CA1336249C - Procedure for the deposition of firmly adhering silver films - Google Patents
Procedure for the deposition of firmly adhering silver filmsInfo
- Publication number
- CA1336249C CA1336249C CA000608433A CA608433A CA1336249C CA 1336249 C CA1336249 C CA 1336249C CA 000608433 A CA000608433 A CA 000608433A CA 608433 A CA608433 A CA 608433A CA 1336249 C CA1336249 C CA 1336249C
- Authority
- CA
- Canada
- Prior art keywords
- silver
- improvement according
- depositing
- compound
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 239000004332 silver Substances 0.000 title claims abstract description 25
- 230000008021 deposition Effects 0.000 title description 5
- 229940100890 silver compound Drugs 0.000 claims abstract description 16
- 150000003379 silver compounds Chemical class 0.000 claims abstract description 16
- 238000000151 deposition Methods 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- PVOMXLLZEZMWBX-UHFFFAOYSA-N FC1=C(C(=C(C(=C1[Ag])F)F)F)F Chemical compound FC1=C(C(=C(C(=C1[Ag])F)F)F)F PVOMXLLZEZMWBX-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract 2
- 230000001464 adherent effect Effects 0.000 claims abstract 2
- 239000003638 chemical reducing agent Substances 0.000 claims abstract 2
- 229910052731 fluorine Inorganic materials 0.000 claims abstract 2
- 239000011737 fluorine Substances 0.000 claims abstract 2
- 229910052736 halogen Inorganic materials 0.000 claims abstract 2
- 150000002367 halogens Chemical class 0.000 claims abstract 2
- 238000006722 reduction reaction Methods 0.000 claims abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000012159 carrier gas Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 230000002829 reductive effect Effects 0.000 claims 2
- 230000008719 thickening Effects 0.000 claims 2
- 150000001721 carbon Chemical group 0.000 claims 1
- 238000000354 decomposition reaction Methods 0.000 claims 1
- 150000002894 organic compounds Chemical class 0.000 claims 1
- 150000003378 silver Chemical group 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 15
- 125000004432 carbon atom Chemical group C* 0.000 abstract description 2
- -1 silver organic compounds Chemical class 0.000 abstract description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000007792 gaseous phase Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- IBKKDOSOWNXUPK-UHFFFAOYSA-N [O].FC(F)(F)F Chemical compound [O].FC(F)(F)F IBKKDOSOWNXUPK-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 231100000086 high toxicity Toxicity 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000008237 rinsing water Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Chemical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3828211A DE3828211A1 (de) | 1988-08-16 | 1988-08-16 | Verfahren zur haftfesten abscheidung von silberfilmen |
| DEP3828211.9 | 1988-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1336249C true CA1336249C (en) | 1995-07-11 |
Family
ID=6361207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000608433A Expired - Fee Related CA1336249C (en) | 1988-08-16 | 1989-08-15 | Procedure for the deposition of firmly adhering silver films |
Country Status (6)
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5149596A (en) * | 1990-10-05 | 1992-09-22 | The United States Of America As Represented By The United States Department Of Energy | Vapor deposition of thin films |
| US5506059A (en) * | 1993-05-14 | 1996-04-09 | Minnesota Mining And Manufacturing Company | Metallic films and articles using same |
| DE4438777A1 (de) * | 1994-10-18 | 1996-05-02 | Atotech Deutschland Gmbh | Verfahren zur Herstellung elektrischer Schaltungsträger |
| EP0787224B1 (de) | 1994-10-18 | 1998-09-16 | ATOTECH Deutschland GmbH | Verfahren zur abscheidung von metallschichten |
| US5674606A (en) * | 1995-04-06 | 1997-10-07 | Parker-Hannifin Corporation | Electrically conductive flame retardant materials and methods of manufacture |
| AT405842B (de) | 1998-06-19 | 1999-11-25 | Miba Gleitlager Ag | Verfahren zum aufbringen einer metallischen schicht auf eine polymeroberfläche eines werkstückes |
| US20040031404A1 (en) * | 2002-08-19 | 2004-02-19 | John Dixon | Seamless embossing shim |
| JP5200304B2 (ja) * | 2008-04-22 | 2013-06-05 | 国立大学法人群馬大学 | プラスチックへの銀担持方法及びプラスチックの銀担体、銀イオン水の製造方法 |
| FR2964118B1 (fr) * | 2010-08-31 | 2013-10-11 | Gerflor | Revetement de sols avec des proprietes antiderapantes et son procede de fabrication |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2501563A (en) * | 1946-02-20 | 1950-03-21 | Libbey Owens Ford Glass Co | Method of forming strongly adherent metallic compound films by glow discharge |
| GB791777A (en) * | 1954-11-24 | 1958-03-12 | Gen Electric | Improvements relating to the growing of single crystals |
| US3087838A (en) * | 1955-10-05 | 1963-04-30 | Hupp Corp | Methods of photoelectric cell manufacture |
| US4226896A (en) * | 1977-12-23 | 1980-10-07 | International Business Machines Corporation | Plasma method for forming a metal containing polymer |
| DE2941896A1 (de) * | 1979-10-17 | 1981-04-30 | Ruhrchemie Ag, 4200 Oberhausen | Verfahren zur herstellung von haftfaehigen schichten auf polyolefinen |
| DE3510982A1 (de) * | 1985-03-22 | 1986-09-25 | Schering AG, Berlin und Bergkamen, 1000 Berlin | Herstellung metallischer strukturen auf nichtleitern |
| JPH0627327B2 (ja) * | 1987-06-30 | 1994-04-13 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | Ｉｂ族金属の付着方法 |
-
1988
- 1988-08-16 DE DE3828211A patent/DE3828211A1/de active Granted
-
1989
- 1989-07-19 EP EP89113191A patent/EP0357918B1/de not_active Expired - Lifetime
- 1989-07-19 DE DE89113191T patent/DE58906243D1/de not_active Expired - Fee Related
- 1989-08-09 AT AT0190989A patent/AT396944B/de not_active IP Right Cessation
- 1989-08-15 CA CA000608433A patent/CA1336249C/en not_active Expired - Fee Related
- 1989-08-16 JP JP1210236A patent/JP3016795B2/ja not_active Expired - Lifetime
- 1989-08-16 US US07/394,828 patent/US5019415A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0357918B1 (de) | 1993-11-24 |
| JP3016795B2 (ja) | 2000-03-06 |
| EP0357918A1 (de) | 1990-03-14 |
| JPH02125873A (ja) | 1990-05-14 |
| US5019415A (en) | 1991-05-28 |
| ATA190989A (de) | 1993-05-15 |
| AT396944B (de) | 1993-12-27 |
| DE58906243D1 (de) | 1994-01-05 |
| DE3828211C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-12-05 |
| DE3828211A1 (de) | 1990-02-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |