CA2374004A1 - Method of modifying a surface of a structured wafer - Google Patents
Method of modifying a surface of a structured wafer Download PDFInfo
- Publication number
- CA2374004A1 CA2374004A1 CA002374004A CA2374004A CA2374004A1 CA 2374004 A1 CA2374004 A1 CA 2374004A1 CA 002374004 A CA002374004 A CA 002374004A CA 2374004 A CA2374004 A CA 2374004A CA 2374004 A1 CA2374004 A1 CA 2374004A1
- Authority
- CA
- Canada
- Prior art keywords
- abrasive
- wafer
- phase
- abrasive article
- phase separated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 71
- 229920000642 polymer Polymers 0.000 claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000002002 slurry Substances 0.000 claims abstract description 13
- 239000002131 composite material Substances 0.000 claims description 40
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 28
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 17
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical group C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 16
- 229920001400 block copolymer Polymers 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims description 3
- 229920000359 diblock copolymer Polymers 0.000 claims description 2
- 229920003046 tetrablock copolymer Polymers 0.000 claims description 2
- 230000002708 enhancing effect Effects 0.000 claims 1
- 229920006254 polymer film Polymers 0.000 claims 1
- 229920000428 triblock copolymer Polymers 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 102
- 230000008569 process Effects 0.000 description 37
- 229910052751 metal Inorganic materials 0.000 description 36
- 239000010410 layer Substances 0.000 description 35
- 239000002184 metal Substances 0.000 description 35
- 239000004065 semiconductor Substances 0.000 description 23
- 239000007788 liquid Substances 0.000 description 20
- 238000005498 polishing Methods 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000012360 testing method Methods 0.000 description 15
- 239000010949 copper Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 9
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 7
- 239000003989 dielectric material Substances 0.000 description 7
- 229920002633 Kraton (polymer) Polymers 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000004049 embossing Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- -1 e.g. Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 235000019589 hardness Nutrition 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 108700015862 A-B-A triblock copolymer Proteins 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000001246 colloidal dispersion Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007613 slurry method Methods 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000807 solvent casting Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 238000006277 sulfonation reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/328,916 | 1999-06-09 | ||
| US09/328,916 US6234875B1 (en) | 1999-06-09 | 1999-06-09 | Method of modifying a surface |
| PCT/US1999/024445 WO2000074896A1 (en) | 1999-06-09 | 1999-10-18 | Method of modifying a surface of a structured wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2374004A1 true CA2374004A1 (en) | 2000-12-14 |
Family
ID=23283024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002374004A Abandoned CA2374004A1 (en) | 1999-06-09 | 1999-10-18 | Method of modifying a surface of a structured wafer |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US6234875B1 (enExample) |
| EP (1) | EP1189729B1 (enExample) |
| JP (1) | JP2003501820A (enExample) |
| KR (1) | KR100638289B1 (enExample) |
| CN (1) | CN1352589A (enExample) |
| AT (1) | ATE272465T1 (enExample) |
| AU (1) | AU1317500A (enExample) |
| BR (1) | BR9917355A (enExample) |
| CA (1) | CA2374004A1 (enExample) |
| DE (1) | DE69919230T2 (enExample) |
| ES (1) | ES2224717T3 (enExample) |
| HK (1) | HK1044504B (enExample) |
| TW (1) | TWI231245B (enExample) |
| WO (1) | WO2000074896A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009009870A1 (en) * | 2007-07-13 | 2009-01-22 | UNIVERSITé LAVAL | Thermoformable ultrasonic machining tool and method |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6390890B1 (en) | 1999-02-06 | 2002-05-21 | Charles J Molnar | Finishing semiconductor wafers with a fixed abrasive finishing element |
| US6413153B1 (en) | 1999-04-26 | 2002-07-02 | Beaver Creek Concepts Inc | Finishing element including discrete finishing members |
| US6641463B1 (en) | 1999-02-06 | 2003-11-04 | Beaver Creek Concepts Inc | Finishing components and elements |
| TW501197B (en) * | 1999-08-17 | 2002-09-01 | Hitachi Chemical Co Ltd | Polishing compound for chemical mechanical polishing and method for polishing substrate |
| US7736687B2 (en) * | 2006-01-31 | 2010-06-15 | Advance Bio Prosthetic Surfaces, Ltd. | Methods of making medical devices |
| US6976905B1 (en) * | 2000-06-16 | 2005-12-20 | Cabot Microelectronics Corporation | Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system |
| KR100905266B1 (ko) * | 2000-12-01 | 2009-06-29 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
| US6572463B1 (en) * | 2000-12-27 | 2003-06-03 | Lam Research Corp. | Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same |
| US6561889B1 (en) | 2000-12-27 | 2003-05-13 | Lam Research Corporation | Methods for making reinforced wafer polishing pads and apparatuses implementing the same |
| US6612916B2 (en) * | 2001-01-08 | 2003-09-02 | 3M Innovative Properties Company | Article suitable for chemical mechanical planarization processes |
| US6612917B2 (en) * | 2001-02-07 | 2003-09-02 | 3M Innovative Properties Company | Abrasive article suitable for modifying a semiconductor wafer |
| US6632129B2 (en) | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
| US6627550B2 (en) * | 2001-03-27 | 2003-09-30 | Micron Technology, Inc. | Post-planarization clean-up |
| US6629879B1 (en) * | 2001-05-08 | 2003-10-07 | Advanced Micro Devices, Inc. | Method of controlling barrier metal polishing processes based upon X-ray fluorescence measurements |
| US6811470B2 (en) | 2001-07-16 | 2004-11-02 | Applied Materials Inc. | Methods and compositions for chemical mechanical polishing shallow trench isolation substrates |
| US7199056B2 (en) * | 2002-02-08 | 2007-04-03 | Applied Materials, Inc. | Low cost and low dishing slurry for polysilicon CMP |
| US6943114B2 (en) * | 2002-02-28 | 2005-09-13 | Infineon Technologies Ag | Integration scheme for metal gap fill, with fixed abrasive CMP |
| US7063597B2 (en) | 2002-10-25 | 2006-06-20 | Applied Materials | Polishing processes for shallow trench isolation substrates |
| CN100551623C (zh) | 2003-01-10 | 2009-10-21 | 3M创新有限公司 | 应用于化学机械平面化的垫结构 |
| US6908366B2 (en) * | 2003-01-10 | 2005-06-21 | 3M Innovative Properties Company | Method of using a soft subpad for chemical mechanical polishing |
| US6951504B2 (en) * | 2003-03-20 | 2005-10-04 | 3M Innovative Properties Company | Abrasive article with agglomerates and method of use |
| WO2005000529A1 (en) * | 2003-06-03 | 2005-01-06 | Neopad Technologies Corporation | Synthesis of a functionally graded pad for chemical mechanical planarization |
| DE602005006326T2 (de) * | 2004-02-05 | 2009-07-09 | Jsr Corp. | Chemisch-mechanisches Polierkissen und Polierverfahren |
| US7086939B2 (en) * | 2004-03-19 | 2006-08-08 | Saint-Gobain Performance Plastics Corporation | Chemical mechanical polishing retaining ring with integral polymer backing |
| US7485028B2 (en) | 2004-03-19 | 2009-02-03 | Saint-Gobain Performance Plastics Corporation | Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same |
| US20050252547A1 (en) * | 2004-05-11 | 2005-11-17 | Applied Materials, Inc. | Methods and apparatus for liquid chemical delivery |
| US20050282029A1 (en) * | 2004-06-18 | 2005-12-22 | 3M Innovative Properties Company | Polymerizable composition and articles therefrom |
| US7150770B2 (en) * | 2004-06-18 | 2006-12-19 | 3M Innovative Properties Company | Coated abrasive article with tie layer, and method of making and using the same |
| US7150771B2 (en) * | 2004-06-18 | 2006-12-19 | 3M Innovative Properties Company | Coated abrasive article with composite tie layer, and method of making and using the same |
| US20060088976A1 (en) * | 2004-10-22 | 2006-04-27 | Applied Materials, Inc. | Methods and compositions for chemical mechanical polishing substrates |
| US7344575B2 (en) * | 2005-06-27 | 2008-03-18 | 3M Innovative Properties Company | Composition, treated backing, and abrasive articles containing the same |
| US7344574B2 (en) * | 2005-06-27 | 2008-03-18 | 3M Innovative Properties Company | Coated abrasive article, and method of making and using the same |
| TWI292185B (en) * | 2005-07-11 | 2008-01-01 | Fujitsu Ltd | Manufacture of semiconductor device with cmp |
| US20090215266A1 (en) * | 2008-02-22 | 2009-08-27 | Thomas Terence M | Polishing Copper-Containing patterned wafers |
| DE102009025242B4 (de) * | 2009-06-17 | 2013-05-23 | Siltronic Ag | Verfahren zum beidseitigen chemischen Schleifen einer Halbleiterscheibe |
| DE102009033206A1 (de) * | 2009-07-15 | 2011-01-27 | Brand, Guido | Polierverfahren und Poliervorrichtung zur Korrektur von geometrischen Abweichungsfehlern auf Präzisionsoberflächen |
| RU2590749C2 (ru) * | 2011-01-22 | 2016-07-10 | Руд. Старке Гмбх Унд Ко. Кг | Шлифовальник |
| JP5934053B2 (ja) * | 2012-08-14 | 2016-06-15 | セイコープレシジョン株式会社 | Ｘ線処理装置 |
| KR102347711B1 (ko) | 2014-04-03 | 2022-01-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법 |
| TWI769988B (zh) | 2015-10-07 | 2022-07-11 | 美商3M新設資產公司 | 拋光墊與系統及其製造與使用方法 |
| CN111087973B (zh) * | 2019-12-17 | 2021-07-27 | 吉林大学 | 一种植物纤维发酵改性增强摩擦材料制备装置及制备方法 |
| US20230347470A1 (en) * | 2022-04-28 | 2023-11-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Pad for chemical mechanical polishing |
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- 1999-06-09 US US09/328,916 patent/US6234875B1/en not_active Expired - Lifetime
- 1999-10-18 BR BR9917355-7A patent/BR9917355A/pt active Search and Examination
- 1999-10-18 WO PCT/US1999/024445 patent/WO2000074896A1/en not_active Ceased
- 1999-10-18 CA CA002374004A patent/CA2374004A1/en not_active Abandoned
- 1999-10-18 AU AU13175/00A patent/AU1317500A/en not_active Abandoned
- 1999-10-18 DE DE69919230T patent/DE69919230T2/de not_active Expired - Fee Related
- 1999-10-18 CN CN99816713A patent/CN1352589A/zh active Pending
- 1999-10-18 AT AT99956604T patent/ATE272465T1/de not_active IP Right Cessation
- 1999-10-18 KR KR1020017015751A patent/KR100638289B1/ko not_active Expired - Fee Related
- 1999-10-18 HK HK02106259.1A patent/HK1044504B/en not_active IP Right Cessation
- 1999-10-18 ES ES99956604T patent/ES2224717T3/es not_active Expired - Lifetime
- 1999-10-18 EP EP99956604A patent/EP1189729B1/en not_active Expired - Lifetime
- 1999-10-18 JP JP2001501410A patent/JP2003501820A/ja active Pending
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2000
- 2000-05-30 TW TW089110529A patent/TWI231245B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009009870A1 (en) * | 2007-07-13 | 2009-01-22 | UNIVERSITé LAVAL | Thermoformable ultrasonic machining tool and method |
| US8016644B2 (en) | 2007-07-13 | 2011-09-13 | UNIVERSITé LAVAL | Method and apparatus for micro-machining a surface |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20020011435A (ko) | 2002-02-08 |
| JP2003501820A (ja) | 2003-01-14 |
| CN1352589A (zh) | 2002-06-05 |
| AU1317500A (en) | 2000-12-28 |
| US6234875B1 (en) | 2001-05-22 |
| KR100638289B1 (ko) | 2006-10-26 |
| EP1189729A1 (en) | 2002-03-27 |
| BR9917355A (pt) | 2002-02-26 |
| WO2000074896A8 (en) | 2001-03-29 |
| DE69919230T2 (de) | 2005-08-04 |
| EP1189729B1 (en) | 2004-08-04 |
| WO2000074896A1 (en) | 2000-12-14 |
| ATE272465T1 (de) | 2004-08-15 |
| HK1044504B (en) | 2005-06-30 |
| DE69919230D1 (de) | 2004-09-09 |
| TWI231245B (en) | 2005-04-21 |
| HK1044504A1 (en) | 2002-10-25 |
| ES2224717T3 (es) | 2005-03-01 |
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