CA2453338A1 - Sheet for sealing electric wiring - Google Patents

Sheet for sealing electric wiring Download PDF

Info

Publication number
CA2453338A1
CA2453338A1 CA002453338A CA2453338A CA2453338A1 CA 2453338 A1 CA2453338 A1 CA 2453338A1 CA 002453338 A CA002453338 A CA 002453338A CA 2453338 A CA2453338 A CA 2453338A CA 2453338 A1 CA2453338 A1 CA 2453338A1
Authority
CA
Canada
Prior art keywords
bus
resin
sealing
sheet
thermocurable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002453338A
Other languages
English (en)
French (fr)
Inventor
Kohichiro Kawate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2453338A1 publication Critical patent/CA2453338A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Insulating Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
CA002453338A 2001-08-07 2002-08-06 Sheet for sealing electric wiring Abandoned CA2453338A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-239204 2001-08-07
JP2001239204A JP2003059363A (ja) 2001-08-07 2001-08-07 電気配線封止用シート
PCT/US2002/024789 WO2003015166A2 (en) 2001-08-07 2002-08-06 Sheet for sealing electric wiring

Publications (1)

Publication Number Publication Date
CA2453338A1 true CA2453338A1 (en) 2003-02-20

Family

ID=19069988

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002453338A Abandoned CA2453338A1 (en) 2001-08-07 2002-08-06 Sheet for sealing electric wiring

Country Status (7)

Country Link
EP (1) EP1415343A2 (zh)
JP (1) JP2003059363A (zh)
CN (1) CN1327518C (zh)
BR (1) BR0211509A (zh)
CA (1) CA2453338A1 (zh)
MX (1) MXPA04000893A (zh)
WO (1) WO2003015166A2 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2428537A1 (de) * 2010-09-13 2012-03-14 Sika Technology AG Abdichtungsmembran mit verbesserter Haftung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB902567A (en) * 1958-02-06 1962-08-01 Reyrolle A & Co Ltd Improvements relating to elongated electrical conductors embedded in cast resin solid insulation
JPH05315473A (ja) * 1992-05-06 1993-11-26 Nitto Denko Corp 半導体装置
JP2000049275A (ja) * 1998-07-28 2000-02-18 Hitachi Ltd リードフレームおよびそれを用いた半導体装置ならびにその製造方法
CN2458701Y (zh) * 2001-01-02 2001-11-07 山东省金曼克电气集团股份有限公司 大中型干式变压器低压封闭型出线装置

Also Published As

Publication number Publication date
WO2003015166A2 (en) 2003-02-20
MXPA04000893A (es) 2004-06-03
EP1415343A2 (en) 2004-05-06
CN1327518C (zh) 2007-07-18
WO2003015166A3 (en) 2003-10-16
JP2003059363A (ja) 2003-02-28
BR0211509A (pt) 2004-09-14
CN1572022A (zh) 2005-01-26

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CA2453338A1 (en) Sheet for sealing electric wiring

Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued