JP2002531961A - サブストレート上に導電層を付着するためのプロセス - Google Patents
サブストレート上に導電層を付着するためのプロセスInfo
- Publication number
- JP2002531961A JP2002531961A JP2000586145A JP2000586145A JP2002531961A JP 2002531961 A JP2002531961 A JP 2002531961A JP 2000586145 A JP2000586145 A JP 2000586145A JP 2000586145 A JP2000586145 A JP 2000586145A JP 2002531961 A JP2002531961 A JP 2002531961A
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- substrate
- process according
- ink
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 61
- 239000000758 substrate Substances 0.000 title claims abstract description 42
- 238000000151 deposition Methods 0.000 title claims abstract description 24
- 238000007639 printing Methods 0.000 claims abstract description 14
- 238000010899 nucleation Methods 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 8
- 239000011236 particulate material Substances 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229920001940 conductive polymer Polymers 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 125000003368 amide group Chemical group 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229920000307 polymer substrate Polymers 0.000 claims 1
- 238000011068 loading method Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 49
- 230000008021 deposition Effects 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 8
- -1 polyethylene Polymers 0.000 description 8
- 229920000728 polyester Polymers 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 238000009472 formulation Methods 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- RRAFCDWBNXTKKO-UHFFFAOYSA-N eugenol Chemical compound COC1=CC(CC=C)=CC=C1O RRAFCDWBNXTKKO-UHFFFAOYSA-N 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000015112 vegetable and seed oil Nutrition 0.000 description 2
- 239000008158 vegetable oil Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- NPBVQXIMTZKSBA-UHFFFAOYSA-N Chavibetol Natural products COC1=CC=C(CC=C)C=C1O NPBVQXIMTZKSBA-UHFFFAOYSA-N 0.000 description 1
- 101100049144 Escherichia phage 186 dhr gene Proteins 0.000 description 1
- 239000005770 Eugenol Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 101100219325 Phaseolus vulgaris BA13 gene Proteins 0.000 description 1
- UVMRYBDEERADNV-UHFFFAOYSA-N Pseudoeugenol Natural products COC1=CC(C(C)=C)=CC=C1O UVMRYBDEERADNV-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000006701 autoxidation reaction Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 238000010960 commercial process Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 229960002217 eugenol Drugs 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB9826447.6A GB9826447D0 (en) | 1998-12-03 | 1998-12-03 | Fabrication of a seeding layer to enable electroplating and electroless platingvia a lithographic printing process |
| GB9826446.8 | 1998-12-03 | ||
| GBGB9826446.8A GB9826446D0 (en) | 1998-12-03 | 1998-12-03 | Electrical battery interconnect device |
| GB9826447.6 | 1998-12-03 | ||
| PCT/GB1999/004064 WO2000033625A1 (fr) | 1998-12-03 | 1999-12-03 | Technique de depot de couche conductrice sur un substrat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002531961A true JP2002531961A (ja) | 2002-09-24 |
Family
ID=26314771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000586145A Pending JP2002531961A (ja) | 1998-12-03 | 1999-12-03 | サブストレート上に導電層を付着するためのプロセス |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP1142456A1 (fr) |
| JP (1) | JP2002531961A (fr) |
| CN (1) | CN1242659C (fr) |
| AU (1) | AU762686B2 (fr) |
| CA (1) | CA2350506A1 (fr) |
| HK (1) | HK1042627A1 (fr) |
| IL (1) | IL143440A0 (fr) |
| WO (1) | WO2000033625A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008528812A (ja) * | 2005-02-03 | 2008-07-31 | マクダーミッド インコーポレーテッド | 非導電性基板の選択的触媒活性化 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6413858B1 (en) | 1999-08-27 | 2002-07-02 | Micron Technology, Inc. | Barrier and electroplating seed layer |
| GB0104982D0 (en) | 2001-02-28 | 2001-04-18 | Gill Steven | Electrode |
| FR2825228B1 (fr) | 2001-05-25 | 2003-09-19 | Framatome Connectors Int | Procede de fabrication d'un circuit imprime et antenne planaire fabriquee avec celui-ci |
| GB0117431D0 (en) * | 2001-07-17 | 2001-09-12 | Univ Brunel | Method for printing conducting layer onto substrate |
| US6828713B2 (en) * | 2002-07-30 | 2004-12-07 | Agilent Technologies, Inc | Resonator with seed layer |
| GB2394725A (en) * | 2002-10-04 | 2004-05-05 | Qinetiq Ltd | Method of forming a magnetic information tag by electroless deposition |
| US7255782B2 (en) | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
| GB0413076D0 (en) | 2004-06-11 | 2004-07-14 | Medtronic Inc | Deep brain stimulation of the Zona incerta |
| US20120031656A1 (en) * | 2009-04-24 | 2012-02-09 | Yoshio Oka | Substrate for printed wiring board, printed wiring board, and methods for producing same |
| EP2740818B1 (fr) * | 2012-12-05 | 2016-03-30 | ATOTECH Deutschland GmbH | Procédé de fabrication de surfaces pouvant être collées et soudées sur des électrodes en métal noble |
| JP6484218B2 (ja) | 2014-03-20 | 2019-03-13 | 住友電気工業株式会社 | プリント配線板用基板及びプリント配線板 |
| CN106134298B (zh) | 2014-03-27 | 2019-02-22 | 住友电气工业株式会社 | 印刷线路板用基板、印刷线路板以及制造印刷线路板用基板的方法 |
| WO2016117575A1 (fr) | 2015-01-22 | 2016-07-28 | 住友電気工業株式会社 | Substrat pour carte de circuit imprimé, carte de circuit imprimé, et procédé de fabrication de carte de circuit imprimé |
| CN105405490A (zh) * | 2015-12-23 | 2016-03-16 | 东洋油墨Sc控股株式会社 | 激光加工用导电性糊、导电性片材、信号布线的制造方法及电子设备 |
| ES2938658T3 (es) | 2018-02-27 | 2023-04-13 | Fund I D Automocion Y Mecatronica | Método de producción de una tinta conductora de impresión offset y tinta conductora así producida |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3226256A (en) | 1963-01-02 | 1965-12-28 | Jr Frederick W Schneble | Method of making printed circuits |
| DE2728465C2 (de) | 1977-06-24 | 1982-04-22 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Gedruckte Schaltung |
| CA1326720C (fr) | 1987-12-31 | 1994-02-01 | Michael John Modic | Melanges de polymeres thermoplastiques polaires et de copolymeres sequences modifies, resistant aux chocs |
| US5158645A (en) | 1991-09-03 | 1992-10-27 | International Business Machines, Inc. | Method of external circuitization of a circuit panel |
| US5509557A (en) * | 1994-01-24 | 1996-04-23 | International Business Machines Corporation | Depositing a conductive metal onto a substrate |
| WO1997048257A1 (fr) * | 1996-06-12 | 1997-12-18 | Brunel University | Circuit electrique |
-
1999
- 1999-12-03 JP JP2000586145A patent/JP2002531961A/ja active Pending
- 1999-12-03 CA CA002350506A patent/CA2350506A1/fr not_active Abandoned
- 1999-12-03 AU AU15746/00A patent/AU762686B2/en not_active Ceased
- 1999-12-03 WO PCT/GB1999/004064 patent/WO2000033625A1/fr not_active Application Discontinuation
- 1999-12-03 IL IL14344099A patent/IL143440A0/xx unknown
- 1999-12-03 CN CNB998138053A patent/CN1242659C/zh not_active Expired - Fee Related
- 1999-12-03 EP EP99958371A patent/EP1142456A1/fr not_active Withdrawn
-
2002
- 2002-04-08 HK HK02102596.2A patent/HK1042627A1/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008528812A (ja) * | 2005-02-03 | 2008-07-31 | マクダーミッド インコーポレーテッド | 非導電性基板の選択的触媒活性化 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1242659C (zh) | 2006-02-15 |
| HK1042627A1 (zh) | 2002-08-16 |
| CA2350506A1 (fr) | 2000-06-08 |
| AU1574600A (en) | 2000-06-19 |
| EP1142456A1 (fr) | 2001-10-10 |
| CN1335045A (zh) | 2002-02-06 |
| WO2000033625A1 (fr) | 2000-06-08 |
| IL143440A0 (en) | 2002-04-21 |
| AU762686B2 (en) | 2003-07-03 |
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