H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K1/00—Printed circuits
H05K1/18—Printed circuits structurally associated with non-printed electric components
H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
H—ELECTRICITY
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
H05K2201/10621—Components characterised by their electrical contacts
Boitier de semi-conducteur ayant un element semi-conducteur, une structure de fixation de boitier de semi-conducteur montee sur une plaquette de circuits imprimes, et procede d'assemblage de boitier de semi-conducteur