US20100155040A1 - Heat Sink Comprising a Tube Through Which Cooling Medium Flows - Google Patents

Heat Sink Comprising a Tube Through Which Cooling Medium Flows Download PDF

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Publication number
US20100155040A1
US20100155040A1 US12/223,993 US22399306A US2010155040A1 US 20100155040 A1 US20100155040 A1 US 20100155040A1 US 22399306 A US22399306 A US 22399306A US 2010155040 A1 US2010155040 A1 US 2010155040A1
Authority
US
United States
Prior art keywords
tube
heat sink
heat
cooling medium
corrugated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/223,993
Other languages
English (en)
Inventor
Ingolf Hoffmann
Hans Knauer
Wilhelm Reischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG Oesterreich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG Oesterreich filed Critical Siemens AG Oesterreich
Assigned to SIEMENS AG OSTERREICH reassignment SIEMENS AG OSTERREICH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RIESCHER, WILHEIM, HOFFMANN, INGOLF, KNAUER, HANS
Publication of US20100155040A1 publication Critical patent/US20100155040A1/en
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SIEMENS AG OSTERREICH
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/22—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
    • F28D1/0477—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being bent in a serpentine or zig-zag
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/08—Tubular elements crimped or corrugated in longitudinal section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Definitions

  • the invention relates to a heat sink comprising at least one tube through which cooling medium flows and which is surrounded by a heat-conducting material.
  • Heat sinks of said kind are used for example for cooling heat-generating components for whose operation an increase in the temperature of the ambient air is not desirable.
  • Examples of such components are snubber resistors, power semiconductors or electrolytic capacitors in power electronics.
  • the heat sink typically serves as a mount on which the electronic components are placed. The components are mounted onto the heat sink surface-to-surface with good thermal contact such that a transfer of heat takes place from the components onto the heat sink. At the same time this leads to the requirement for the heat to be dissipated as directly as possible to the cooling medium. If that is the case, the components exhibit very good thermal resistance and only a slight heating of the respective component environment takes place in the heat sink.
  • a closed circuit is usually provided in which the cooling medium is circulated by means of a pump and cooled down by way of a heat exchanger.
  • the aim is to keep the amount of cooling medium small in order to ensure a maximum ratio of cooling performance to device volume.
  • Effort is directed at achieving good heat transfer between heat sink and cooling medium in order to optimize cooling performance. According to the prior art turbulating elements are for that reason arranged inside the tubes in order to ensure a turbulent flow. A laminar flow is disadvantageous due to the low heat transfer coefficient.
  • Turbulating elements of the aforesaid kind often result in the formation inside the tubes of zones within which small amounts of cooling medium circulate or within which low flow velocities arise. This leads over time to the accumulation of waste products and residues which are precipitated from the cooling medium and adhere to the tube inner wall and the turbulating elements. The consequence of this is deterioration in heat transfer efficiency together with an increase in flow resistance which may ultimately lead to a complete blockage of the tube.
  • An object underlying the present invention is to specify an improvement over the prior art for a heat sink of the type cited in the introduction.
  • a heat sink comprising at least one tube through which cooling medium flows and which is surrounded by a heat-conducting material, wherein the tube wall of the at least one tube is corrugated in the flow direction.
  • the corrugated embodiment has the advantage that the transition from laminar to turbulent flow takes place at a lower flow velocity compared to a straight-walled tube. Turbulating elements are then no longer necessary. Furthermore the heat transfer area is greater for the same tube length compared to a straight-walled tube, as a result of which more heat is dissipated to the cooling medium.
  • the at least one tube is embodied as a corrugated tube with parallel corrugations.
  • Corrugated tubes of said kind are available in different materials at affordable cost.
  • the parallel corrugation has the advantage that a tube can easily be bent.
  • a further advantageous embodiment is provided if the at least one tube is embodied as a spiral tube with spiral corrugations.
  • a tube of said kind combines the advantages of a corrugated tube with a simple means of connecting to connector fittings which have suitable internal threads and are screwed onto the ends of the spiral tube without additional preparatory work. Furthermore a better purging effect for evacuating possible cooling medium waste products is achieved in a spiral tube.
  • the at least one tube is manufactured from corrosion-resistant high-grade steel or copper.
  • high-grade steel With high-grade steel, a long useful life of the heat sink is assured even if the cooling medium contains corrosion-promoting substances.
  • the use of copper is also advantageous, since its thermal conductivity is superior to high-grade steel.
  • the at least one tube is formed from the heat-conducting material as a tubular cavity.
  • a casting core having the shape of the corrugated tube inner wall is placed in a casting mold.
  • a cavity having the shape of the casting core is then embodied in the cast body made of heat-conducting material.
  • a further possibility consists in embodying the heat sink in two parts with a mold seam defined by the central axis of the tube. Chip-removing machining methods are then used to produce the tubular cavity in such a way that a corrugated channel is hollowed out in each half of the heat sink. When the heat sink is assembled, these two channels form the tubular cavity.
  • the heat sink has an essentially plate-shaped geometry.
  • the heat sink is then easy to manufacture and has a flat mounting surface for affixing heat-dissipating components.
  • the arrangement of the at least one tube if said tube is arranged in a meander shape.
  • the tube then forms a plurality of cooling coils within the heat sink, thereby producing a more effective dissipation of heat to the cooling medium. Furthermore, sufficient space for mounting holes remains between the cooling coils.
  • the at least one tube is arranged in a spiral shape.
  • the tube is embodied e.g. in the center of the spiral with a semicircular arc, such that two tube sections running in parallel are brought out in a spiral shape and provided with connector fittings at the edge of the heat sink.
  • this provides a sufficient tube length within the heat sink for good heat dissipation to the cooling medium.
  • a water/antifreeze mixture is provided as the cooling medium.
  • a mixture of said kind is not only readily available but is also suitable for a frostproof application of the heat sink.
  • FIG. 1 a front view and side view of a heat sink
  • FIG. 2 a longitudinal cross-section of a corrugated tube
  • FIG. 3 a longitudinal cross-section of a spiral tube
  • FIG. 1 shows an exemplary embodiment of a heat sink comprising a tube 2 arranged in a meander shape, wherein the tube wall is corrugated in the flow direction.
  • the tube has connector fittings 3 , 4 at its ends, with cooling medium that has been cooled being pumped into the heat sink by way of a first connector fitting 3 .
  • the tube 2 forms a plurality of cooling coils with semicircles being arranged between straight tube sections such that the straight successive tube sections run parallel to one another.
  • the alignment of the tube sections running parallel to one another can be changed here within the heat sink, resulting in an adjustment to the position and heat dissipation of the components arranged on the heat sink.
  • Components exhibiting a higher heat dissipation are therein arranged directly over one or more tube sections, whereas components exhibiting lower heat dissipation can also be placed in zones between two tube sections.
  • the cooling medium When flowing through the tube 2 arranged within the heat sink, the cooling medium absorbs heat and flows out of the heat sink by way of a second connector fitting 4 , usually via a pump to a heat exchanger by means of which the cooling medium is cooled down.
  • the tube 2 is embodied by way of example as a corrugated tube made of corrosion-resistant high-grade steel. It is also possible to equip a heat sink with a plurality of tubes 2 and in this way provide a plurality of cooling circuits. In this case each cooling circuit can have its own particular temperature level and its own particular flow velocity, thereby ensuring an optimal matching to the cooling requirements of the components mounted on the heat sink.
  • the tube 2 is meander-shaped in one plane and cast in a heat-conducting material ( 1 ), aluminum for example. Thus, only the ends of the tube 2 with the connector fittings 4 , 5 project from the heat-conducting material ( 1 ).
  • Drilled holes 5 are provided in the zones between the parallel tube sections and serve as mounting holes for installing components.
  • the heat sink itself can also be mounted on an appropriate support by means of the drilled holes 5 .
  • the heat sink In order to determine the optimal cooling conditions it makes sense to carry out empirical tests with different tube arrangements, wherein the heat sink is initially uniformly heated in a test setup and then cooled down through circulation of a cooling medium. During the cooling-down process the change in temperature is measured as a function of time and the position on the heat sink surface. The placement of the individual components on the heat sink is subsequently carried out on the basis of these measurement results.
  • the pressure loss per tube length unit as a function of the volume flow rate follows a parabolic profile, i.e. the pressure loss per tube length unit increases continuously more sharply as the volume flow rate increases. At the same time the scale of this increase is magnified as the diameter of the tube becomes smaller.
  • the optimal tuning of the individual variables is performed either empirically using tests, through simulation or by means of fluidic calculations. The optimum balance is then attained when the maximum heat extraction of the heat sink is achieved with the minimum supply of energy (for a circulating pump and other units).
  • corrugated and spiral tubes are usually published by the manufacturers of such tubes (e.g. Water Way Engineering GmbH, D-47441 Moers, Germany).
  • FIG. 2 shows a tube 2 embodied as a corrugated tube in longitudinal cross-section, with the individual corrugations running axially symmetrically.
  • a tube 2 embodied as a spiral tube is shown in longitudinal cross-section. In this case the corrugations run in a helical line around the central axis of the tube 2 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
US12/223,993 2006-02-21 2006-12-04 Heat Sink Comprising a Tube Through Which Cooling Medium Flows Abandoned US20100155040A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006008033A DE102006008033A1 (de) 2006-02-21 2006-02-21 Kühlkörper mit von Kühlmittel durchströmtem Rohr
DE102006008033.5 2006-02-21
PCT/EP2006/069241 WO2007096013A1 (fr) 2006-02-21 2006-12-04 Refroidisseur dote d'un tube traverse par un fluide de refroidissement

Publications (1)

Publication Number Publication Date
US20100155040A1 true US20100155040A1 (en) 2010-06-24

Family

ID=37837015

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/223,993 Abandoned US20100155040A1 (en) 2006-02-21 2006-12-04 Heat Sink Comprising a Tube Through Which Cooling Medium Flows

Country Status (6)

Country Link
US (1) US20100155040A1 (fr)
EP (1) EP1987308A1 (fr)
CN (1) CN101379359B (fr)
CA (1) CA2640960C (fr)
DE (1) DE102006008033A1 (fr)
WO (1) WO2007096013A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9366046B1 (en) 2014-12-19 2016-06-14 Robert M. Rodrick Apparatus and method for cooling swimming pool water
US9551535B2 (en) 2014-12-19 2017-01-24 Robert M. Rodrick Apparatus and method for cooling selected portions of swimming pool water
WO2018044813A1 (fr) * 2016-08-31 2018-03-08 Nlight, Inc. Système de refroidissement laser
US20180116075A1 (en) * 2016-10-24 2018-04-26 Fujitsu Limited Electronic device
US10447004B2 (en) 2015-11-19 2019-10-15 Nlight, Inc. Laser fault tolerance and self-calibration system
US10574020B2 (en) 2016-12-15 2020-02-25 Nlight, Inc. Fiber laser packaging
US10784645B2 (en) 2018-03-12 2020-09-22 Nlight, Inc. Fiber laser having variably wound optical fiber
CN114747002A (zh) * 2019-12-06 2022-07-12 三菱电机株式会社 散热器以及散热器的制造方法
US11573053B2 (en) * 2019-08-13 2023-02-07 General Electric Company Cyclone cooler device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007015859B4 (de) * 2007-04-02 2009-02-19 Reiner Dziadek Wärmetauscher, einer Kühlanordnung mit dem Wärmetauscher, sowie dessen Verwendung und Kühlverfahren
DE102007053561A1 (de) * 2007-11-09 2008-08-28 Siemens Ag Kühlplatte
DE102009012042B4 (de) 2009-03-07 2011-01-05 Esw Gmbh Vorrichtung zur Kühlung von elektrischen oder elektronischen Bauteilen
TW201217738A (en) * 2010-10-22 2012-05-01 Metal Ind Res & Dev Ct wherein a conductive body is formed to closely integrate with the pipe piece and the object surface in order to achieve the practical purpose of dramatically enhancing the cooling/heating efficiency
CN102280419A (zh) * 2011-07-04 2011-12-14 遵义航天新力精密铸锻有限公司 一种大型电子设备用散热板及其制造方法
CN112944973A (zh) * 2021-03-30 2021-06-11 中国农业大学 翅片式水体换热器及养殖池系统

