JPS4939224B1 - - Google Patents
Info
- Publication number
- JPS4939224B1 JPS4939224B1 JP45097672A JP9767270A JPS4939224B1 JP S4939224 B1 JPS4939224 B1 JP S4939224B1 JP 45097672 A JP45097672 A JP 45097672A JP 9767270 A JP9767270 A JP 9767270A JP S4939224 B1 JPS4939224 B1 JP S4939224B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45097672A JPS4939224B1 (enExample) | 1970-11-05 | 1970-11-05 | |
| GB4950271A GB1374626A (en) | 1970-10-30 | 1971-10-25 | Method of making a semiconductor device |
| CA126342A CA920721A (en) | 1970-10-30 | 1971-10-28 | Method of making thermo-compression-bonded semiconductor device |
| IT7057371A IT940089B (it) | 1970-10-30 | 1971-10-29 | Procedimento per fabbricare disposi tivi semiconduttori fissati per termocompressione |
| NL7114934A NL7114934A (enExample) | 1970-10-30 | 1971-10-29 | |
| DE19712154026 DE2154026A1 (de) | 1970-10-30 | 1971-10-29 | Verfahren zum Herstellen von Halb leiterbauelementen |
| FR717139077A FR2111969B1 (enExample) | 1970-10-30 | 1971-10-29 | |
| US00193956A US3729807A (en) | 1970-10-30 | 1971-10-29 | Method of making thermo-compression-bonded semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45097672A JPS4939224B1 (enExample) | 1970-11-05 | 1970-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4939224B1 true JPS4939224B1 (enExample) | 1974-10-24 |
Family
ID=14198497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45097672A Pending JPS4939224B1 (enExample) | 1970-10-30 | 1970-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4939224B1 (enExample) |
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1970
- 1970-11-05 JP JP45097672A patent/JPS4939224B1/ja active Pending