CH413540A - Bad und Verfahren zum stromlosen Abscheiden von Kupferschichten - Google Patents

Bad und Verfahren zum stromlosen Abscheiden von Kupferschichten

Info

Publication number
CH413540A
CH413540A CH345361A CH345361A CH413540A CH 413540 A CH413540 A CH 413540A CH 345361 A CH345361 A CH 345361A CH 345361 A CH345361 A CH 345361A CH 413540 A CH413540 A CH 413540A
Authority
CH
Switzerland
Prior art keywords
bath
electroless deposition
copper layers
copper
layers
Prior art date
Application number
CH345361A
Other languages
German (de)
English (en)
Inventor
John Zeblisky Rudolph
Francis Mccormack John
Duff Williamson John
W Jr Schneble Frederick
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of CH413540A publication Critical patent/CH413540A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CH345361A 1960-05-03 1961-03-23 Bad und Verfahren zum stromlosen Abscheiden von Kupferschichten CH413540A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26401A US3095309A (en) 1960-05-03 1960-05-03 Electroless copper plating

Publications (1)

Publication Number Publication Date
CH413540A true CH413540A (de) 1966-05-15

Family

ID=21831628

Family Applications (1)

Application Number Title Priority Date Filing Date
CH345361A CH413540A (de) 1960-05-03 1961-03-23 Bad und Verfahren zum stromlosen Abscheiden von Kupferschichten

Country Status (5)

Country Link
US (1) US3095309A (lv)
CH (1) CH413540A (lv)
DE (1) DE1696312C2 (lv)
DK (1) DK105901C (lv)
ES (1) ES266074A1 (lv)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0070061A1 (en) * 1981-07-02 1983-01-19 Koninklijke Philips Electronics N.V. A solution for the electroless deposition of gold-alloys onto a substrate

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3326700A (en) * 1963-06-12 1967-06-20 Rudolph J Zeblisky Electroless copper plating
US3259559A (en) * 1962-08-22 1966-07-05 Day Company Method for electroless copper plating
US3321328A (en) * 1962-11-15 1967-05-23 Ibm Coating of aluminum substrates with a magnetic material
US3306830A (en) * 1963-06-13 1967-02-28 Bell Telephone Labor Inc Printed circuit boards and their fabrication
US3269861A (en) * 1963-06-21 1966-08-30 Day Company Method for electroless copper plating
DE1301186B (de) * 1963-09-19 1969-08-14 Basf Ag Verfahren zur Metallisierung von Oberflaechen von Kunststoff-Gegenstaenden
US3377174A (en) * 1963-10-24 1968-04-09 Torigai Eiichi Method and bath for chemically plating copper
US3340164A (en) * 1963-12-26 1967-09-05 Sperry Rand Corp Method of copper plating anodized aluminum
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3322881A (en) * 1964-08-19 1967-05-30 Jr Frederick W Schneble Multilayer printed circuit assemblies
US3296012A (en) * 1965-04-30 1967-01-03 Corning Glass Works Electroless copper plating on ceramic material
US3607317A (en) * 1969-02-04 1971-09-21 Photocircuits Corp Ductility promoter and stabilizer for electroless copper plating baths
US3853590A (en) * 1969-08-20 1974-12-10 Crown City Plating Co Electroless plating solution and process
US4036651A (en) * 1974-02-26 1977-07-19 Rca Corporation Electroless copper plating bath
US4460427A (en) * 1981-09-21 1984-07-17 E. I. Dupont De Nemours And Company Process for the preparation of flexible circuits
FR2527833A1 (fr) * 1982-05-28 1983-12-02 Europ Composants Electron Procede de depot de terminaisons metalliques sur un condensateur ceramique multicouches et condensateur ainsi obtenu
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
JPS6033358A (ja) * 1983-08-04 1985-02-20 Hitachi Chem Co Ltd 無電解銅めっき液
DE3404270A1 (de) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
US5786030A (en) * 1996-11-12 1998-07-28 Henkel Corporation Spotting resistant gloss enhancement of autodeposition coating
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US8673091B2 (en) * 2007-08-03 2014-03-18 Ppg Industries Ohio, Inc Pretreatment compositions and methods for coating a metal substrate
US9574093B2 (en) * 2007-09-28 2017-02-21 Ppg Industries Ohio, Inc. Methods for coating a metal substrate and related coated metal substrates
US20090238979A1 (en) * 2008-03-21 2009-09-24 William Decesare Method of Applying Catalytic Solution for Use in Electroless Deposition
US8282801B2 (en) * 2008-12-18 2012-10-09 Ppg Industries Ohio, Inc. Methods for passivating a metal substrate and related coated metal substrates
CN103009708A (zh) * 2011-09-21 2013-04-03 深圳富泰宏精密工业有限公司 镀膜件及其制造方法
US9273399B2 (en) 2013-03-15 2016-03-01 Ppg Industries Ohio, Inc. Pretreatment compositions and methods for coating a battery electrode
CN106823469B (zh) * 2017-01-10 2019-05-14 华南理工大学 无需低表面能物质修饰的超疏水超亲油铜网及其制备方法
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2391289A (en) * 1941-09-15 1945-12-18 Jr John F Beaver Bright copper plating
US2874072A (en) * 1956-09-17 1959-02-17 Gen Electric Autocatalytic copper plating process and solution
US2938805A (en) * 1958-03-31 1960-05-31 Gen Electric Process of stabilizing autocatalytic copper plating solutions
US2956901A (en) * 1958-08-06 1960-10-18 Alpha Metal Lab Inc Copper coating composition and method of coating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0070061A1 (en) * 1981-07-02 1983-01-19 Koninklijke Philips Electronics N.V. A solution for the electroless deposition of gold-alloys onto a substrate

Also Published As

Publication number Publication date
DK105901C (da) 1966-11-21
DE1696312B2 (de) 1971-07-15
US3095309A (en) 1963-06-25
DE1696312A1 (lv) 1971-07-15
ES266074A1 (es) 1961-06-16
DE1696312C2 (de) 1979-08-16

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