CA2223199C - Montage a couplage par les grilles permettant d'ameliorer la protection contre les perturbations electrostatiques a l'entree et a la sortie de circuits integres cmos - Google Patents

Montage a couplage par les grilles permettant d'ameliorer la protection contre les perturbations electrostatiques a l'entree et a la sortie de circuits integres cmos Download PDF

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Publication number
CA2223199C
CA2223199C CA002223199A CA2223199A CA2223199C CA 2223199 C CA2223199 C CA 2223199C CA 002223199 A CA002223199 A CA 002223199A CA 2223199 A CA2223199 A CA 2223199A CA 2223199 C CA2223199 C CA 2223199C
Authority
CA
Canada
Prior art keywords
fet
source
gate
drain
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002223199A
Other languages
English (en)
Other versions
CA2223199A1 (fr
Inventor
Kris Iniewski
Marek Syrzycki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microsemi Storage Solutions Ltd
Original Assignee
PMC Sierra Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PMC Sierra Ltd filed Critical PMC Sierra Ltd
Publication of CA2223199A1 publication Critical patent/CA2223199A1/fr
Application granted granted Critical
Publication of CA2223199C publication Critical patent/CA2223199C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/045—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere
    • H02H9/046—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere responsive to excess voltage appearing at terminals of integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
CA002223199A 1997-05-30 1997-12-01 Montage a couplage par les grilles permettant d'ameliorer la protection contre les perturbations electrostatiques a l'entree et a la sortie de circuits integres cmos Expired - Fee Related CA2223199C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/866,120 US5910874A (en) 1997-05-30 1997-05-30 Gate-coupled structure for enhanced ESD input/output pad protection in CMOS ICs
US08/866,120 1997-05-30

Publications (2)

Publication Number Publication Date
CA2223199A1 CA2223199A1 (fr) 1998-11-30
CA2223199C true CA2223199C (fr) 2001-10-09

Family

ID=25346952

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002223199A Expired - Fee Related CA2223199C (fr) 1997-05-30 1997-12-01 Montage a couplage par les grilles permettant d'ameliorer la protection contre les perturbations electrostatiques a l'entree et a la sortie de circuits integres cmos

Country Status (2)

