CA2640960C - Refroidisseur dote d'un tube traverse par un fluide de refroidissement - Google Patents
Refroidisseur dote d'un tube traverse par un fluide de refroidissement Download PDFInfo
- Publication number
- CA2640960C CA2640960C CA2640960A CA2640960A CA2640960C CA 2640960 C CA2640960 C CA 2640960C CA 2640960 A CA2640960 A CA 2640960A CA 2640960 A CA2640960 A CA 2640960A CA 2640960 C CA2640960 C CA 2640960C
- Authority
- CA
- Canada
- Prior art keywords
- tube
- heat sink
- heat
- cooling medium
- corrugated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/22—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
- F28D1/0477—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being bent in a serpentine or zig-zag
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/08—Tubular elements crimped or corrugated in longitudinal section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006008033A DE102006008033A1 (de) | 2006-02-21 | 2006-02-21 | Kühlkörper mit von Kühlmittel durchströmtem Rohr |
DE102006008033.5 | 2006-02-21 | ||
PCT/EP2006/069241 WO2007096013A1 (fr) | 2006-02-21 | 2006-12-04 | Refroidisseur dote d'un tube traverse par un fluide de refroidissement |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2640960A1 CA2640960A1 (fr) | 2007-08-30 |
CA2640960C true CA2640960C (fr) | 2014-02-25 |
Family
ID=37837015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2640960A Expired - Fee Related CA2640960C (fr) | 2006-02-21 | 2006-12-04 | Refroidisseur dote d'un tube traverse par un fluide de refroidissement |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100155040A1 (fr) |
EP (1) | EP1987308A1 (fr) |
CN (1) | CN101379359B (fr) |
CA (1) | CA2640960C (fr) |
DE (1) | DE102006008033A1 (fr) |
WO (1) | WO2007096013A1 (fr) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007015859B4 (de) * | 2007-04-02 | 2009-02-19 | Reiner Dziadek | Wärmetauscher, einer Kühlanordnung mit dem Wärmetauscher, sowie dessen Verwendung und Kühlverfahren |
DE102007053561A1 (de) * | 2007-11-09 | 2008-08-28 | Siemens Ag | Kühlplatte |
DE102009012042B4 (de) | 2009-03-07 | 2011-01-05 | Esw Gmbh | Vorrichtung zur Kühlung von elektrischen oder elektronischen Bauteilen |
TW201217738A (en) * | 2010-10-22 | 2012-05-01 | Metal Ind Res & Dev Ct | wherein a conductive body is formed to closely integrate with the pipe piece and the object surface in order to achieve the practical purpose of dramatically enhancing the cooling/heating efficiency |
CN102280419A (zh) * | 2011-07-04 | 2011-12-14 | 遵义航天新力精密铸锻有限公司 | 一种大型电子设备用散热板及其制造方法 |
US9366046B1 (en) | 2014-12-19 | 2016-06-14 | Robert M. Rodrick | Apparatus and method for cooling swimming pool water |
US9551535B2 (en) | 2014-12-19 | 2017-01-24 | Robert M. Rodrick | Apparatus and method for cooling selected portions of swimming pool water |
CN108370129B (zh) | 2015-11-19 | 2020-09-18 | 恩耐公司 | 激光容错和自校准系统 |
WO2018044813A1 (fr) * | 2016-08-31 | 2018-03-08 | Nlight, Inc. | Système de refroidissement laser |
JP7087254B2 (ja) * | 2016-10-24 | 2022-06-21 | 富士通株式会社 | 電子機器 |
WO2018112220A1 (fr) | 2016-12-15 | 2018-06-21 | Nlight, Inc. | Mise sous boîtier de laser à fibre |
WO2019178003A1 (fr) | 2018-03-12 | 2019-09-19 | Nlight, Inc. | Laser à fibre ayant une fibre optique à enroulement variable |
US11573053B2 (en) * | 2019-08-13 | 2023-02-07 | General Electric Company | Cyclone cooler device |
CN114747002A (zh) * | 2019-12-06 | 2022-07-12 | 三菱电机株式会社 | 散热器以及散热器的制造方法 |
