CA920721A - Method of making thermo-compression-bonded semiconductor device - Google Patents

Method of making thermo-compression-bonded semiconductor device

Info

Publication number
CA920721A
CA920721A CA126342A CA126342A CA920721A CA 920721 A CA920721 A CA 920721A CA 126342 A CA126342 A CA 126342A CA 126342 A CA126342 A CA 126342A CA 920721 A CA920721 A CA 920721A
Authority
CA
Canada
Prior art keywords
compression
semiconductor device
bonded semiconductor
making thermo
thermo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA126342A
Other languages
English (en)
Inventor
Fujiwara Shohei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP45096128A external-priority patent/JPS4939223B1/ja
Priority claimed from JP45097672A external-priority patent/JPS4939224B1/ja
Priority claimed from JP45097673A external-priority patent/JPS4948264B1/ja
Priority claimed from JP45098605A external-priority patent/JPS4948265B1/ja
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Application granted granted Critical
Publication of CA920721A publication Critical patent/CA920721A/en
Expired legal-status Critical Current

Links

Classifications

    • H10P95/00—
    • H10W72/073—
    • H10W72/07332—
    • H10W72/07336—
    • H10W72/352—
    • H10W72/5522—
    • H10W72/59—
    • H10W72/884—
    • H10W72/952—
    • H10W90/736—
    • H10W90/753—
    • H10W90/754—
CA126342A 1970-10-30 1971-10-28 Method of making thermo-compression-bonded semiconductor device Expired CA920721A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP45096128A JPS4939223B1 (enExample) 1970-10-30 1970-10-30
JP45097672A JPS4939224B1 (enExample) 1970-11-05 1970-11-05
JP45097673A JPS4948264B1 (enExample) 1970-11-05 1970-11-05
JP45098605A JPS4948265B1 (enExample) 1970-11-07 1970-11-07

Publications (1)

Publication Number Publication Date
CA920721A true CA920721A (en) 1973-02-06

Family

ID=27468399

Family Applications (1)

Application Number Title Priority Date Filing Date
CA126342A Expired CA920721A (en) 1970-10-30 1971-10-28 Method of making thermo-compression-bonded semiconductor device

Country Status (6)

Country Link
US (1) US3729807A (enExample)
CA (1) CA920721A (enExample)
DE (1) DE2154026A1 (enExample)
FR (1) FR2111969B1 (enExample)
GB (1) GB1374626A (enExample)
NL (1) NL7114934A (enExample)

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US3890455A (en) * 1972-06-23 1975-06-17 Ibm Method of electrolessly plating alloys
US3986251A (en) * 1974-10-03 1976-10-19 Motorola, Inc. Germanium doped light emitting diode bonding process
US4065588A (en) * 1975-11-20 1977-12-27 Rca Corporation Method of making gold-cobalt contact for silicon devices
JPS5439573A (en) * 1977-09-05 1979-03-27 Toshiba Corp Compound semiconductor device
US4293587A (en) * 1978-11-09 1981-10-06 Zilog, Inc. Low resistance backside preparation for semiconductor integrated circuit chips
EP0067993A1 (en) * 1980-12-30 1983-01-05 Mostek Corporation Die attachment exhibiting enhanced quality and reliability
US4702941A (en) * 1984-03-27 1987-10-27 Motorola Inc. Gold metallization process
US5037778A (en) * 1989-05-12 1991-08-06 Intel Corporation Die attach using gold ribbon with gold/silicon eutectic alloy cladding
US5028454A (en) * 1989-10-16 1991-07-02 Motorola Inc. Electroless plating of portions of semiconductor devices and the like
DE4107660C2 (de) * 1991-03-09 1995-05-04 Bosch Gmbh Robert Verfahren zur Montage von Silizium-Plättchen auf metallischen Montageflächen
JPH05200539A (ja) * 1992-01-24 1993-08-10 Honda Motor Co Ltd 半導体基板接合方法
US6225218B1 (en) * 1995-12-20 2001-05-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and its manufacturing method
DE19639438A1 (de) * 1996-09-25 1998-04-02 Siemens Ag Halbleiterkörper mit Lotmaterialschicht
US6118351A (en) * 1997-06-10 2000-09-12 Lucent Technologies Inc. Micromagnetic device for power processing applications and method of manufacture therefor
US6440750B1 (en) 1997-06-10 2002-08-27 Agere Systems Guardian Corporation Method of making integrated circuit having a micromagnetic device
CN1322282A (zh) 1998-09-03 2001-11-14 卢卡斯新星传感器公司 正比微机械装置
US7011378B2 (en) * 1998-09-03 2006-03-14 Ge Novasensor, Inc. Proportional micromechanical valve
US6523560B1 (en) 1998-09-03 2003-02-25 General Electric Corporation Microvalve with pressure equalization
US6255714B1 (en) 1999-06-22 2001-07-03 Agere Systems Guardian Corporation Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor
US6845962B1 (en) * 2000-03-22 2005-01-25 Kelsey-Hayes Company Thermally actuated microvalve device
US6505811B1 (en) 2000-06-27 2003-01-14 Kelsey-Hayes Company High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate
US20070251586A1 (en) * 2003-11-24 2007-11-01 Fuller Edward N Electro-pneumatic control valve with microvalve pilot
US8011388B2 (en) * 2003-11-24 2011-09-06 Microstaq, INC Thermally actuated microvalve with multiple fluid ports
EP1694990A4 (en) * 2003-11-24 2009-12-09 Microstaq Inc MICRO-VALVE DEVICE FOR CONTROLLING A VARIABLE DISPLACEMENT COMPRESSOR
JP2007525630A (ja) * 2004-02-27 2007-09-06 アルーマナ、マイクロウ、エルエルシー ハイブリッド・マイクロ／マクロ・プレート弁
US7803281B2 (en) * 2004-03-05 2010-09-28 Microstaq, Inc. Selective bonding for forming a microvalve
US7156365B2 (en) * 2004-07-27 2007-01-02 Kelsey-Hayes Company Method of controlling microvalve actuator
CN100591916C (zh) * 2005-01-14 2010-02-24 麦克罗斯塔克公司 用于控制变容积式压缩机的方法和系统
US8156962B2 (en) 2006-12-15 2012-04-17 Dunan Microstaq, Inc. Microvalve device
WO2008121369A1 (en) 2007-03-30 2008-10-09 Microstaq, Inc. Pilot operated micro spool valve
WO2008121365A1 (en) 2007-03-31 2008-10-09 Microstaq, Inc. Pilot operated spool valve
CN102164846B (zh) * 2008-08-09 2016-03-30 盾安美斯泰克公司(美国) 改进的微型阀装置
US8113482B2 (en) * 2008-08-12 2012-02-14 DunAn Microstaq Microvalve device with improved fluid routing
WO2010065804A2 (en) 2008-12-06 2010-06-10 Microstaq, Inc. Fluid flow control assembly
WO2010117874A2 (en) 2009-04-05 2010-10-14 Microstaq, Inc. Method and structure for optimizing heat exchanger performance
CN102575782B (zh) 2009-08-17 2014-04-09 盾安美斯泰克股份有限公司 微型机械装置和控制方法
US9006844B2 (en) 2010-01-28 2015-04-14 Dunan Microstaq, Inc. Process and structure for high temperature selective fusion bonding
CN102812538B (zh) 2010-01-28 2015-05-13 盾安美斯泰克股份有限公司 用以促进接合的重调节半导体表面的方法
US8996141B1 (en) 2010-08-26 2015-03-31 Dunan Microstaq, Inc. Adaptive predictive functional controller
US8925793B2 (en) 2012-01-05 2015-01-06 Dunan Microstaq, Inc. Method for making a solder joint
US9140613B2 (en) 2012-03-16 2015-09-22 Zhejiang Dunan Hetian Metal Co., Ltd. Superheat sensor
EP2693465A1 (en) * 2012-07-31 2014-02-05 Nxp B.V. Electronic device and method of manufacturing such device
US9188375B2 (en) 2013-12-04 2015-11-17 Zhejiang Dunan Hetian Metal Co., Ltd. Control element and check valve assembly
US9804273B2 (en) * 2014-10-17 2017-10-31 Purdue Research Foundation Combined n-type and p-type MOS-based radiation sensors for environmental compensations

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3078559A (en) * 1959-04-13 1963-02-26 Sylvania Electric Prod Method for preparing semiconductor elements
US3207838A (en) * 1961-06-30 1965-09-21 Western Electric Co Substrates having solderable gold films formed thereon, and methods of making the same
US3273979A (en) * 1964-07-06 1966-09-20 Rca Corp Semiconductive devices
US3585711A (en) * 1968-09-06 1971-06-22 Us Navy Gold-silicon bonding process
GB1256518A (enExample) * 1968-11-30 1971-12-08
US3618202A (en) * 1969-05-12 1971-11-09 Mallory & Co Inc P R Ceramic chip electrical components
US3673478A (en) * 1969-10-31 1972-06-27 Hitachi Ltd A semiconductor pellet fitted on a metal body
US3680199A (en) * 1970-07-06 1972-08-01 Texas Instruments Inc Alloying method

Also Published As

Publication number Publication date
GB1374626A (en) 1974-11-20
DE2154026A1 (de) 1972-05-18
US3729807A (en) 1973-05-01
FR2111969A1 (enExample) 1972-06-09
NL7114934A (enExample) 1972-05-03
FR2111969B1 (enExample) 1974-06-21

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