CA2350506A1 - Technique de depot de couche conductrice sur un substrat - Google Patents
Technique de depot de couche conductrice sur un substrat Download PDFInfo
- Publication number
- CA2350506A1 CA2350506A1 CA002350506A CA2350506A CA2350506A1 CA 2350506 A1 CA2350506 A1 CA 2350506A1 CA 002350506 A CA002350506 A CA 002350506A CA 2350506 A CA2350506 A CA 2350506A CA 2350506 A1 CA2350506 A1 CA 2350506A1
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- layer
- conducting layer
- ink
- electrically conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 56
- 230000008569 process Effects 0.000 title claims abstract description 44
- 239000000758 substrate Substances 0.000 title claims abstract description 39
- 238000000151 deposition Methods 0.000 title claims abstract description 26
- 230000008021 deposition Effects 0.000 claims abstract description 16
- 238000010899 nucleation Methods 0.000 claims abstract description 15
- 238000007639 printing Methods 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- 239000011236 particulate material Substances 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 229920001940 conductive polymer Polymers 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 125000003368 amide group Chemical group 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229920000307 polymer substrate Polymers 0.000 claims 1
- 239000010410 layer Substances 0.000 description 49
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000009472 formulation Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- RRAFCDWBNXTKKO-UHFFFAOYSA-N eugenol Chemical compound COC1=CC(CC=C)=CC=C1O RRAFCDWBNXTKKO-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 235000019198 oils Nutrition 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 235000015112 vegetable and seed oil Nutrition 0.000 description 2
- 239000008158 vegetable oil Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- NPBVQXIMTZKSBA-UHFFFAOYSA-N Chavibetol Natural products COC1=CC=C(CC=C)C=C1O NPBVQXIMTZKSBA-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 101100049144 Escherichia phage 186 dhr gene Proteins 0.000 description 1
- 239000005770 Eugenol Substances 0.000 description 1
- UVMRYBDEERADNV-UHFFFAOYSA-N Pseudoeugenol Natural products COC1=CC(C(C)=C)=CC=C1O UVMRYBDEERADNV-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical class [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 238000010960 commercial process Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 229960002217 eugenol Drugs 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 150000004668 long chain fatty acids Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Cette invention a trait à une technique de dépôt de couche conductrice sur un substrat, laquelle technique consiste à déposer une encre sur le substrat par impression lithographique de manière à former une couche d'activation, puis à déposer une première couche conductrice de l'électricité sur cette couche d'activation par dépôt autocatalytique.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB9826447.6A GB9826447D0 (en) | 1998-12-03 | 1998-12-03 | Fabrication of a seeding layer to enable electroplating and electroless platingvia a lithographic printing process |
| GB9826446.8 | 1998-12-03 | ||
| GBGB9826446.8A GB9826446D0 (en) | 1998-12-03 | 1998-12-03 | Electrical battery interconnect device |
| GB9826447.6 | 1998-12-03 | ||
| PCT/GB1999/004064 WO2000033625A1 (fr) | 1998-12-03 | 1999-12-03 | Technique de depot de couche conductrice sur un substrat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2350506A1 true CA2350506A1 (fr) | 2000-06-08 |
Family
ID=26314771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002350506A Abandoned CA2350506A1 (fr) | 1998-12-03 | 1999-12-03 | Technique de depot de couche conductrice sur un substrat |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP1142456A1 (fr) |
| JP (1) | JP2002531961A (fr) |
| CN (1) | CN1242659C (fr) |
