CA1303752C - Burn-in pads for tab interconnect structures - Google Patents
Burn-in pads for tab interconnect structuresInfo
- Publication number
- CA1303752C CA1303752C CA000594187A CA594187A CA1303752C CA 1303752 C CA1303752 C CA 1303752C CA 000594187 A CA000594187 A CA 000594187A CA 594187 A CA594187 A CA 594187A CA 1303752 C CA1303752 C CA 1303752C
- Authority
- CA
- Canada
- Prior art keywords
- burn
- pads
- tape
- conductors
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17309488A | 1988-03-28 | 1988-03-28 | |
US07/173,094 | 1988-03-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1303752C true CA1303752C (en) | 1992-06-16 |
Family
ID=22630520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000594187A Expired - Fee Related CA1303752C (en) | 1988-03-28 | 1989-03-20 | Burn-in pads for tab interconnect structures |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0364536A1 (ja) |
JP (1) | JPH02500221A (ja) |
CA (1) | CA1303752C (ja) |
WO (1) | WO1989009493A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5150047A (en) * | 1989-07-21 | 1992-09-22 | Nippon Steel Corporation | Member for use in assembly of integrated circuit elements and a method of testing assembled integrated circuit elements |
DE4204459A1 (de) * | 1992-02-14 | 1993-08-19 | Siemens Nixdorf Inf Syst | Filmtraegermontierter integrierter baustein |
FR2739742B1 (fr) * | 1995-10-09 | 1997-12-05 | Sagem | Procede de fabrication de module a micro-composants et support a circuits imprimes de liaison, et produit intermediaire de mise en oeuvre du procede |
JP3717660B2 (ja) | 1998-04-28 | 2005-11-16 | 株式会社ルネサステクノロジ | フィルムキャリア及びバーンイン方法 |
JP5215032B2 (ja) * | 2008-05-09 | 2013-06-19 | スパンション エルエルシー | 半導体装置の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4386389A (en) * | 1981-09-08 | 1983-05-31 | Mostek Corporation | Single layer burn-in tape for integrated circuit |
US4701363A (en) * | 1986-01-27 | 1987-10-20 | Olin Corporation | Process for manufacturing bumped tape for tape automated bonding and the product produced thereby |
-
1989
- 1989-03-14 EP EP89903601A patent/EP0364536A1/en not_active Withdrawn
- 1989-03-14 WO PCT/US1989/000965 patent/WO1989009493A1/en not_active Application Discontinuation
- 1989-03-14 JP JP1503366A patent/JPH02500221A/ja active Pending
- 1989-03-20 CA CA000594187A patent/CA1303752C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH02500221A (ja) | 1990-01-25 |
EP0364536A1 (en) | 1990-04-25 |
WO1989009493A1 (en) | 1989-10-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKLA | Lapsed |