BR0211509A - Folha e processo para a preparação de uma folha para a vedação de pelo menos uma barra de ligação, processo para a vedação de uma barra de ligação, e, circuito elétrico - Google Patents

Folha e processo para a preparação de uma folha para a vedação de pelo menos uma barra de ligação, processo para a vedação de uma barra de ligação, e, circuito elétrico

Info

Publication number
BR0211509A
BR0211509A BR0211509-3A BR0211509A BR0211509A BR 0211509 A BR0211509 A BR 0211509A BR 0211509 A BR0211509 A BR 0211509A BR 0211509 A BR0211509 A BR 0211509A
Authority
BR
Brazil
Prior art keywords
sheet
sealing
tie bar
preparing
electrical circuit
Prior art date
Application number
BR0211509-3A
Other languages
English (en)
Portuguese (pt)
Inventor
Kohichiro Kawate
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BR0211509A publication Critical patent/BR0211509A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Insulating Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
BR0211509-3A 2001-08-07 2002-08-06 Folha e processo para a preparação de uma folha para a vedação de pelo menos uma barra de ligação, processo para a vedação de uma barra de ligação, e, circuito elétrico BR0211509A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001239204A JP2003059363A (ja) 2001-08-07 2001-08-07 電気配線封止用シート
PCT/US2002/024789 WO2003015166A2 (en) 2001-08-07 2002-08-06 Sheet for sealing electric wiring

Publications (1)

Publication Number Publication Date
BR0211509A true BR0211509A (pt) 2004-09-14

Family

ID=19069988

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0211509-3A BR0211509A (pt) 2001-08-07 2002-08-06 Folha e processo para a preparação de uma folha para a vedação de pelo menos uma barra de ligação, processo para a vedação de uma barra de ligação, e, circuito elétrico

Country Status (7)

Country Link
EP (1) EP1415343A2 (zh)
JP (1) JP2003059363A (zh)
CN (1) CN1327518C (zh)
BR (1) BR0211509A (zh)
CA (1) CA2453338A1 (zh)
MX (1) MXPA04000893A (zh)
WO (1) WO2003015166A2 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2428537A1 (de) * 2010-09-13 2012-03-14 Sika Technology AG Abdichtungsmembran mit verbesserter Haftung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB902567A (en) * 1958-02-06 1962-08-01 Reyrolle A & Co Ltd Improvements relating to elongated electrical conductors embedded in cast resin solid insulation
JPH05315473A (ja) * 1992-05-06 1993-11-26 Nitto Denko Corp 半導体装置
JP2000049275A (ja) * 1998-07-28 2000-02-18 Hitachi Ltd リードフレームおよびそれを用いた半導体装置ならびにその製造方法
CN2458701Y (zh) * 2001-01-02 2001-11-07 山东省金曼克电气集团股份有限公司 大中型干式变压器低压封闭型出线装置

Also Published As

Publication number Publication date
WO2003015166A2 (en) 2003-02-20
MXPA04000893A (es) 2004-06-03
EP1415343A2 (en) 2004-05-06
CA2453338A1 (en) 2003-02-20
CN1327518C (zh) 2007-07-18
WO2003015166A3 (en) 2003-10-16
JP2003059363A (ja) 2003-02-28
CN1572022A (zh) 2005-01-26

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A E 9A A NUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2108 DE 31/05/2011.