CN112944973A (zh) * | 2021-03-30 | 2021-06-11 | 中国农业大学 | 翅片式水体换热器及养殖池系统 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1913573A (en) * | 1932-01-11 | 1933-06-13 | John B Turner | Radiator |
US3853309A (en) * | 1972-03-20 | 1974-12-10 | C Widmer | Components using cast-in cooling tubes |
CN2113441U (zh) * | 1991-12-31 | 1992-08-19 | 云南航天工业总公司电冰箱厂 | 平背对流式冷凝器 |
US5287919A (en) * | 1992-09-29 | 1994-02-22 | Gas Research Institute | Heat exchanger |
US5297586A (en) * | 1993-03-16 | 1994-03-29 | Mcintosh Robert | Flexible metal hose assembly incorporating modified braid ring with annular member having tools flats |
JPH08110186A (ja) * | 1994-10-12 | 1996-04-30 | Yasuoka:Kk | 冷却用螺旋管とその製造方法及びその螺旋管を用いた冷却装置 |
JP3960486B2 (ja) * | 1995-09-21 | 2007-08-15 | 臼井国際産業株式会社 | Egrガス冷却装置 |
US6330980B1 (en) * | 1997-11-03 | 2001-12-18 | Joachim Fiedrich | Dry installation of a radiant floor or wall hydronic heating system, metal radiating plates that attach to the edges of side-by-side boards and provide metal slots for holding hot water tubing |
CN2314335Y (zh) * | 1997-11-18 | 1999-04-14 | 高府斌 | 换热器用环节波纹式金属管材 |
DE19845336A1 (de) * | 1998-10-01 | 2000-04-06 | Behr Gmbh & Co | Mehrkanal-Flachrohr |
US6942018B2 (en) * | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
US6679315B2 (en) * | 2002-01-14 | 2004-01-20 | Marconi Communications, Inc. | Small scale chip cooler assembly |
EP1382915A1 (fr) * | 2002-07-15 | 2004-01-21 | SULZER, Hans Dietrich | Element d'échangeur de chaleur et procédé de le fabriquer et procédé de le monter |
DE10393588T5 (de) * | 2002-11-01 | 2006-02-23 | Cooligy, Inc., Mountain View | Optimales Ausbreitungssystem, Vorrichtung und Verfahren für flüssigkeitsgekühlten, mikroskalierten Wärmetausch |
CN2602332Y (zh) * | 2003-03-06 | 2004-02-04 | 宁波广厦热力成套设备有限公司 | 螺旋波纹换热管 |
US7011150B2 (en) * | 2004-04-20 | 2006-03-14 | Tokyo Radiator Mfg. Co., Ltd. | Tube structure of multitubular heat exchanger |
GB2421457A (en) * | 2004-12-22 | 2006-06-28 | T I Group Automotive Systems L | A heat exchanger |
US20090294105A1 (en) * | 2005-03-22 | 2009-12-03 | Bharat Heavy Electricals Limited | Selectively Grooved Cold Plate for Electronics Cooling |
US7673389B2 (en) * | 2005-07-19 | 2010-03-09 | International Business Machines Corporation | Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component |
US20070090324A1 (en) * | 2005-10-21 | 2007-04-26 | Virgil Flanigan | Antifreeze/liquid coolant composition and method of use |
JP4619932B2 (ja) * | 2005-11-30 | 2011-01-26 | 本田技研工業株式会社 | 車体フレーム、ダイキャスト鋳造品、ダイキャスト鋳造品の金型、ダイキャスト鋳造方法 |
-
2006
- 2006-02-21 DE DE102006008033A patent/DE102006008033A1/de not_active Withdrawn
- 2006-12-04 EP EP06830307A patent/EP1987308A1/fr not_active Withdrawn
- 2006-12-04 CA CA2640960A patent/CA2640960C/fr not_active Expired - Fee Related
- 2006-12-04 US US12/223,993 patent/US20100155040A1/en not_active Abandoned
- 2006-12-04 CN CN200680053094.2A patent/CN101379359B/zh not_active Expired - Fee Related
- 2006-12-04 WO PCT/EP2006/069241 patent/WO2007096013A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN101379359B (zh) | 2011-06-08 |
WO2007096013A1 (fr) | 2007-08-30 |
CA2640960A1 (fr) | 2007-08-30 |
DE102006008033A1 (de) | 2007-09-06 |
CN101379359A (zh) | 2009-03-04 |
EP1987308A1 (fr) | 2008-11-05 |
US20100155040A1 (en) | 2010-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |
Effective date: 20191204 |