CA2087766A1 - Organopolysiloxane paper release compositions - Google Patents
Organopolysiloxane paper release compositionsInfo
- Publication number
- CA2087766A1 CA2087766A1 CA002087766A CA2087766A CA2087766A1 CA 2087766 A1 CA2087766 A1 CA 2087766A1 CA 002087766 A CA002087766 A CA 002087766A CA 2087766 A CA2087766 A CA 2087766A CA 2087766 A1 CA2087766 A1 CA 2087766A1
- Authority
- CA
- Canada
- Prior art keywords
- epoxy
- heat curable
- accordance
- curable composition
- paper release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 31
- 229920001296 polysiloxane Polymers 0.000 title claims description 38
- 239000004593 Epoxy Substances 0.000 claims abstract description 45
- -1 methylsiloxanes Chemical class 0.000 claims abstract description 43
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052990 silicon hydride Inorganic materials 0.000 claims abstract description 16
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 10
- 239000003054 catalyst Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000003112 inhibitor Substances 0.000 claims description 5
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical group C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 claims description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
- 239000000654 additive Substances 0.000 abstract description 20
- 238000006459 hydrosilylation reaction Methods 0.000 abstract description 4
- 239000002210 silicon-based material Substances 0.000 abstract description 2
- 229920002554 vinyl polymer Polymers 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 239000008199 coating composition Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000011067 equilibration Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000013005 condensation curing Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000005046 Chlorosilane Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 2
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 description 2
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000007171 acid catalysis Methods 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000003301 hydrolyzing effect Effects 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Inorganic materials [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 229920005573 silicon-containing polymer Polymers 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 2
- LSWYGACWGAICNM-UHFFFAOYSA-N 2-(prop-2-enoxymethyl)oxirane Chemical compound C=CCOCC1CO1 LSWYGACWGAICNM-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- JQZGUQIEPRIDMR-UHFFFAOYSA-N 3-methylbut-1-yn-1-ol Chemical compound CC(C)C#CO JQZGUQIEPRIDMR-UHFFFAOYSA-N 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229920003354 Modic® Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- MFIBZDZRPYQXOM-UHFFFAOYSA-N [dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silyl]oxy-dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound C1OC1COCCC[Si](C)(C)O[Si](C)(C)CCCOCC1CO1 MFIBZDZRPYQXOM-UHFFFAOYSA-N 0.000 description 1
- 238000013006 addition curing Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000013270 controlled release Methods 0.000 description 1
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical group CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 1
- STRNXFOUBFLVIN-UHFFFAOYSA-N diethyl but-2-ynedioate Chemical compound CCOC(=O)C#CC(=O)OCC STRNXFOUBFLVIN-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000012632 extractable Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000012429 release testing Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- ZQTYRTSKQFQYPQ-UHFFFAOYSA-N trisiloxane Chemical compound [SiH3]O[SiH2]O[SiH3] ZQTYRTSKQFQYPQ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Silicon Polymers (AREA)
