CA2813726A1 - Module photonique et procede de fabrication associe - Google Patents

Module photonique et procede de fabrication associe Download PDF

Info

Publication number
CA2813726A1
CA2813726A1 CA2813726A CA2813726A CA2813726A1 CA 2813726 A1 CA2813726 A1 CA 2813726A1 CA 2813726 A CA2813726 A CA 2813726A CA 2813726 A CA2813726 A CA 2813726A CA 2813726 A1 CA2813726 A1 CA 2813726A1
Authority
CA
Canada
Prior art keywords
enclosure
motherboard
optical fiber
photonics module
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA2813726A
Other languages
English (en)
Inventor
Stewart Wayne Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Palomar Medical Technologies LLC
Original Assignee
Palomar Medical Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Palomar Medical Technologies LLC filed Critical Palomar Medical Technologies LLC
Publication of CA2813726A1 publication Critical patent/CA2813726A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
CA2813726A 2010-10-25 2010-10-25 Module photonique et procede de fabrication associe Abandoned CA2813726A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2010/053945 WO2012057731A1 (fr) 2010-10-25 2010-10-25 Module photonique et procédé de fabrication associé

Publications (1)

Publication Number Publication Date
CA2813726A1 true CA2813726A1 (fr) 2012-05-03

Family

ID=44170186

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2813726A Abandoned CA2813726A1 (fr) 2010-10-25 2010-10-25 Module photonique et procede de fabrication associe

Country Status (7)

Country Link
EP (1) EP2633550A1 (fr)
JP (1) JP2013545300A (fr)
CN (1) CN103180939A (fr)
AU (1) AU2010363044A1 (fr)
CA (1) CA2813726A1 (fr)
IL (1) IL225629A0 (fr)
WO (1) WO2012057731A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104966986A (zh) * 2015-06-30 2015-10-07 中国电子科技集团公司第十三研究所 激光器阵列装配指向性测试系统
US11237330B2 (en) * 2018-08-29 2022-02-01 Sumitomo Electric Optifrontier Co., Ltd. Optical fiber alignment jig, optical fiber fusion splicer equipped with optical fiber alignment jig, and method for aligning optical fiber
CN109994923A (zh) * 2019-03-26 2019-07-09 中国科学院半导体研究所 温度探测装置及其制作方法
CN110596675A (zh) * 2019-08-21 2019-12-20 深圳奥锐达科技有限公司 一种激光发射装置及激光雷达系统
CN114280500A (zh) * 2021-12-22 2022-04-05 深圳市迅飞凌科技有限公司 一种检测光模块金属外壳是否短路到内部电路的检测装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2616668B2 (ja) * 1993-08-30 1997-06-04 日本電気株式会社 光ファイバ導入部の気密封止構造
JP3596029B2 (ja) * 1994-06-06 2004-12-02 住友電気工業株式会社 半導体レーザモジュール
JP3592406B2 (ja) * 1995-07-10 2004-11-24 富士通株式会社 光モジュール及び光モジュールの製造方法
JP2001343560A (ja) * 2000-05-30 2001-12-14 Kyocera Corp 光モジュール
JP3896097B2 (ja) * 2003-06-27 2007-03-22 日本オプネクスト株式会社 レセプタクル型光モジュール

Also Published As

Publication number Publication date
IL225629A0 (en) 2013-06-27
WO2012057731A1 (fr) 2012-05-03
CN103180939A (zh) 2013-06-26
JP2013545300A (ja) 2013-12-19
EP2633550A1 (fr) 2013-09-04
AU2010363044A1 (en) 2013-05-02

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Legal Events

Date Code Title Description
FZDE Discontinued

Effective date: 20151027