IL225629A0 - Photonics module and method of manufacturing - Google Patents

Photonics module and method of manufacturing

Info

Publication number
IL225629A0
IL225629A0 IL225629A IL22562913A IL225629A0 IL 225629 A0 IL225629 A0 IL 225629A0 IL 225629 A IL225629 A IL 225629A IL 22562913 A IL22562913 A IL 22562913A IL 225629 A0 IL225629 A0 IL 225629A0
Authority
IL
Israel
Prior art keywords
manufacturing
photonics module
photonics
module
Prior art date
Application number
IL225629A
Other languages
Hebrew (he)
Original Assignee
Palomar Medical Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Palomar Medical Tech Inc filed Critical Palomar Medical Tech Inc
Publication of IL225629A0 publication Critical patent/IL225629A0/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
IL225629A 2010-10-25 2013-04-08 Photonics module and method of manufacturing IL225629A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2010/053945 WO2012057731A1 (en) 2010-10-25 2010-10-25 Photonics module and method of manufacturing

Publications (1)

Publication Number Publication Date
IL225629A0 true IL225629A0 (en) 2013-06-27

Family

ID=44170186

Family Applications (1)

Application Number Title Priority Date Filing Date
IL225629A IL225629A0 (en) 2010-10-25 2013-04-08 Photonics module and method of manufacturing

Country Status (7)

Country Link
EP (1) EP2633550A1 (en)
JP (1) JP2013545300A (en)
CN (1) CN103180939A (en)
AU (1) AU2010363044A1 (en)
CA (1) CA2813726A1 (en)
IL (1) IL225629A0 (en)
WO (1) WO2012057731A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104966986A (en) * 2015-06-30 2015-10-07 中国电子科技集团公司第十三研究所 Directive test system for assembling laser array
KR20210049819A (en) * 2018-08-29 2021-05-06 스미토모 덴코 옵티프론티어 가부시키가이샤 Optical fiber alignment jig, optical fiber fusion splicer equipped with optical fiber alignment jig, and optical fiber alignment method
CN109994923A (en) * 2019-03-26 2019-07-09 中国科学院半导体研究所 Temperature detection device and preparation method thereof
CN110596675A (en) * 2019-08-21 2019-12-20 深圳奥锐达科技有限公司 Laser emission device and laser radar system
CN114280500A (en) * 2021-12-22 2022-04-05 深圳市迅飞凌科技有限公司 Detection device for detecting whether metal shell of optical module is short-circuited to internal circuit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2616668B2 (en) * 1993-08-30 1997-06-04 日本電気株式会社 Hermetically sealed structure of optical fiber introduction section
JP3596029B2 (en) * 1994-06-06 2004-12-02 住友電気工業株式会社 Semiconductor laser module
JP3592406B2 (en) * 1995-07-10 2004-11-24 富士通株式会社 Optical module and method for manufacturing optical module
JP2001343560A (en) * 2000-05-30 2001-12-14 Kyocera Corp Optical module
JP3896097B2 (en) * 2003-06-27 2007-03-22 日本オプネクスト株式会社 Receptacle type optical module

Also Published As

Publication number Publication date
CA2813726A1 (en) 2012-05-03
AU2010363044A1 (en) 2013-05-02
CN103180939A (en) 2013-06-26
EP2633550A1 (en) 2013-09-04
JP2013545300A (en) 2013-12-19
WO2012057731A1 (en) 2012-05-03

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