GB9826447D0 - Fabrication of a seeding layer to enable electroplating and electroless platingvia a lithographic printing process - Google Patents
Fabrication of a seeding layer to enable electroplating and electroless platingvia a lithographic printing processInfo
- Publication number
- GB9826447D0 GB9826447D0 GBGB9826447.6A GB9826447A GB9826447D0 GB 9826447 D0 GB9826447 D0 GB 9826447D0 GB 9826447 A GB9826447 A GB 9826447A GB 9826447 D0 GB9826447 D0 GB 9826447D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- platingvia
- electroless
- fabrication
- printing process
- lithographic printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000009713 electroplating Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000010899 nucleation Methods 0.000 title 1
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9826447.6A GB9826447D0 (en) | 1998-12-03 | 1998-12-03 | Fabrication of a seeding layer to enable electroplating and electroless platingvia a lithographic printing process |
EP99958371A EP1142456A1 (en) | 1998-12-03 | 1999-12-03 | Process for depositing conducting layer on substrate |
JP2000586145A JP2002531961A (en) | 1998-12-03 | 1999-12-03 | Process for depositing a conductive layer on a substrate |
AU15746/00A AU762686B2 (en) | 1998-12-03 | 1999-12-03 | Process for depositing conducting layer on substrate |
PCT/GB1999/004064 WO2000033625A1 (en) | 1998-12-03 | 1999-12-03 | Process for depositing conducting layer on substrate |
IL14344099A IL143440A0 (en) | 1998-12-03 | 1999-12-03 | A method for forming a conductive layer on a substrate |
CA002350506A CA2350506A1 (en) | 1998-12-03 | 1999-12-03 | Process for depositing conducting layer on substrate |
HK02102596.2A HK1042627A1 (en) | 1998-12-03 | 1999-12-03 | Process for depositing conducting layer on substrate |
CNB998138053A CN1242659C (en) | 1998-12-03 | 1999-12-03 | Method for depositing conductive layer on substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9826447.6A GB9826447D0 (en) | 1998-12-03 | 1998-12-03 | Fabrication of a seeding layer to enable electroplating and electroless platingvia a lithographic printing process |
Publications (1)
Publication Number | Publication Date |
---|---|
GB9826447D0 true GB9826447D0 (en) | 1999-01-27 |
Family
ID=10843489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB9826447.6A Ceased GB9826447D0 (en) | 1998-12-03 | 1998-12-03 | Fabrication of a seeding layer to enable electroplating and electroless platingvia a lithographic printing process |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB9826447D0 (en) |
-
1998
- 1998-12-03 GB GBGB9826447.6A patent/GB9826447D0/en not_active Ceased
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |