CH411070A - Panneau à circuit imprimé - Google Patents

Panneau à circuit imprimé

Info

Publication number
CH411070A
CH411070A CH787764A CH787764A CH411070A CH 411070 A CH411070 A CH 411070A CH 787764 A CH787764 A CH 787764A CH 787764 A CH787764 A CH 787764A CH 411070 A CH411070 A CH 411070A
Authority
CH
Switzerland
Prior art keywords
conductive
insulating plate
printed
circuit element
conductive part
Prior art date
Application number
CH787764A
Other languages
English (en)
French (fr)
Inventor
Lazar Michael
Original Assignee
Burndy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burndy Corp filed Critical Burndy Corp
Publication of CH411070A publication Critical patent/CH411070A/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
CH787764A 1964-05-29 1964-06-17 Panneau à circuit imprimé CH411070A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6406045A NL6406045A (enExample) 1964-05-29 1964-05-29

Publications (1)

Publication Number Publication Date
CH411070A true CH411070A (fr) 1966-04-15

Family

ID=19790198

Family Applications (1)

Application Number Title Priority Date Filing Date
CH787764A CH411070A (fr) 1964-05-29 1964-06-17 Panneau à circuit imprimé

Country Status (4)

Country Link
US (1) US3192307A (enExample)
CH (1) CH411070A (enExample)
FR (1) FR1397874A (enExample)
NL (1) NL6406045A (enExample)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3262022A (en) * 1964-02-13 1966-07-19 Gen Micro Electronics Inc Packaged electronic device
US3319166A (en) * 1964-07-21 1967-05-09 Westinghouse Electric Corp Fixture for securing and electrically testing an electronic component in flat package with coplanar leads
US3354394A (en) * 1964-08-06 1967-11-21 Texas Instruments Inc Receptacle for transistors or integrated circuits to be tested
US3316458A (en) * 1965-01-29 1967-04-25 Hughes Aircraft Co Electronic circuit assembly with recessed substrate mounting means
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
US3480836A (en) * 1966-08-11 1969-11-25 Ibm Component mounted in a printed circuit
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
GB1225485A (enExample) * 1967-05-15 1971-03-17
US3521128A (en) * 1967-08-02 1970-07-21 Rca Corp Microminiature electrical component having integral indexing means
DE1909480C2 (de) * 1968-03-01 1984-10-11 General Electric Co., Schenectady, N.Y. Trägeranordnung und Verfahren zur elektrischen Kontaktierung von Halbleiterchips
US3686612A (en) * 1968-03-05 1972-08-22 Flexicon Electronics Inc Electrical connector
DE7016022U (de) * 1970-04-28 1970-07-23 Agfa Gevaert Ag Leiterplatte.
US3983458A (en) * 1971-07-21 1976-09-28 Corning Glass Works Electrical device assembly and method
US3868725A (en) * 1971-10-14 1975-02-25 Philips Corp Integrated circuit lead structure
US3943021A (en) * 1972-02-07 1976-03-09 Lindsey Richard W Optical data processing system
US3746973A (en) * 1972-05-05 1973-07-17 Ibm Testing of metallization networks on insulative substrates supporting semiconductor chips
JPS4961444U (enExample) * 1972-09-07 1974-05-30
JPS5548700B2 (enExample) * 1973-01-30 1980-12-08
GB1574699A (en) * 1975-10-10 1980-09-10 Luc Technologies Ltd Conductive connections
DE2645721A1 (de) * 1976-10-09 1978-04-13 Luc Technologies Ltd Leitende verbindungen
US4138691A (en) * 1977-06-07 1979-02-06 Nippon Electric Co., Ltd. Framed lead assembly for a semiconductor device comprising insulator reinforcing strips supported by a frame and made integral with lead strips
US4300153A (en) * 1977-09-22 1981-11-10 Sharp Kabushiki Kaisha Flat shaped semiconductor encapsulation
JPS594873B2 (ja) * 1978-09-26 1984-02-01 松下電器産業株式会社 印刷配線板
JPS5683096A (en) * 1979-12-10 1981-07-07 Sony Corp Hybrid integrated circuit and method of manufacturing same
US4380357A (en) * 1980-11-03 1983-04-19 Texas Instruments Incorporated System and method for effecting electrical interconnections using a flexible media with radially extending electrical conductors
US4320272A (en) * 1981-01-26 1982-03-16 Oak Industries Inc. Connector for attaching an electrical component to a flat sheet
US4402561A (en) * 1981-03-27 1983-09-06 Amp Incorporated Socket for integrated circuit package with extended leads
US4635354A (en) * 1982-07-22 1987-01-13 Texas Instruments Incorporated Low cost electronic apparatus construction method
US4603373A (en) * 1983-07-13 1986-07-29 Electronic Concepts, Inc. Outer wrapping for a metallized wound capacitor
US4631820A (en) * 1984-08-23 1986-12-30 Canon Kabushiki Kaisha Mounting assembly and mounting method for an electronic component
US4818823A (en) * 1987-07-06 1989-04-04 Micro-Circuits, Inc. Adhesive component means for attaching electrical components to conductors
FI85783C (fi) * 1989-02-17 1992-05-25 Nokia Mobira Oy Kylningskonstruktion foer transistor.
US5113579A (en) * 1989-06-30 1992-05-19 Semicon Components, Inc. Method of manufacturing hybrid integrated circuit
US4979076A (en) * 1989-06-30 1990-12-18 Dibugnara Raymond Hybrid integrated circuit apparatus
US5355102A (en) * 1990-04-05 1994-10-11 General Electric Company HDI impedance matched microwave circuit assembly
US5245751A (en) * 1990-04-27 1993-09-21 Circuit Components, Incorporated Array connector
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US6160714A (en) 1997-12-31 2000-12-12 Elpac (Usa), Inc. Molded electronic package and method of preparation
JP2004506309A (ja) 1997-12-31 2004-02-26 エルパック（ユーエスエー）、インコーポレイテッド モールドされた電子パッケージ、製作方法およびシールディング方法
FR2790905A1 (fr) * 1999-03-09 2000-09-15 Sagem Composant electrique de puissance a montage par brasage sur un support et procede de montage correspondant
FI115285B (fi) * 2002-01-31 2005-03-31 Imbera Electronics Oy Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi
US7361844B2 (en) * 2002-11-25 2008-04-22 Vlt, Inc. Power converter package and thermal management
DE102004006533A1 (de) * 2004-02-11 2005-09-01 Conti Temic Microelectronic Gmbh Elektrisch leitfähiger Kontaktstift zum Einpressen in eine Öffnung einer Leiterplatte sowie elektrische Baugruppe mit einem solchen Kontaktstift
TW201322565A (zh) * 2011-11-30 2013-06-01 Hon Hai Prec Ind Co Ltd 電路連接元件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3061762A (en) * 1962-10-30 figure
US2964587A (en) * 1956-11-16 1960-12-13 Otis N Minot Tape conductor
US3077511A (en) * 1960-03-11 1963-02-12 Int Resistance Co Printed circuit unit
US3082396A (en) * 1960-07-27 1963-03-19 Frank L Bernhard Automatic electrical connection device

Also Published As

Publication number Publication date
US3192307A (en) 1965-06-29
NL6406045A (enExample) 1965-11-30
FR1397874A (fr) 1965-04-30

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