ES176807U - Construction element semiconductor. (Machine-translation by Google Translate, not legally binding) - Google Patents
Construction element semiconductor. (Machine-translation by Google Translate, not legally binding)Info
- Publication number
- ES176807U ES176807U ES0176807U ES176807U ES176807U ES 176807 U ES176807 U ES 176807U ES 0176807 U ES0176807 U ES 0176807U ES 176807 U ES176807 U ES 176807U ES 176807 U ES176807 U ES 176807U
- Authority
- ES
- Spain
- Prior art keywords
- translation
- machine
- legally binding
- google translate
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
- Thyristors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Semiconductor construction element with a disk-shaped semiconductor body having at least one passage, which is clamped between two pressure contact bodies by inserting ductile electrodes, characterized in that the bodies; pressure contact have on the front faces, directed towards the semiconductor body, contact faces that are symmetrical to a central line, because the ductile electrodes are developed in the form of plate or cup, because the diameter of the inner bottom of the the electrodes are approximately the same as the diameter of the contact bodies by pressure and because the bent edges of the electrodes are directed towards the contact bodies by pressure. (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2039806A DE2039806C3 (en) | 1970-08-11 | 1970-08-11 | Semiconductor component with pressure contacts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES176807U true ES176807U (en) | 1972-08-16 |
| ES176807Y ES176807Y (en) | 1973-05-01 |
Family
ID=5779405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES1971176807U Expired ES176807Y (en) | 1970-08-11 | 1971-08-09 | SEMICONDUCTOR CONSTRUCTION ELEMENT. |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5550389B1 (en) |
| CH (1) | CH520403A (en) |
| DE (1) | DE2039806C3 (en) |
| ES (1) | ES176807Y (en) |
| FR (1) | FR2102176B1 (en) |
| GB (1) | GB1336790A (en) |
| NL (1) | NL7110924A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2821268C2 (en) * | 1978-05-16 | 1986-10-16 | Siemens AG, 1000 Berlin und 8000 München | Semiconductor component with pressure contact |
| DE2825682C2 (en) * | 1978-06-12 | 1984-09-20 | Brown, Boveri & Cie Ag, 6800 Mannheim | Semiconductor component with insulating housing |
| DE2840400C2 (en) * | 1978-09-16 | 1982-04-08 | Brown, Boveri & Cie Ag, 6800 Mannheim | Controllable power semiconductor component |
| DE2902224A1 (en) * | 1979-01-20 | 1980-07-24 | Bbc Brown Boveri & Cie | CONTACT SYSTEM FOR PERFORMANCE SEMICONDUCTOR COMPONENTS |
| SE420964B (en) * | 1980-03-27 | 1981-11-09 | Asea Ab | COMPOSITION MATERIAL AND SET FOR ITS MANUFACTURING |
| DE3209174A1 (en) * | 1982-03-13 | 1983-09-15 | Brown, Boveri & Cie Ag, 6800 Mannheim | SANDWICH FOR PRINT-CONTACTABLE SEMICONDUCTOR POWER COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF |
| JPS59134876A (en) * | 1983-01-20 | 1984-08-02 | Mitsubishi Electric Corp | Semiconductor device |
| DE112014002388B4 (en) * | 2013-05-13 | 2022-05-05 | Abb Power Grids Switzerland Ag | Spacer system for a switchable semiconductor component |
| WO2020078816A1 (en) | 2018-10-19 | 2020-04-23 | Abb Schweiz Ag | Power semiconductor device with free-floating packaging concept |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1467544A (en) * | 1965-02-08 | 1967-01-27 | Westinghouse Electric Corp | Semiconductor devices |
-
1970
- 1970-08-11 DE DE2039806A patent/DE2039806C3/en not_active Expired
-
1971
- 1971-07-23 CH CH1086071A patent/CH520403A/en not_active IP Right Cessation
- 1971-08-09 FR FR7129055A patent/FR2102176B1/fr not_active Expired
- 1971-08-09 ES ES1971176807U patent/ES176807Y/en not_active Expired
- 1971-08-09 GB GB3734671A patent/GB1336790A/en not_active Expired
- 1971-08-09 NL NL7110924A patent/NL7110924A/xx unknown
- 1971-08-10 JP JP6000671A patent/JPS5550389B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2039806C3 (en) | 1975-05-07 |
| DE2039806B2 (en) | 1974-09-05 |
| JPS5550389B1 (en) | 1980-12-17 |
| NL7110924A (en) | 1972-02-15 |
| GB1336790A (en) | 1973-11-07 |
| FR2102176B1 (en) | 1976-05-28 |
| CH520403A (en) | 1972-03-15 |
| ES176807Y (en) | 1973-05-01 |
| DE2039806A1 (en) | 1972-02-24 |
| FR2102176A1 (en) | 1972-04-07 |
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