CH391108A - Verfahren zur Herstellung der elektrischen Anschlüsse einer Halbleiteranordnung - Google Patents

Verfahren zur Herstellung der elektrischen Anschlüsse einer Halbleiteranordnung

Info

Publication number
CH391108A
CH391108A CH373261A CH373261A CH391108A CH 391108 A CH391108 A CH 391108A CH 373261 A CH373261 A CH 373261A CH 373261 A CH373261 A CH 373261A CH 391108 A CH391108 A CH 391108A
Authority
CH
Switzerland
Prior art keywords
producing
electrical connections
semiconductor arrangement
semiconductor
arrangement
Prior art date
Application number
CH373261A
Other languages
English (en)
Inventor
Adolf Dr Herlet
Rosenheinrich Rene
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH391108A publication Critical patent/CH391108A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
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    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01015—Phosphorus [P]
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    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
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    • H01L2924/01042—Molybdenum [Mo]
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    • H01L2924/01051—Antimony [Sb]
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    • H01L2924/01074—Tungsten [W]
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    • H01L2924/01079—Gold [Au]
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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    • H01L2924/013—Alloys
    • H01L2924/0133—Ternary Alloys
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13034—Silicon Controlled Rectifier [SCR]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Coils Of Transformers For General Uses (AREA)
CH373261A 1960-06-28 1961-03-29 Verfahren zur Herstellung der elektrischen Anschlüsse einer Halbleiteranordnung CH391108A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0069152 1960-06-28

Publications (1)

Publication Number Publication Date
CH391108A true CH391108A (de) 1965-04-30

Family

ID=7500765

Family Applications (1)

Application Number Title Priority Date Filing Date
CH373261A CH391108A (de) 1960-06-28 1961-03-29 Verfahren zur Herstellung der elektrischen Anschlüsse einer Halbleiteranordnung

Country Status (5)

Country Link
US (1) US3418709A (de)
BE (1) BE605339A (de)
CH (1) CH391108A (de)
GB (1) GB947528A (de)
NL (1) NL264022A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0194475A2 (de) * 1985-03-14 1986-09-17 Olin Corporation Bindungssystem für Halbleiterwürfel
US4978052A (en) * 1986-11-07 1990-12-18 Olin Corporation Semiconductor die attach system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5046656A (en) * 1988-09-12 1991-09-10 Regents Of The University Of California Vacuum die attach for integrated circuits

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2801375A (en) * 1955-08-01 1957-07-30 Westinghouse Electric Corp Silicon semiconductor devices and processes for making them

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0194475A2 (de) * 1985-03-14 1986-09-17 Olin Corporation Bindungssystem für Halbleiterwürfel
EP0194475A3 (de) * 1985-03-14 1988-04-20 Olin Corporation Bindungssystem für Halbleiterwürfel
US4978052A (en) * 1986-11-07 1990-12-18 Olin Corporation Semiconductor die attach system

Also Published As

Publication number Publication date
BE605339A (fr) 1961-12-27
NL264022A (de)
GB947528A (en) 1964-01-22
US3418709A (en) 1968-12-31

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