CH346864A - Verfahren zum Herstellen von Siliziumkarbidkristallen durch Sublimation - Google Patents

Verfahren zum Herstellen von Siliziumkarbidkristallen durch Sublimation

Info

Publication number
CH346864A
CH346864A CH346864DA CH346864A CH 346864 A CH346864 A CH 346864A CH 346864D A CH346864D A CH 346864DA CH 346864 A CH346864 A CH 346864A
Authority
CH
Switzerland
Prior art keywords
sublimation
manufacture
silicon carbide
carbide crystals
crystals
Prior art date
Application number
Other languages
English (en)
Inventor
Anthony Lely Jan
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH346864A publication Critical patent/CH346864A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
    • H01L21/0455—Making n or p doped regions or layers, e.g. using diffusion
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/002—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/36—Carbides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/906—Special atmosphere other than vacuum or inert
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S118/00—Coating apparatus
    • Y10S118/90—Semiconductor vapor doping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/148—Silicon carbide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/931—Silicon carbide semiconductor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Carbon And Carbon Compounds (AREA)
CH346864D 1954-03-19 1955-03-17 Verfahren zum Herstellen von Siliziumkarbidkristallen durch Sublimation CH346864A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL346864X 1954-03-19

Publications (1)

Publication Number Publication Date
CH346864A true CH346864A (de) 1960-06-15

Family

ID=19784917

Family Applications (1)

Application Number Title Priority Date Filing Date
CH346864D CH346864A (de) 1954-03-19 1955-03-17 Verfahren zum Herstellen von Siliziumkarbidkristallen durch Sublimation

Country Status (6)

Country Link
US (1) US2854364A (de)
CH (1) CH346864A (de)
DE (1) DE1039045B (de)
FR (1) FR1138273A (de)
GB (1) GB772691A (de)
NL (1) NL87348C (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994023096A1 (de) * 1993-04-01 1994-10-13 Siemens Aktiengesellschaft VORRICHTUNG UND VERFAHREN ZUM HERSTELLEN VON SiC-EINKRISTALLEN

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US3154439A (en) * 1959-04-09 1964-10-27 Sprague Electric Co Method for forming a protective skin for transistor
US3082126A (en) * 1959-06-19 1963-03-19 Westinghouse Electric Corp Producing diffused junctions in silicon carbide
US3129125A (en) * 1959-07-01 1964-04-14 Westinghouse Electric Corp Preparation of silicon carbide materials
US2996415A (en) * 1959-10-05 1961-08-15 Transitron Electronic Corp Method of purifying silicon carbide
US3053635A (en) * 1960-09-26 1962-09-11 Clevite Corp Method of growing silicon carbide crystals
NL267879A (de) * 1960-09-26
US3166380A (en) * 1961-05-01 1965-01-19 Carborundum Co Process for the production of submicron silicon carbide
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US3161473A (en) * 1962-06-06 1964-12-15 Corning Glass Works Method of making beta-silicon carbide fibers
US3236780A (en) * 1962-12-19 1966-02-22 Gen Electric Luminescent silicon carbide and preparation thereof
NL293275A (de) * 1963-05-27
US3236673A (en) * 1963-06-03 1966-02-22 Ionics Colloidal silicon carbide and the method of making the same
US3275415A (en) * 1964-02-27 1966-09-27 Westinghouse Electric Corp Apparatus for and preparation of silicon carbide single crystals
GB1052587A (de) * 1964-06-30
US3470107A (en) * 1965-10-15 1969-09-30 Gen Electric Silicon carbide phosphors
US3962406A (en) * 1967-11-25 1976-06-08 U.S. Philips Corporation Method of manufacturing silicon carbide crystals
US4147572A (en) * 1976-10-18 1979-04-03 Vodakov Jury A Method for epitaxial production of semiconductor silicon carbide utilizing a close-space sublimation deposition technique
AU524439B2 (en) * 1979-10-11 1982-09-16 Matsushita Electric Industrial Co., Ltd. Sputtered thin film thermistor
US4536379A (en) * 1983-06-02 1985-08-20 Graphite Sales, Inc. Production of silicon carbide
US4556436A (en) * 1984-08-22 1985-12-03 The United States Of America As Represented By The Secretary Of The Navy Method of preparing single crystalline cubic silicon carbide layers
US4866005A (en) 1987-10-26 1989-09-12 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US4912063A (en) * 1987-10-26 1990-03-27 North Carolina State University Growth of beta-sic thin films and semiconductor devices fabricated thereon
US5032332A (en) * 1988-10-06 1991-07-16 Benchmark Structural Ceramics Corporation Process for making a silicon carbide whisker reinforced alumina ceramic composite precursor
US4948761A (en) * 1988-12-02 1990-08-14 Benchmark Structural Ceramics Corporation Process for making a silicon carbide composition
US5006290A (en) * 1988-10-06 1991-04-09 Benchmark Structural Ceramics Corporation Process for making a silicon carbide whisker reinforced alumina ceramic composite precursor
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US4990295A (en) * 1988-10-06 1991-02-05 Benchmark Structural Ceramics Corporation Process for making a silicon carbide composition
US5071797A (en) * 1988-10-06 1991-12-10 Benchmark Structural Ceramics Corporation Titanium carbide/alumina composite material
US5143668A (en) * 1988-10-06 1992-09-01 Benchmark Structural Ceramics Corporation Process for making a reaction-sintered carbide-based composite body with controlled combustion synthesis
US4957885A (en) * 1988-10-06 1990-09-18 Benchmark Structural Ceramics Corporation Process for making a silicon carbide composition
US5211801A (en) * 1989-06-20 1993-05-18 Siemens Aktiengesellschaft Method for manufacturing single-crystal silicon carbide
US5958132A (en) * 1991-04-18 1999-09-28 Nippon Steel Corporation SiC single crystal and method for growth thereof
US5709745A (en) * 1993-01-25 1998-01-20 Ohio Aerospace Institute Compound semi-conductors and controlled doping thereof
CA2113336C (en) * 1993-01-25 2001-10-23 David J. Larkin Compound semi-conductors and controlled doping thereof
US5441011A (en) * 1993-03-16 1995-08-15 Nippon Steel Corporation Sublimation growth of single crystal SiC
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DE4427857C2 (de) * 1994-08-05 2001-04-12 Siemens Ag Verfahren zum Herstellen eines mit Aluminium dotierten Siliciumcarbid-Einkristalls
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US5989340A (en) * 1995-11-14 1999-11-23 Siemens Aktiengesellschaft Process and device for sublimation growing of silicon carbide monocrystals
US5746827A (en) * 1995-12-27 1998-05-05 Northrop Grumman Corporation Method of producing large diameter silicon carbide crystals
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US6547877B2 (en) 1996-01-22 2003-04-15 The Fox Group, Inc. Tantalum crucible fabrication and treatment
US6537371B2 (en) 1997-01-22 2003-03-25 The Fox Group, Inc. Niobium crucible fabrication and treatment
US6562130B2 (en) 1997-01-22 2003-05-13 The Fox Group, Inc. Low defect axially grown single crystal silicon carbide
ATE217368T1 (de) 1997-01-22 2002-05-15 Yury Alexandrovich Vodakov Züchtung von siliziumkarbid einkristallen
US5937317A (en) * 1997-05-08 1999-08-10 Northrop Grumman Corporation Method of making a low resistivity silicon carbide boule
US6562131B2 (en) 1999-07-20 2003-05-13 The Fox Group, Inc. Method for growing single crystal silicon carbide
US7147715B2 (en) * 2003-07-28 2006-12-12 Cree, Inc. Growth of ultra-high purity silicon carbide crystals in an ambient containing hydrogen
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US8409351B2 (en) * 2007-08-08 2013-04-02 Sic Systems, Inc. Production of bulk silicon carbide with hot-filament chemical vapor deposition
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US9797064B2 (en) 2013-02-05 2017-10-24 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion
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US9738991B2 (en) 2013-02-05 2017-08-22 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion
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CN108463580B (zh) 2015-09-24 2021-11-12 帕里杜斯有限公司 气相沉积装置以及使用高纯度聚合物衍生的碳化硅的技术
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JP7268299B2 (ja) * 2018-08-08 2023-05-08 株式会社レゾナック 遮蔽部材及び単結晶成長装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994023096A1 (de) * 1993-04-01 1994-10-13 Siemens Aktiengesellschaft VORRICHTUNG UND VERFAHREN ZUM HERSTELLEN VON SiC-EINKRISTALLEN
US5707446A (en) * 1993-04-01 1998-01-13 Siemens Aktiengesellschaft Device for producing SiC single crystals

Also Published As

Publication number Publication date
GB772691A (en) 1957-04-17
DE1039045B (de) 1958-09-18
NL87348C (de) 1900-01-01
FR1138273A (fr) 1957-06-12
US2854364A (en) 1958-09-30

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