CA2003202A1 - Agencements de circuits imprimes a thermocouple pour fins de formation et d'evaluation de materiel, et methode de realisation et d'utilisation - Google Patents
Agencements de circuits imprimes a thermocouple pour fins de formation et d'evaluation de materiel, et methode de realisation et d'utilisationInfo
- Publication number
- CA2003202A1 CA2003202A1 CA002003202A CA2003202A CA2003202A1 CA 2003202 A1 CA2003202 A1 CA 2003202A1 CA 002003202 A CA002003202 A CA 002003202A CA 2003202 A CA2003202 A CA 2003202A CA 2003202 A1 CA2003202 A1 CA 2003202A1
- Authority
- CA
- Canada
- Prior art keywords
- thermocouple
- conductor material
- printed circuit
- support
- terminal portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
- G09B19/00—Teaching not covered by other main groups of this subclass
- G09B19/24—Use of tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
Landscapes
- Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- Entrepreneurship & Innovation (AREA)
- Physics & Mathematics (AREA)
- Educational Administration (AREA)
- Educational Technology (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Electrically Operated Instructional Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27643288A | 1988-11-23 | 1988-11-23 | |
US276,432 | 1988-11-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2003202A1 true CA2003202A1 (fr) | 1990-05-23 |
Family
ID=23056648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002003202A Abandoned CA2003202A1 (fr) | 1988-11-23 | 1989-11-17 | Agencements de circuits imprimes a thermocouple pour fins de formation et d'evaluation de materiel, et methode de realisation et d'utilisation |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPH02211489A (fr) |
CA (1) | CA2003202A1 (fr) |
DE (1) | DE3938847A1 (fr) |
FR (1) | FR2646313A1 (fr) |
GB (1) | GB2225663B (fr) |
IT (1) | IT1236825B (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112362098A (zh) * | 2020-10-28 | 2021-02-12 | 乔娜娜 | 一种集成电路焊点检测结构及其检测方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2261984B (en) * | 1991-11-27 | 1995-04-19 | Automobile Ass Limited The | Improvements in and relating to simulating electrical characteristics of components |
EP3522810B1 (fr) * | 2016-10-04 | 2022-06-29 | St. Jude Medical, Cardiology Division, Inc. | Pointe de cathéter d'ablation avec circuit électronique flexible |
CN110519910B (zh) * | 2019-08-28 | 2020-10-16 | 生益电子股份有限公司 | 通过导电介质粘结散热介质的pcb检测方法及pcb |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2413646A1 (fr) * | 1978-01-02 | 1979-07-27 | Saint Gobain | Fluxmetre thermique |
US4224744A (en) * | 1978-05-12 | 1980-09-30 | Pace Incorporated | Circuitry for teaching soldering and practice circuit board for use therewith |
US4394711A (en) * | 1979-06-01 | 1983-07-19 | Interconnection Technology, Inc. | Circuit board with weldable terminals |
JPS5672321A (en) * | 1979-11-20 | 1981-06-16 | Kensetsusho Kenchiku Kenkyu Shocho | Radiation thermocouple and its manufacture |
JPS5810875A (ja) * | 1981-07-14 | 1983-01-21 | Toshiba Chem Corp | シ−ト状熱電対の製造方法 |
-
1989
- 1989-11-17 CA CA002003202A patent/CA2003202A1/fr not_active Abandoned
- 1989-11-23 DE DE3938847A patent/DE3938847A1/de not_active Withdrawn
- 1989-11-23 FR FR8915430A patent/FR2646313A1/fr not_active Withdrawn
- 1989-11-23 IT IT02250089A patent/IT1236825B/it active IP Right Grant
- 1989-11-23 GB GB8926492A patent/GB2225663B/en not_active Expired - Fee Related
- 1989-11-24 JP JP1306343A patent/JPH02211489A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112362098A (zh) * | 2020-10-28 | 2021-02-12 | 乔娜娜 | 一种集成电路焊点检测结构及其检测方法 |
Also Published As
Publication number | Publication date |
---|---|
FR2646313A1 (fr) | 1990-10-26 |
DE3938847A1 (de) | 1990-05-31 |
GB2225663B (en) | 1992-07-15 |
GB8926492D0 (en) | 1990-01-10 |
JPH02211489A (ja) | 1990-08-22 |
GB2225663A (en) | 1990-06-06 |
IT8922500A0 (it) | 1989-11-23 |
IT8922500A1 (it) | 1991-05-23 |
IT1236825B (it) | 1993-04-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
FZDE | Discontinued |