| AU (1) | AU762686B2 (fr) |
| CA (1) | CA2350506A1 (fr) |
| HK (1) | HK1042627A1 (fr) |
| IL (1) | IL143440A0 (fr) |
| WO (1) | WO2000033625A1 (fr) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6413858B1 (en) | 1999-08-27 | 2002-07-02 | Micron Technology, Inc. | Barrier and electroplating seed layer |
| GB0104982D0 (en) | 2001-02-28 | 2001-04-18 | Gill Steven | Electrode |
| FR2825228B1 (fr) | 2001-05-25 | 2003-09-19 | Framatome Connectors Int | Procede de fabrication d'un circuit imprime et antenne planaire fabriquee avec celui-ci |
| GB0117431D0 (en) * | 2001-07-17 | 2001-09-12 | Univ Brunel | Method for printing conducting layer onto substrate |
| US6828713B2 (en) * | 2002-07-30 | 2004-12-07 | Agilent Technologies, Inc | Resonator with seed layer |
| GB2394725A (en) * | 2002-10-04 | 2004-05-05 | Qinetiq Ltd | Method of forming a magnetic information tag by electroless deposition |
| US7255782B2 (en) | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
| US20050241951A1 (en) * | 2004-04-30 | 2005-11-03 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
| GB0413076D0 (en) | 2004-06-11 | 2004-07-14 | Medtronic Inc | Deep brain stimulation of the Zona incerta |
| WO2010122918A1 (fr) * | 2009-04-24 | 2010-10-28 | 住友電気工業株式会社 | Substrat pour carte imprimée, carte imprimée, et procédés de fabrication de celle-ci |
| EP2740818B1 (fr) * | 2012-12-05 | 2016-03-30 | ATOTECH Deutschland GmbH | Procédé de fabrication de surfaces pouvant être collées et soudées sur des électrodes en métal noble |
| JP6484218B2 (ja) | 2014-03-20 | 2019-03-13 | 住友電気工業株式会社 | プリント配線板用基板及びプリント配線板 |
| US10237976B2 (en) | 2014-03-27 | 2019-03-19 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board |
| US10076028B2 (en) | 2015-01-22 | 2018-09-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board |
| CN105405490A (zh) * | 2015-12-23 | 2016-03-16 | 东洋油墨Sc控股株式会社 | 激光加工用导电性糊、导电性片材、信号布线的制造方法及电子设备 |
| EP3530706B1 (fr) | 2018-02-27 | 2022-12-07 | Fundación I + D Automoción y Mecatrónica | Procédé de production d'une encre conductrice pour impression offset et encre conductrice ainsi produite |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3226256A (en) | 1963-01-02 | 1965-12-28 | Jr Frederick W Schneble | Method of making printed circuits |
| DE2728465C2 (de) | 1977-06-24 | 1982-04-22 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Gedruckte Schaltung |
| CA1326720C (fr) | 1987-12-31 | 1994-02-01 | Michael John Modic | Melanges de polymeres thermoplastiques polaires et de copolymeres sequences modifies, resistant aux chocs |
| US5158645A (en) | 1991-09-03 | 1992-10-27 | International Business Machines, Inc. | Method of external circuitization of a circuit panel |
| US5509557A (en) * | 1994-01-24 | 1996-04-23 | International Business Machines Corporation | Depositing a conductive metal onto a substrate |
| EP0910935A1 (fr) * | 1996-06-12 | 1999-04-28 | Brunel University | Circuit electrique |
-
1999
- 1999-12-03 CA CA002350506A patent/CA2350506A1/fr not_active Abandoned
- 1999-12-03 CN CNB998138053A patent/CN1242659C/zh not_active Expired - Fee Related
- 1999-12-03 AU AU15746/00A patent/AU762686B2/en not_active Ceased
- 1999-12-03 IL IL14344099A patent/IL143440A0/xx unknown
- 1999-12-03 EP EP99958371A patent/EP1142456A1/fr not_active Withdrawn
- 1999-12-03 JP JP2000586145A patent/JP2002531961A/ja active Pending
- 1999-12-03 WO PCT/GB1999/004064 patent/WO2000033625A1/fr not_active Application Discontinuation
-
2002
- 2002-04-08 HK HK02102596.2A patent/HK1042627A1/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| AU1574600A (en) | 2000-06-19 |
| AU762686B2 (en) | 2003-07-03 |
| WO2000033625A1 (fr) | 2000-06-08 |
| CN1335045A (zh) | 2002-02-06 |
| CN1242659C (zh) | 2006-02-15 |
| IL143440A0 (en) | 2002-04-21 |
| EP1142456A1 (fr) | 2001-10-10 |
| HK1042627A1 (zh) | 2002-08-16 |
| JP2002531961A (ja) | 2002-09-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Discontinued |