Country Link
US (2) US5910874A (fr)
CA (1) CA2223199C (fr)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5910874A (en) * 1997-05-30 1999-06-08 Pmc-Sierra Ltd. Gate-coupled structure for enhanced ESD input/output pad protection in CMOS ICs
JP3270364B2 (ja) * 1997-07-28 2002-04-02 エヌイーシーマイクロシステム株式会社 静電保護回路
JP3993927B2 (ja) * 1997-12-22 2007-10-17 沖電気工業株式会社 静電破壊保護回路
US6091594A (en) * 1998-02-18 2000-07-18 Vlsi Technology, Inc. Protection circuits and methods of protecting a semiconductor device
TW373317B (en) * 1998-03-25 1999-11-01 United Microelectronics Corporaiton Gate voltage control electrostatic discharge protection circuit
KR100295053B1 (ko) 1998-09-03 2001-07-12 윤종용 부하적응형저잡음출력버퍼
US6242942B1 (en) 1998-11-13 2001-06-05 Integrated Device Technology, Inc. Integrated circuit output buffers having feedback switches therein for reducing simultaneous switching noise and improving impedance matching characteristics
US6356102B1 (en) 1998-11-13 2002-03-12 Integrated Device Technology, Inc. Integrated circuit output buffers having control circuits therein that utilize output signal feedback to control pull-up and pull-down time intervals
US6091260A (en) * 1998-11-13 2000-07-18 Integrated Device Technology, Inc. Integrated circuit output buffers having low propagation delay and improved noise characteristics
TW471152B (en) * 2000-03-10 2002-01-01 United Microelectronics Corp Electrostatic discharge protection circuit of integrated circuit
US6437407B1 (en) 2000-11-07 2002-08-20 Industrial Technology Research Institute Charged device model electrostatic discharge protection for integrated circuits
US6617649B2 (en) 2000-12-28 2003-09-09 Industrial Technology Research Institute Low substrate-noise electrostatic discharge protection circuits with bi-directional silicon diodes
US7205641B2 (en) * 2000-12-28 2007-04-17 Industrial Technology Research Institute Polydiode structure for photo diode
US6690065B2 (en) * 2000-12-28 2004-02-10 Industrial Technology Research Institute Substrate-biased silicon diode for electrostatic discharge protection and fabrication method
TW486804B (en) 2001-04-24 2002-05-11 United Microelectronics Corp Double-triggered electrostatic discharge protection circuit
US6633068B2 (en) 2001-05-10 2003-10-14 Industrial Technology Research Institute Low-noise silicon controlled rectifier for electrostatic discharge protection
DE10128740B4 (de) * 2001-06-13 2006-07-06 Infineon Technologies Ag Aktive Überspannungsschutzschaltung
US6747501B2 (en) 2001-07-13 2004-06-08 Industrial Technology Research Institute Dual-triggered electrostatic discharge protection circuit
US6750515B2 (en) 2002-02-05 2004-06-15 Industrial Technology Research Institute SCR devices in silicon-on-insulator CMOS process for on-chip ESD protection
US6576974B1 (en) 2002-03-12 2003-06-10 Industrial Technology Research Institute Bipolar junction transistors for on-chip electrostatic discharge protection and methods thereof
US6734504B1 (en) 2002-04-05 2004-05-11 Cypress Semiconductor Corp. Method of providing HBM protection with a decoupled HBM structure
US6838707B2 (en) 2002-05-06 2005-01-04 Industrial Technology Research Institute Bi-directional silicon controlled rectifier for electrostatic discharge protection
US6762918B2 (en) * 2002-05-20 2004-07-13 International Business Machines Corporation Fault free fuse network
TW560038B (en) * 2002-05-29 2003-11-01 Ind Tech Res Inst Electrostatic discharge protection circuit using whole chip trigger technique
TWI225501B (en) * 2002-11-06 2004-12-21 Delta Optoelectronics Inc Packaging material used for a display device and method of forming thereof
US20040105202A1 (en) * 2002-12-03 2004-06-03 Industrial Technology Research Institute Electrostatic discharge protection device and method using depletion switch
US7304827B2 (en) * 2003-05-02 2007-12-04 Zi-Ping Chen ESD protection circuits for mixed-voltage buffers
US7253453B2 (en) * 2003-05-21 2007-08-07 Industrial Technology Research Institute Charge-device model electrostatic discharge protection using active device for CMOS circuits
US7244992B2 (en) 2003-07-17 2007-07-17 Ming-Dou Ker Turn-on-efficient bipolar structures with deep N-well for on-chip ESD protection
US20050237682A1 (en) * 2004-04-26 2005-10-27 Taiwan Semiconductor Manufacturing Co. Novel ESD protection scheme for core devices
TWI273634B (en) 2004-12-21 2007-02-11 Transpacific Ip Ltd Novel poly diode structure for photo diode
CN100426618C (zh) * 2004-12-29 2008-10-15 鸿富锦精密工业（深圳）有限公司 静电放电防护电路
TWI264248B (en) * 2005-03-25 2006-10-11 Avision Inc A method of electrostatic discharge prevention for a systematic circuit
KR100741925B1 (ko) * 2005-12-30 2007-07-23 동부일렉트로닉스 주식회사 구동 용량의 미세 조절이 가능한 입출력 셀
TWI329965B (en) * 2006-06-20 2010-09-01 Via Tech Inc Voltage pull-up device
GB2464538A (en) 2008-10-17 2010-04-28 Cambridge Silicon Radio Ltd An ESD protection circuit for a transmitter output
JP2012203528A (ja) * 2011-03-24 2012-10-22 Seiko Instruments Inc ボルテージ・レギュレータ
US10191108B2 (en) * 2015-11-19 2019-01-29 Globalfoundries Inc. On-chip sensor for monitoring active circuits on integrated circuit (IC) chips
US10574066B2 (en) * 2017-12-04 2020-02-25 Bell Helicopter Textron Inc. Integrated capacitive discharge electrical bonding assurance system

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5400202A (en) * 1992-06-15 1995-03-21 Hewlett-Packard Company Electrostatic discharge protection circuit for integrated circuits
US5910874A (en) * 1997-05-30 1999-06-08 Pmc-Sierra Ltd. Gate-coupled structure for enhanced ESD input/output pad protection in CMOS ICs

Also Published As

Publication number Publication date
US5910874A (en) 1999-06-08
CA2223199A1 (fr) 1998-11-30
US6128171A (en) 2000-10-03

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