CH368680A - Galvanisches Kupferbad - Google Patents

Galvanisches Kupferbad

Info

Publication number
CH368680A
CH368680A CH5734458A CH5734458A CH368680A CH 368680 A CH368680 A CH 368680A CH 5734458 A CH5734458 A CH 5734458A CH 5734458 A CH5734458 A CH 5734458A CH 368680 A CH368680 A CH 368680A
Authority
CH
Switzerland
Prior art keywords
copper bath
galvanic copper
galvanic
bath
copper
Prior art date
Application number
CH5734458A
Other languages
English (en)
Inventor
Wennemar Dr Strauss
Hans Dr Wedell
Original Assignee
Dehydag Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dehydag Gmbh filed Critical Dehydag Gmbh
Publication of CH368680A publication Critical patent/CH368680A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CH5734458A 1957-04-16 1958-03-21 Galvanisches Kupferbad CH368680A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DED25419A DE1214069B (de) 1957-04-16 1957-04-16 Galvanische Kupferbaeder

Publications (1)

Publication Number Publication Date
CH368680A true CH368680A (de) 1963-04-15

Family

ID=7038530

Family Applications (1)

Application Number Title Priority Date Filing Date
CH5734458A CH368680A (de) 1957-04-16 1958-03-21 Galvanisches Kupferbad

Country Status (6)

Country Link
US (1) US3000800A (de)
BE (1) BE565994A (de)
CH (1) CH368680A (de)
DE (1) DE1214069B (de)
FR (1) FR1248421A (de)
GB (1) GB884036A (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1133610B (de) * 1959-06-06 1962-07-19 Dehydag Gmbh Saure galvanische Kupferbaeder
GB872879A (en) * 1961-02-20 1961-07-12 Dehydag Gmbh Electrolytic copper-plating baths
US3940320A (en) * 1972-12-14 1976-02-24 M & T Chemicals Inc. Electrodeposition of copper
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956079A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956084A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3966565A (en) * 1972-12-14 1976-06-29 M & T Chemicals Inc. Electrodeposition of copper
US3956120A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US4036710A (en) * 1974-11-21 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4014760A (en) * 1974-11-21 1977-03-29 M & T Chemicals Inc. Electrodeposition of copper
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
US6246975B1 (en) 1996-10-30 2001-06-12 American Board Of Family Practice, Inc. Computer architecture and process of patient generation, evolution, and simulation for computer based testing system
US7581998B2 (en) * 2005-09-08 2009-09-01 Ngk Spark Plug Co., Ltd. Method for regulating aground electrode position in spark plug
JP2009191335A (ja) * 2008-02-15 2009-08-27 Ishihara Chem Co Ltd めっき液及び電子部品
US10797524B2 (en) 2017-10-24 2020-10-06 Stryker Corporation Techniques for power transfer through wheels of a patient support apparatus
CN113943934B (zh) * 2021-10-26 2023-10-20 海宁市科泰克金属表面技术有限公司 电器元件的锡、镍镀层保护剂

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2563360A (en) * 1941-05-24 1951-08-07 Gen Motors Corp Electrodeposition of copper
US2489538A (en) * 1941-05-24 1949-11-29 Gen Motors Corp Electrodeposition of copper
US2391289A (en) * 1941-09-15 1945-12-18 Jr John F Beaver Bright copper plating
BE520210A (de) * 1952-05-26
BE518440A (de) * 1952-07-05
DE932709C (de) * 1952-08-31 1955-09-08 W Kampschulte & Cie Dr Verfahren zur Abscheidung von glatten und glaenzenden Kupferueberzuegen
DE1001078B (de) * 1953-08-13 1957-01-17 Dehydag Gmbh Galvanische Baeder zur Herstellung von Metallueberzuegen
NL298381A (de) * 1953-09-19
NL217034A (de) * 1956-06-15

Also Published As

Publication number Publication date
GB884036A (en) 1961-12-06
DE1214069B (de) 1966-04-07
US3000800A (en) 1961-09-19
FR1248421A (fr) 1960-12-16
BE565994A (de)

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