- Paper (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83318092A | 1992-02-10 | 1992-02-10 | |
| US833,180 | 1992-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2087766A1 true CA2087766A1 (en) | 1993-08-11 |
Family
ID=25263677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002087766A Abandoned CA2087766A1 (en) | 1992-02-10 | 1993-01-21 | Organopolysiloxane paper release compositions |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0556023A1 (enExample) |
| JP (1) | JPH061918A (enExample) |
| KR (1) | KR930017980A (enExample) |
| CA (1) | CA2087766A1 (enExample) |
| FI (1) | FI930554A7 (enExample) |
| TW (1) | TW198054B (enExample) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1215320A (zh) * | 1996-02-14 | 1999-04-28 | 日东电工株式会社 | 生理用卫生巾个装片材和用该个装片材包装的生理用卫生巾个别包装体 |
| CN1837317B (zh) * | 1996-10-08 | 2010-05-12 | 日立化成工业株式会社 | 半导体装置、粘合剂和双面粘合膜 |
| US6077611A (en) * | 1997-09-30 | 2000-06-20 | General Electric Company | Printable paper release compositions |
| EP1174467B1 (de) | 2000-07-22 | 2004-09-15 | Goldschmidt AG | Hitzestabile, korrosionsinhibierende Polyorganosiloxanharze |
| JP4757504B2 (ja) * | 2005-02-03 | 2011-08-24 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 剥離性硬化皮膜形成用シリコーン組成物 |
| FR2903112A1 (fr) | 2006-06-29 | 2008-01-04 | Rhodia Recherches & Tech | Composition silicone reticulable pour la realisation de revetements anti-adherents pour supports souples et additif promoteur d'accrochage contenu dans cette composition |
| GB0616021D0 (en) | 2006-08-14 | 2006-09-20 | Dow Corning | Silicone release coating compositions |
| JP4798375B2 (ja) * | 2006-11-17 | 2011-10-19 | 信越化学工業株式会社 | 押し出し成型用シリコーンゴム組成物及びその製造方法 |
| US20160369058A1 (en) * | 2013-07-11 | 2016-12-22 | Momentive Performance Materials Inc. | Dual modalities curing silicone compositions |
| CN110382645B (zh) | 2016-12-23 | 2021-07-09 | 陶氏（上海）投资有限公司 | 聚有机硅氧烷离型涂层以及其制备方法和用途 |
| US10876019B2 (en) | 2017-10-19 | 2020-12-29 | Dow Silicones Corporation | Polyorganosiloxane compositions containing a 2-substituted-1-alkynyl-1-cyclohexanol useful as a hydrosilylation reaction inhibitor |
| EP3645651B1 (en) | 2017-10-19 | 2023-09-06 | Dow Silicones Corporation | A method for fabricating a flexible organic light emitting diode using a pressure sensitive adhesive composition |
| EP3898774B1 (en) | 2018-12-21 | 2023-06-07 | Dow Silicones Corporation | Method for preparing a functionalized polyorganosiloxane |
| JP7555925B2 (ja) | 2018-12-21 | 2024-09-25 | ダウ シリコーンズ コーポレーション | 多官能性オルガノシロキサン、それを含有する組成物、及びその調製方法 |
| JP7499250B2 (ja) | 2018-12-21 | 2024-06-13 | ダウ シリコーンズ コーポレーション | 多官能性オルガノシロキサン、それを含有する組成物、及びその調製方法 |
| EP3898777B1 (en) | 2018-12-21 | 2023-04-19 | Dow Silicones Corporation | Methods for making polyfunctional organosiloxanes and compositions containing same |
| JP7609808B2 (ja) | 2019-05-16 | 2025-01-07 | ダウ シリコーンズ コーポレーション | ポリシロキサン制御剥離添加剤、それを調製するための方法、及び剥離コーティング組成物 |
| JP7422864B2 (ja) | 2019-08-22 | 2024-01-26 | ダウ シリコーンズ コーポレーション | ポリオルガノシロキサン剥離コーティング組成物 |
| WO2021061417A1 (en) | 2019-09-26 | 2021-04-01 | Dow Silicones Corporation | Silicone release coating composition and methods for the preparation and use of same |
| JP7434543B2 (ja) | 2019-10-30 | 2024-02-20 | ダウ シリコーンズ コーポレーション | 無溶媒ポリオルガノシロキサンペレットならびにその調製および使用のためのプロセス |
| KR102757571B1 (ko) | 2019-10-31 | 2025-01-22 | 다우 실리콘즈 코포레이션 | 실리콘 감압 접착제 조성물 및 이의 제조 및 사용 방법 |
| US11279847B2 (en) | 2019-12-02 | 2022-03-22 | Dow Silicones Corporation | Composition for preparing a release coating |
| CN114729125B (zh) | 2019-12-02 | 2023-11-07 | 美国陶氏有机硅公司 | 用于制备防粘涂料的组合物 |
| EP3953427B1 (en) | 2019-12-02 | 2023-03-29 | Dow Silicones Corporation | Composition for preparing a release coating |
