CH489116A - Verfahren zur Herstellung einer Hohlkehle an einem Halbleiterbauelement - Google Patents
Verfahren zur Herstellung einer Hohlkehle an einem HalbleiterbauelementInfo
- Publication number
- CH489116A CH489116A CH733169A CH733169A CH489116A CH 489116 A CH489116 A CH 489116A CH 733169 A CH733169 A CH 733169A CH 733169 A CH733169 A CH 733169A CH 489116 A CH489116 A CH 489116A
- Authority
- CH
- Switzerland
- Prior art keywords
- fillet
- producing
- semiconductor component
- semiconductor
- component
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19681764326 DE1764326A1 (de) | 1968-05-17 | 1968-05-17 | Verfahren zur Anbringung einer Hohlkehle an einem Halbleiterbauelement |
Publications (1)
Publication Number | Publication Date |
---|---|
CH489116A true CH489116A (de) | 1970-04-15 |
Family
ID=5697939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH733169A CH489116A (de) | 1968-05-17 | 1969-05-14 | Verfahren zur Herstellung einer Hohlkehle an einem Halbleiterbauelement |
Country Status (8)
Country | Link |
---|---|
US (1) | US3628294A (de) |
JP (1) | JPS4812551B1 (de) |
CH (1) | CH489116A (de) |
DE (1) | DE1764326A1 (de) |
FR (1) | FR2019280B1 (de) |
GB (1) | GB1214238A (de) |
NL (1) | NL6907502A (de) |
SE (1) | SE353816B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0264700A1 (de) * | 1986-10-22 | 1988-04-27 | BBC Brown Boveri AG | Verfahren zum Anbringen einer umlaufenden Hohlkehle am Rand einer Halbleiterscheibe eines Leistungshalbleiter-Bauelements |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2340107A1 (de) * | 1973-07-06 | 1975-01-23 | Bbc Brown Boveri & Cie | Leistungshalbleiterbauelement |
US4344260A (en) * | 1979-07-13 | 1982-08-17 | Nagano Electronics Industrial Co., Ltd. | Method for precision shaping of wafer materials |
JPS57155620U (de) * | 1981-03-27 | 1982-09-30 | ||
JPS61109976A (ja) * | 1984-10-31 | 1986-05-28 | 東亜医用電子株式会社 | ガラス精密弁およびその製法 |
JPS63133599A (ja) * | 1986-11-25 | 1988-06-06 | 株式会社 ユ−シン | 電気機器の取付構造 |
US5154022A (en) * | 1991-06-21 | 1992-10-13 | International Business Machines Corporation | High precision micromachining of very fine features |
US5701373A (en) * | 1995-10-12 | 1997-12-23 | Sdl, Inc. | Method for improving the coupling efficiency of elliptical light beams into optical waveguides |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1945935A (en) * | 1930-12-18 | 1934-02-06 | Siemens Ag | Apparatus for making embossing cylinders |
US2876599A (en) * | 1956-03-09 | 1959-03-10 | Rca Corp | Tuning apparatus |
DE1269732C2 (de) * | 1962-12-24 | 1973-12-13 | Verfahren zum herstellen von halbleiteranordnungen | |
US3299579A (en) * | 1964-01-17 | 1967-01-24 | Heald Machine Co | Grinding machine |
NL6603372A (de) * | 1965-03-25 | 1966-09-26 |
-
1968
- 1968-05-17 DE DE19681764326 patent/DE1764326A1/de active Pending
-
1969
- 1969-05-12 US US823592A patent/US3628294A/en not_active Expired - Lifetime
- 1969-05-14 FR FR696915642A patent/FR2019280B1/fr not_active Expired
- 1969-05-14 CH CH733169A patent/CH489116A/de not_active IP Right Cessation
- 1969-05-15 GB GB24843/69A patent/GB1214238A/en not_active Expired
- 1969-05-15 JP JP44037032A patent/JPS4812551B1/ja active Pending
- 1969-05-16 NL NL6907502A patent/NL6907502A/xx unknown
- 1969-05-16 SE SE06961/69A patent/SE353816B/xx unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0264700A1 (de) * | 1986-10-22 | 1988-04-27 | BBC Brown Boveri AG | Verfahren zum Anbringen einer umlaufenden Hohlkehle am Rand einer Halbleiterscheibe eines Leistungshalbleiter-Bauelements |
Also Published As
Publication number | Publication date |
---|---|
NL6907502A (de) | 1969-11-19 |
JPS4812551B1 (de) | 1973-04-21 |
US3628294A (en) | 1971-12-21 |
FR2019280B1 (de) | 1974-02-22 |
GB1214238A (en) | 1970-12-02 |
FR2019280A1 (de) | 1970-07-03 |
DE1764326A1 (de) | 1971-07-01 |
SE353816B (de) | 1973-02-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |