Expired ES176807Y (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2039806A DE2039806C3 (en) 1970-08-11 1970-08-11 Semiconductor component with pressure contacts

Publications (2)

Publication Number Publication Date
ES176807U ES176807U (en) 1972-08-16
ES176807Y true ES176807Y (en) 1973-05-01

Family

ID=5779405

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1971176807U Expired ES176807Y (en) 1970-08-11 1971-08-09 SEMICONDUCTOR CONSTRUCTION ELEMENT.

Country Status (7)

Country Link
JP (1) JPS5550389B1 (en)
CH (1) CH520403A (en)
DE (1) DE2039806C3 (en)
ES (1) ES176807Y (en)
FR (1) FR2102176B1 (en)
GB (1) GB1336790A (en)
NL (1) NL7110924A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2821268C2 (en) * 1978-05-16 1986-10-16 Siemens AG, 1000 Berlin und 8000 München Semiconductor component with pressure contact
DE2825682C2 (en) * 1978-06-12 1984-09-20 Brown, Boveri & Cie Ag, 6800 Mannheim Semiconductor component with insulating housing
DE2840400C2 (en) * 1978-09-16 1982-04-08 Brown, Boveri & Cie Ag, 6800 Mannheim Controllable power semiconductor component
DE2902224A1 (en) * 1979-01-20 1980-07-24 Bbc Brown Boveri & Cie CONTACT SYSTEM FOR PERFORMANCE SEMICONDUCTOR COMPONENTS
SE420964B (en) * 1980-03-27 1981-11-09 Asea Ab COMPOSITION MATERIAL AND SET FOR ITS MANUFACTURING
DE3209174A1 (en) * 1982-03-13 1983-09-15 Brown, Boveri & Cie Ag, 6800 Mannheim SANDWICH FOR PRINT-CONTACTABLE SEMICONDUCTOR POWER COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
JPS59134876A (en) * 1983-01-20 1984-08-02 Mitsubishi Electric Corp Semiconductor device
JP6474790B2 (en) 2013-05-13 2019-02-27 アーベーベー・テクノロジー・アーゲー Spacer system for semiconductor switching devices
WO2020078816A1 (en) 2018-10-19 2020-04-23 Abb Schweiz Ag Power semiconductor device with free-floating packaging concept

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1467544A (en) * 1965-02-08 1967-01-27 Westinghouse Electric Corp Semiconductor devices

Also Published As

Publication number Publication date
GB1336790A (en) 1973-11-07
DE2039806C3 (en) 1975-05-07
DE2039806A1 (en) 1972-02-24
FR2102176A1 (en) 1972-04-07
FR2102176B1 (en) 1976-05-28
CH520403A (en) 1972-03-15
ES176807U (en) 1972-08-16
NL7110924A (en) 1972-02-15
DE2039806B2 (en) 1974-09-05
JPS5550389B1 (en) 1980-12-17

Similar Documents

Publication Publication Date Title
CH552111A (en) ELEMENT OF CONSTRUCTION.
CH551690A (en) SEMI-CONDUCTOR ARRANGEMENT.
NL161525B (en) FLAT DRAINEER ELEMENT.
CH555091A (en) CELLULE ELECTROCHIMIQUE.
ES192827Y (en) STANDARD CONSTRUCTION ELEMENT.
CH554600A (en) SEMICONDUCTOR COMPONENT.
NL169656C (en) REVERSE TRANSISTOR.
NL178368C (en) SEMICONDUCTOR MEMORY.
AR196860A1 (en) FOUNDATION ELEMENT
ES176807Y (en) SEMICONDUCTOR CONSTRUCTION ELEMENT.
ES161478Y (en) ROOF ELEMENT.
CH552285A (en) SEMI-CONDUCTOR ARRANGEMENT.
AR203982A1 (en) CONSTRUCTION ELEMENT
CH547407A (en) ELEMENT DE CLOISON AMOVIBLE.
CH549286A (en) SEMICONDUCTOR COMPONENT.
ES168912Y (en) RESISTOR ELEMENT.
ES170885Y (en) CONSTRUCTION ELEMENT.
CH547962A (en) FASTENING ELEMENT.
NL150923B (en) LIGHT-SENSITIVE ELEMENT.
NL160389C (en) THERMOMETER.
CH516874A (en) Semiconductor component
CH548111A (en) SEMI-CONDUCTOR ARRANGEMENT.
ES151785Y (en) PERNIO ELEMENT.
CH546867A (en) LOST FORMWORK ELEMENT.
ES160807Y (en) CONSTRUCTION ELEMENT.