| CN114761467B (zh) | 2019-12-02 | 2023-05-12 | 美国陶氏有机硅公司 | 用于制备防粘涂料的组合物 |
| WO2021138152A1 (en) | 2019-12-30 | 2021-07-08 | Dow Silicones Corporation | Composition for preparing a release coating, release coating composition, and related methods |
| CN114867801B (zh) | 2019-12-30 | 2024-08-23 | 美国陶氏有机硅公司 | 用于制备防粘涂料的组合物、防粘涂料组合物及相关方法 |
| KR20220120648A (ko) | 2019-12-30 | 2022-08-30 | 다우 실리콘즈 코포레이션 | 감압 접착제 조성물 |
| WO2021142653A1 (en) | 2020-01-15 | 2021-07-22 | Dow Silicones Corporation | Silicone pressure sensitive adhesive composition and methods for the preparation and use thereof |
| CN115667435B (zh) | 2020-06-22 | 2024-07-12 | 美国陶氏有机硅公司 | 低强度可辐射固化有机硅防粘涂料组合物及其制备方法和用途 |
| CN116234858B (zh) | 2020-06-24 | 2025-05-06 | 美国陶氏有机硅公司 | 用于由氟化芳基硼烷路易斯酸催化的使有机硅化合物与硅基氢化物反应的组合物和方法 |
| JP7727666B2 (ja) | 2020-06-24 | 2025-08-21 | ダウ シリコーンズ コーポレーション | 多官能性オルガノシロキサンの製造方法及びそれを含有する組成物 |
| EP4172242B1 (en) | 2020-06-24 | 2024-03-20 | Dow Silicones Corporation | Composition and method for silyl hydride reaction catalyzed by fluorinated arylborane lewis acids |
| JP7256286B2 (ja) | 2020-09-27 | 2023-04-11 | ダウ シリコーンズ コーポレーション | 添加剤オルガノポリシロキサン組成物、硬化性組成物、及びフィルム |
| WO2022216367A1 (en) | 2021-04-09 | 2022-10-13 | Dow Silicones Corporation | Pressure sensitive adhesive composition and methods for its preparation and use in flexible organic light emitting diode applications |
| US12116511B2 (en) | 2021-04-09 | 2024-10-15 | Dow Silicones Corporation | Process for preparing a solventless polyorganosiloxane pellet and a waterborne dispersion of a silicone pressure sensitive adhesive base |
| WO2022226797A1 (en) | 2021-04-27 | 2022-11-03 | Dow Silicones Corporation | Hydrosilylation reaction cured silicone pressure sensitive adhesive, composition and method for its preparation, and use in flexible display device |
| EP4347682A1 (en) | 2021-05-24 | 2024-04-10 | Dow Silicones Corporation | Composition for preparing a release coating and method of preparing coated substrate |
| KR102553392B1 (ko) | 2021-07-21 | 2023-07-11 | 다우 글로벌 테크놀로지스 엘엘씨 | 실리콘 감압성 접착제 베이스의 수성 분산액, 및 분산액의 제조 및 사용 방법 |
| WO2023115340A1 (en) | 2021-12-21 | 2023-06-29 | Dow Silicones Corporation | Release coating composition |
| CN117751174A (zh) | 2022-03-30 | 2024-03-22 | 美国陶氏有机硅公司 | 用于有机硅压敏粘合剂的可固化组合物 |
| WO2024006430A1 (en) | 2022-06-30 | 2024-01-04 | Dow Silicones Corporation | Composition for preparing a release coating |
| KR20250111330A (ko) | 2022-11-23 | 2025-07-22 | 다우 실리콘즈 코포레이션 | 이형 코팅 제조용 조성물 및 코팅된 기재의 제조 방법 |
| TW202523744A (zh) * | 2023-12-12 | 2025-06-16 | 美商陶氏有機矽公司 | 穩定之環氧聚矽氧 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4256870A (en) * | 1979-05-17 | 1981-03-17 | General Electric Company | Solventless release compositions, methods and articles of manufacture |
| JPH0279852A (ja) * | 1988-09-16 | 1990-03-20 | Fuji Photo Film Co Ltd | 湿し水不要感光性平版印刷版 |
-
1992
- 1992-04-13 TW TW081102860A patent/TW198054B/zh active
-
1993
- 1993-01-21 CA CA002087766A patent/CA2087766A1/en not_active Abandoned
- 1993-02-08 JP JP5019157A patent/JPH061918A/ja not_active Withdrawn
- 1993-02-09 FI FI930554A patent/FI930554A7/fi not_active Application Discontinuation
- 1993-02-09 EP EP93300937A patent/EP0556023A1/en not_active Withdrawn
- 1993-02-09 KR KR1019930001732A patent/KR930017980A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| TW198054B (enExample) | 1993-01-11 |
| JPH061918A (ja) | 1994-01-11 |
| FI930554L (fi) | 1993-08-11 |
| KR930017980A (ko) | 1993-09-21 |
| EP0556023A1 (en) | 1993-08-18 |
| FI930554A0 (fi) | 1993-02-09 |
| FI930554A7 (fi) | 1993-08-11 |
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Legal Events
| Date | Code | Title | Description |
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| FZDE | Discontinued |