IT1236825B - Sistemi a termocoppia a circuito stampato per scopi di addestramento del personale e valutazione delle apparecchiature e metodi per realizzare ed usare gli stessi. - Google Patents

Sistemi a termocoppia a circuito stampato per scopi di addestramento del personale e valutazione delle apparecchiature e metodi per realizzare ed usare gli stessi.

Info

Publication number
IT1236825B
IT1236825B IT02250089A IT2250089A IT1236825B IT 1236825 B IT1236825 B IT 1236825B IT 02250089 A IT02250089 A IT 02250089A IT 2250089 A IT2250089 A IT 2250089A IT 1236825 B IT1236825 B IT 1236825B
Authority
IT
Italy
Prior art keywords
assessment
create
purposes
equipment
methods
Prior art date
Application number
IT02250089A
Other languages
English (en)
Italian (it)
Other versions
IT8922500A0 (it
IT8922500A1 (it
Original Assignee
Pace Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pace Inc filed Critical Pace Inc
Publication of IT8922500A0 publication Critical patent/IT8922500A0/it
Publication of IT8922500A1 publication Critical patent/IT8922500A1/it
Application granted granted Critical
Publication of IT1236825B publication Critical patent/IT1236825B/it

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B19/00—Teaching not covered by other main groups of this subclass
    • G09B19/24—Use of tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Physics & Mathematics (AREA)
  • Educational Administration (AREA)
  • Educational Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Electrically Operated Instructional Devices (AREA)
IT02250089A 1988-11-23 1989-11-23 Sistemi a termocoppia a circuito stampato per scopi di addestramento del personale e valutazione delle apparecchiature e metodi per realizzare ed usare gli stessi. IT1236825B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27643288A 1988-11-23 1988-11-23

Publications (3)

Publication Number Publication Date
IT8922500A0 IT8922500A0 (it) 1989-11-23
IT8922500A1 IT8922500A1 (it) 1991-05-23
IT1236825B true IT1236825B (it) 1993-04-02

Family

ID=23056648

Family Applications (1)

Application Number Title Priority Date Filing Date
IT02250089A IT1236825B (it) 1988-11-23 1989-11-23 Sistemi a termocoppia a circuito stampato per scopi di addestramento del personale e valutazione delle apparecchiature e metodi per realizzare ed usare gli stessi.

Country Status (6)

Country Link
JP (1) JPH02211489A (fr)
CA (1) CA2003202A1 (fr)
DE (1) DE3938847A1 (fr)
FR (1) FR2646313A1 (fr)
GB (1) GB2225663B (fr)
IT (1) IT1236825B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2261984B (en) * 1991-11-27 1995-04-19 Automobile Ass Limited The Improvements in and relating to simulating electrical characteristics of components
EP3522810B1 (fr) * 2016-10-04 2022-06-29 St. Jude Medical, Cardiology Division, Inc. Pointe de cathéter d'ablation avec circuit électronique flexible
CN110519910B (zh) * 2019-08-28 2020-10-16 生益电子股份有限公司 通过导电介质粘结散热介质的pcb检测方法及pcb
CN114838768A (zh) * 2020-10-28 2022-08-02 乔娜娜 一种集成电路焊点检测工艺、系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2413646A1 (fr) * 1978-01-02 1979-07-27 Saint Gobain Fluxmetre thermique
US4224744A (en) * 1978-05-12 1980-09-30 Pace Incorporated Circuitry for teaching soldering and practice circuit board for use therewith
US4394711A (en) * 1979-06-01 1983-07-19 Interconnection Technology, Inc. Circuit board with weldable terminals
JPS5672321A (en) * 1979-11-20 1981-06-16 Kensetsusho Kenchiku Kenkyu Shocho Radiation thermocouple and its manufacture
JPS5810875A (ja) * 1981-07-14 1983-01-21 Toshiba Chem Corp シ−ト状熱電対の製造方法

Also Published As

Publication number Publication date
FR2646313A1 (fr) 1990-10-26
DE3938847A1 (de) 1990-05-31
GB2225663B (en) 1992-07-15
CA2003202A1 (fr) 1990-05-23
GB8926492D0 (en) 1990-01-10
JPH02211489A (ja) 1990-08-22
GB2225663A (en) 1990-06-06
IT8922500A0 (it) 1989-11-23
IT8922500A1 (it) 1991-05-23

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Legal Events

Date Code Title Description
0001 Granted