CA2330019C - Method of isolation for acoustic resonator devices - Google Patents

Method of isolation for acoustic resonator devices Download PDF

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Publication number
CA2330019C
CA2330019C CA002330019A CA2330019A CA2330019C CA 2330019 C CA2330019 C CA 2330019C CA 002330019 A CA002330019 A CA 002330019A CA 2330019 A CA2330019 A CA 2330019A CA 2330019 C CA2330019 C CA 2330019C
Authority
CA
Canada
Prior art keywords
piezoelectric material
substrate
acoustic
piezoelectric
acoustic resonator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002330019A
Other languages
English (en)
French (fr)
Other versions
CA2330019A1 (en
Inventor
Bradley Paul Barber
Linus Albert Fetter
Michael George Zierdt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Priority to CA2642731A priority Critical patent/CA2642731C/en
Publication of CA2330019A1 publication Critical patent/CA2330019A1/en
Application granted granted Critical
Publication of CA2330019C publication Critical patent/CA2330019C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02118—Means for compensation or elimination of undesirable effects of lateral leakage between adjacent resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CA002330019A 2000-02-04 2001-01-02 Method of isolation for acoustic resonator devices Expired - Fee Related CA2330019C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA2642731A CA2642731C (en) 2000-02-04 2001-01-02 Method of isolation for acoustic resonator devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/497,993 US7296329B1 (en) 2000-02-04 2000-02-04 Method of isolation for acoustic resonator device
US09/497,993 2000-02-04

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CA2642731A Division CA2642731C (en) 2000-02-04 2001-01-02 Method of isolation for acoustic resonator devices

Publications (2)

Publication Number Publication Date
CA2330019A1 CA2330019A1 (en) 2001-08-04
CA2330019C true CA2330019C (en) 2008-12-30

Family

ID=23979175

Family Applications (2)

Application Number Title Priority Date Filing Date
CA002330019A Expired - Fee Related CA2330019C (en) 2000-02-04 2001-01-02 Method of isolation for acoustic resonator devices
CA2642731A Expired - Fee Related CA2642731C (en) 2000-02-04 2001-01-02 Method of isolation for acoustic resonator devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
CA2642731A Expired - Fee Related CA2642731C (en) 2000-02-04 2001-01-02 Method of isolation for acoustic resonator devices

Country Status (8)

Country Link
US (2) US7296329B1 (enExample)
EP (1) EP1126601A3 (enExample)
JP (2) JP2001223410A (enExample)
KR (1) KR100745428B1 (enExample)
CN (1) CN1203464C (enExample)
AU (1) AU1673901A (enExample)
BR (1) BR0100192A (enExample)
CA (2) CA2330019C (enExample)

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US7038559B2 (en) * 2004-02-23 2006-05-02 Ruby Richard C Vertically separated acoustic filters and resonators
JP4535841B2 (ja) * 2004-10-28 2010-09-01 富士通メディアデバイス株式会社 圧電薄膜共振子及びこれを用いたフィルタ
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US11579011B2 (en) 2016-02-19 2023-02-14 Fujifilm Sonosite, Inc. Membrane hydrophone for high frequency ultrasound and method of manufacture
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CN108231995B (zh) * 2018-02-05 2024-04-19 武汉衍熙微器件有限公司 一种压电器件及其制备方法
US11594668B2 (en) * 2018-12-28 2023-02-28 Tdk Corporation Thin film laminate, thin film device and multilayer substrate
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US12501642B2 (en) 2020-10-07 2025-12-16 Hrl Laboratories, Llc Semiconductor materials and devices including iii-nitride layers integrated with scandium aluminum nitride
CN113054941B (zh) * 2021-02-09 2023-11-24 偲百创(深圳)科技有限公司 声波谐振器制作方法及声波谐振器
US20230246630A1 (en) * 2022-01-31 2023-08-03 Texas Instruments Incorporated Substrate top side roughening

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Also Published As

Publication number Publication date
KR100745428B1 (ko) 2007-08-02
BR0100192A (pt) 2001-10-09
JP2001223410A (ja) 2001-08-17
CN1203464C (zh) 2005-05-25
CA2330019A1 (en) 2001-08-04
CA2642731A1 (en) 2001-08-04
AU1673901A (en) 2001-08-09
EP1126601A3 (en) 2006-03-22
JP2014017881A (ja) 2014-01-30
KR20010078314A (ko) 2001-08-20
EP1126601A2 (en) 2001-08-22
JP5559411B2 (ja) 2014-07-23
US20080028585A1 (en) 2008-02-07
US8631547B2 (en) 2014-01-21
CA2642731C (en) 2013-10-15
US7296329B1 (en) 2007-11-20
CN1319835A (zh) 2001-10-31

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