CA2364564A1 - Detecteur de court-circuit sur carte imprimee au moyen d'une camera fonctionnant dans le visible et d'une camera ir - Google Patents
Detecteur de court-circuit sur carte imprimee au moyen d'une camera fonctionnant dans le visible et d'une camera ir Download PDFInfo
- Publication number
- CA2364564A1 CA2364564A1 CA002364564A CA2364564A CA2364564A1 CA 2364564 A1 CA2364564 A1 CA 2364564A1 CA 002364564 A CA002364564 A CA 002364564A CA 2364564 A CA2364564 A CA 2364564A CA 2364564 A1 CA2364564 A1 CA 2364564A1
- Authority
- CA
- Canada
- Prior art keywords
- image
- visible
- camera
- short
- pixels
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000005855 radiation Effects 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000008569 process Effects 0.000 claims abstract description 10
- 230000008439 repair process Effects 0.000 claims abstract description 3
- 230000001681 protective effect Effects 0.000 claims description 4
- 238000004364 calculation method Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims description 2
- 239000011358 absorbing material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000035945 sensitivity Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 230000003595 spectral effect Effects 0.000 description 4
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 3
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
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- 238000007689 inspection Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/80—Analysis of captured images to determine intrinsic or extrinsic camera parameters, i.e. camera calibration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002364564A CA2364564A1 (fr) | 2001-12-07 | 2001-12-07 | Detecteur de court-circuit sur carte imprimee au moyen d'une camera fonctionnant dans le visible et d'une camera ir |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002364564A CA2364564A1 (fr) | 2001-12-07 | 2001-12-07 | Detecteur de court-circuit sur carte imprimee au moyen d'une camera fonctionnant dans le visible et d'une camera ir |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2364564A1 true CA2364564A1 (fr) | 2003-06-07 |
Family
ID=4170772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002364564A Abandoned CA2364564A1 (fr) | 2001-12-07 | 2001-12-07 | Detecteur de court-circuit sur carte imprimee au moyen d'une camera fonctionnant dans le visible et d'une camera ir |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA2364564A1 (fr) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1528391A1 (fr) * | 2003-10-30 | 2005-05-04 | Airbus France | Procédé pour déterminer des modifications apportées à une carte électronique et méthodes de fabrication |
CN103399248A (zh) * | 2013-07-18 | 2013-11-20 | 江苏物联网研究发展中心 | Pcb电路板缺陷批量检测系统和方法 |
WO2014204993A1 (fr) * | 2013-06-20 | 2014-12-24 | Microsoft Corporation | Détection d'image multispectrale pour capture d'une région d'intérêt |
CN104641630A (zh) * | 2012-05-23 | 2015-05-20 | 杭州阿尔法红外检测技术有限公司 | 热像记录装置和热像记录方法 |
CN105891697A (zh) * | 2014-12-23 | 2016-08-24 | 中国人民解放军65049部队 | 电路板检修辅助图片像素动态链接系统 |
CN105891623A (zh) * | 2014-12-23 | 2016-08-24 | 中国人民解放军65049部队 | 电子元件定位辅助图片像素动态链接系统 |
CN108107226A (zh) * | 2017-12-15 | 2018-06-01 | 武汉精测电子集团股份有限公司 | 基于ppc软体的aoi多工位系统及方法 |
CN108152712A (zh) * | 2017-12-28 | 2018-06-12 | 广州飒特红外股份有限公司 | 电路板故障检测方法及设备 |
CN108693462A (zh) * | 2018-06-13 | 2018-10-23 | 奇酷互联网络科技(深圳)有限公司 | 电路板检测方法、系统、可读存储介质、设备及电路板 |
CN112731111A (zh) * | 2020-12-30 | 2021-04-30 | 苏州谨测检测技术服务有限公司 | 一种新型pcba器件失效短路测试方法 |
CN113469293A (zh) * | 2021-09-02 | 2021-10-01 | 成都数联云算科技有限公司 | 面板阵列短路检测方法、装置、电子设备及存储介质 |
CN116309603A (zh) * | 2023-05-24 | 2023-06-23 | 山东双海电气设备安装有限公司 | 一种电力设备故障视觉检测方法及系统 |
-
2001
- 2001-12-07 CA CA002364564A patent/CA2364564A1/fr not_active Abandoned
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2861948A1 (fr) * | 2003-10-30 | 2005-05-06 | Airbus France | Procede pour determiner des modifications apportees a une carte electronique et methodes de fabrication d'une carte electronique et d'un equipement muni d'une carte electronique |
US7136714B2 (en) | 2003-10-30 | 2006-11-14 | Airbus France | Procedure for determining modifications made to an electronic card and methods of fabricating an electronic card and an item equipment provided with an electronic card |
EP1528391A1 (fr) * | 2003-10-30 | 2005-05-04 | Airbus France | Procédé pour déterminer des modifications apportées à une carte électronique et méthodes de fabrication |
CN104641630A (zh) * | 2012-05-23 | 2015-05-20 | 杭州阿尔法红外检测技术有限公司 | 热像记录装置和热像记录方法 |
CN104641630B (zh) * | 2012-05-23 | 2018-11-20 | 杭州阿尔法红外检测技术有限公司 | 热像记录装置和热像记录方法 |
US10863098B2 (en) | 2013-06-20 | 2020-12-08 | Microsoft Technology Licensing. LLC | Multimodal image sensing for region of interest capture |
WO2014204993A1 (fr) * | 2013-06-20 | 2014-12-24 | Microsoft Corporation | Détection d'image multispectrale pour capture d'une région d'intérêt |
CN103399248A (zh) * | 2013-07-18 | 2013-11-20 | 江苏物联网研究发展中心 | Pcb电路板缺陷批量检测系统和方法 |
CN105891623B (zh) * | 2014-12-23 | 2019-08-09 | 中科众志信通(大连)科技有限公司 | 电子元件定位辅助图片像素动态链接方法 |
CN105891697A (zh) * | 2014-12-23 | 2016-08-24 | 中国人民解放军65049部队 | 电路板检修辅助图片像素动态链接系统 |
CN105891697B (zh) * | 2014-12-23 | 2019-08-23 | 中科众志信通(大连)科技有限公司 | 电路板检修辅助图片像素动态链接方法 |
CN105891623A (zh) * | 2014-12-23 | 2016-08-24 | 中国人民解放军65049部队 | 电子元件定位辅助图片像素动态链接系统 |
CN108107226A (zh) * | 2017-12-15 | 2018-06-01 | 武汉精测电子集团股份有限公司 | 基于ppc软体的aoi多工位系统及方法 |
CN108152712A (zh) * | 2017-12-28 | 2018-06-12 | 广州飒特红外股份有限公司 | 电路板故障检测方法及设备 |
CN108152712B (zh) * | 2017-12-28 | 2020-10-02 | 广州飒特红外股份有限公司 | 电路板故障检测方法及设备 |
CN108693462A (zh) * | 2018-06-13 | 2018-10-23 | 奇酷互联网络科技(深圳)有限公司 | 电路板检测方法、系统、可读存储介质、设备及电路板 |
CN112731111A (zh) * | 2020-12-30 | 2021-04-30 | 苏州谨测检测技术服务有限公司 | 一种新型pcba器件失效短路测试方法 |
CN112731111B (zh) * | 2020-12-30 | 2022-12-20 | 苏州谨测检测技术服务有限公司 | 一种新型pcba器件失效短路测试方法 |
CN113469293A (zh) * | 2021-09-02 | 2021-10-01 | 成都数联云算科技有限公司 | 面板阵列短路检测方法、装置、电子设备及存储介质 |
CN113469293B (zh) * | 2021-09-02 | 2021-11-09 | 成都数联云算科技有限公司 | 面板阵列短路检测方法、装置、电子设备及存储介质 |
CN116309603A (zh) * | 2023-05-24 | 2023-06-23 | 山东双海电气设备安装有限公司 | 一种电力设备故障视觉检测方法及系统 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FZDE | Discontinued |