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1913573A (en) * 1932-01-11 1933-06-13 John B Turner Radiator
US3853309A (en) * 1972-03-20 1974-12-10 C Widmer Components using cast-in cooling tubes
US5287919A (en) * 1992-09-29 1994-02-22 Gas Research Institute Heat exchanger
US5297586A (en) * 1993-03-16 1994-03-29 Mcintosh Robert Flexible metal hose assembly incorporating modified braid ring with annular member having tools flats
US6330980B1 (en) * 1997-11-03 2001-12-18 Joachim Fiedrich Dry installation of a radiant floor or wall hydronic heating system, metal radiating plates that attach to the edges of side-by-side boards and provide metal slots for holding hot water tubing
US6357522B2 (en) * 1998-10-01 2002-03-19 Behr Gmbh & Co. Multi-channel flat tube
US20030131972A1 (en) * 2002-01-14 2003-07-17 Cosley Michael R. Small scale chip cooler assembly
US20040188064A1 (en) * 2002-11-01 2004-09-30 Cooligy Inc. Channeled flat plate fin heat exchange system, device and method
US7011150B2 (en) * 2004-04-20 2006-03-14 Tokyo Radiator Mfg. Co., Ltd. Tube structure of multitubular heat exchanger
US7131486B2 (en) * 2001-09-28 2006-11-07 The Board Of Trustees Of The Leland Stanford Junior Universty Electroosmotic microchannel cooling system
US20070017658A1 (en) * 2005-07-19 2007-01-25 International Business Machines Corporation Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component
US20070090324A1 (en) * 2005-10-21 2007-04-26 Virgil Flanigan Antifreeze/liquid coolant composition and method of use
US20090266105A1 (en) * 2004-12-22 2009-10-29 Bundy Refrigeration International Holdings B.V. heat exchanger
US20090294105A1 (en) * 2005-03-22 2009-12-03 Bharat Heavy Electricals Limited Selectively Grooved Cold Plate for Electronics Cooling
US7658005B2 (en) * 2002-07-15 2010-02-09 Hans-Dietrich Sulzer Method for producing heat exchanger elements, heat exchanger elements and method for assembling such elements
US7726382B2 (en) * 2005-11-30 2010-06-01 Honda Motor Co., Ltd. Vehicle body frame, die-cast product, mold for die-cast product and die-cast method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2113441U (zh) * 1991-12-31 1992-08-19 云南航天工业总公司电冰箱厂 平背对流式冷凝器
JPH08110186A (ja) * 1994-10-12 1996-04-30 Yasuoka:Kk 冷却用螺旋管とその製造方法及びその螺旋管を用いた冷却装置
JP3960486B2 (ja) * 1995-09-21 2007-08-15 臼井国際産業株式会社 Ｅｇｒガス冷却装置
CN2314335Y (zh) * 1997-11-18 1999-04-14 高府斌 换热器用环节波纹式金属管材
CN2602332Y (zh) * 2003-03-06 2004-02-04 宁波广厦热力成套设备有限公司 螺旋波纹换热管

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1913573A (en) * 1932-01-11 1933-06-13 John B Turner Radiator
US3853309A (en) * 1972-03-20 1974-12-10 C Widmer Components using cast-in cooling tubes
US5287919A (en) * 1992-09-29 1994-02-22 Gas Research Institute Heat exchanger
US5297586A (en) * 1993-03-16 1994-03-29 Mcintosh Robert Flexible metal hose assembly incorporating modified braid ring with annular member having tools flats
US6330980B1 (en) * 1997-11-03 2001-12-18 Joachim Fiedrich Dry installation of a radiant floor or wall hydronic heating system, metal radiating plates that attach to the edges of side-by-side boards and provide metal slots for holding hot water tubing
US6357522B2 (en) * 1998-10-01 2002-03-19 Behr Gmbh & Co. Multi-channel flat tube
US7131486B2 (en) * 2001-09-28 2006-11-07 The Board Of Trustees Of The Leland Stanford Junior Universty Electroosmotic microchannel cooling system
US20030131972A1 (en) * 2002-01-14 2003-07-17 Cosley Michael R. Small scale chip cooler assembly
US7658005B2 (en) * 2002-07-15 2010-02-09 Hans-Dietrich Sulzer Method for producing heat exchanger elements, heat exchanger elements and method for assembling such elements
US20040188064A1 (en) * 2002-11-01 2004-09-30 Cooligy Inc. Channeled flat plate fin heat exchange system, device and method
US7011150B2 (en) * 2004-04-20 2006-03-14 Tokyo Radiator Mfg. Co., Ltd. Tube structure of multitubular heat exchanger
US20090266105A1 (en) * 2004-12-22 2009-10-29 Bundy Refrigeration International Holdings B.V. heat exchanger
US20090294105A1 (en) * 2005-03-22 2009-12-03 Bharat Heavy Electricals Limited Selectively Grooved Cold Plate for Electronics Cooling
US20070017658A1 (en) * 2005-07-19 2007-01-25 International Business Machines Corporation Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component
US20070090324A1 (en) * 2005-10-21 2007-04-26 Virgil Flanigan Antifreeze/liquid coolant composition and method of use
US7726382B2 (en) * 2005-11-30 2010-06-01 Honda Motor Co., Ltd. Vehicle body frame, die-cast product, mold for die-cast product and die-cast method

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9366046B1 (en) 2014-12-19 2016-06-14 Robert M. Rodrick Apparatus and method for cooling swimming pool water
US9551535B2 (en) 2014-12-19 2017-01-24 Robert M. Rodrick Apparatus and method for cooling selected portions of swimming pool water
US10447004B2 (en) 2015-11-19 2019-10-15 Nlight, Inc. Laser fault tolerance and self-calibration system
WO2018044813A1 (fr) * 2016-08-31 2018-03-08 Nlight, Inc. Système de refroidissement laser
US11025034B2 (en) 2016-08-31 2021-06-01 Nlight, Inc. Laser cooling system
US20180116075A1 (en) * 2016-10-24 2018-04-26 Fujitsu Limited Electronic device
US11129304B2 (en) * 2016-10-24 2021-09-21 Fujitsu Limited Electronic device
US10574020B2 (en) 2016-12-15 2020-02-25 Nlight, Inc. Fiber laser packaging
US10784645B2 (en) 2018-03-12 2020-09-22 Nlight, Inc. Fiber laser having variably wound optical fiber
US11573053B2 (en) * 2019-08-13 2023-02-07 General Electric Company Cyclone cooler device
CN114747002A (zh) * 2019-12-06 2022-07-12 三菱电机株式会社 散热器以及散热器的制造方法
US20220346270A1 (en) * 2019-12-06 2022-10-27 Mitsubishi Electric Corporation Heat sink and sink manufacturing method

Also Published As

Publication number Publication date
CA2640960C (fr) 2014-02-25
DE102006008033A1 (de) 2007-09-06
CA2640960A1 (fr) 2007-08-30
EP1987308A1 (fr) 2008-11-05
CN101379359A (zh) 2009-03-04
CN101379359B (zh) 2011-06-08
WO2007096013A1 (fr) 2007-08-30

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