NL264022A - - Google Patents

Info

Publication number: NL264022A
Authority: NL; Netherlands

Application number

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1960-06-28

Publication of NL264022A publication Critical patent/NL264022A/xx

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
- H—ELECTRICITY
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- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/01029—Copper [Cu]
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- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/01047—Silver [Ag]
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- H01L2924/01051—Antimony [Sb]
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- H01L2924/01074—Tungsten [W]
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- H01L2924/01075—Rhenium [Re]
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- H01L2924/01079—Gold [Au]
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- H01L2924/01082—Lead [Pb]
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/0133—Ternary Alloys
- H—ELECTRICITY
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13034—Silicon Controlled Rectifier [SCR]
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S228/00—Metal fusion bonding
- Y10S228/904—Wire bonding

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Coils Of Transformers For General Uses (AREA)
Die Bonding (AREA)

NL264022D 1960-06-28 NL264022A (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DES0069152		1960-06-28

Publications (1)

Publication Number	Publication Date
NL264022A true NL264022A (de)

Family

ID=7500765

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NL264022D NL264022A (de)	1960-06-28

Country Status (5)

Country	Link
US (1)	US3418709A (de)
BE (1)	BE605339A (de)
CH (1)	CH391108A (de)
GB (1)	GB947528A (de)
NL (1)	NL264022A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4929516A (en) *	1985-03-14	1990-05-29	Olin Corporation	Semiconductor die attach system
US4978052A (en) *	1986-11-07	1990-12-18	Olin Corporation	Semiconductor die attach system
US5046656A (en) *	1988-09-12	1991-09-10	Regents Of The University Of California	Vacuum die attach for integrated circuits

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2801375A (en) *	1955-08-01	1957-07-30	Westinghouse Electric Corp	Silicon semiconductor devices and processes for making them

0
- NL NL264022D patent/NL264022A/xx unknown
1961
- 1961-03-29 CH CH373261A patent/CH391108A/de unknown
- 1961-05-17 GB GB18030/61A patent/GB947528A/en not_active Expired
- 1961-06-23 BE BE605339A patent/BE605339A/fr unknown
1965
- 1965-07-06 US US473555A patent/US3418709A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
CH391108A (de)	1965-04-30
BE605339A (fr)	1961-12-27
GB947528A (en)	1964-01-22
US3418709A (en)	1968-12-31

Publication	Publication Date	Title
FR1310106A (de)	1963-03-06
FR1230705A (de)	1960-09-19
FR1563607A (de)	1969-04-18
FR2034254A2 (de)	1970-12-11
AT229108B (de)	1963-08-26
FI40853B (de)	1969-02-28
FR93M (de)	1961-01-09
DE1141316C2 (de)	1963-07-04
DE1438762B2 (de)	1970-01-02
BE602391A (de)
BE604225A (de)
BE635193A (de)
BE608820A (de)
BE606717A (de)
BE606550A (de)
BE604945A (de)
BE604657A (de)
BE601734A (de)	1961-04-14
BE701871A (de)	1968-01-02
BE587794A (de)
BE588555A (de)
BE598272A (de)
BE599277A (de)
BE601582A (de)
CH1047361A4 (de)	1963-05-31