CA1254294A - Stripline mount for semiconductor lasers - Google Patents

Stripline mount for semiconductor lasers

Info

Publication number
CA1254294A
CA1254294A CA000521619A CA521619A CA1254294A CA 1254294 A CA1254294 A CA 1254294A CA 000521619 A CA000521619 A CA 000521619A CA 521619 A CA521619 A CA 521619A CA 1254294 A CA1254294 A CA 1254294A
Authority
CA
Canada
Prior art keywords
mounting apparatus
transmission path
conductive layer
stripline transmission
stripline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000521619A
Other languages
English (en)
French (fr)
Inventor
Norman R. Dietrich
Anderson F. Johnson, Jr.
Walter R. Holbrook
Alfred Zacharias
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Application granted granted Critical
Publication of CA1254294A publication Critical patent/CA1254294A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • H01S5/02407Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02251Out-coupling of light using optical fibres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0233Mounting configuration of laser chips
    • H01S5/02345Wire-bonding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0235Method for mounting laser chips
    • H01S5/02355Fixing laser chips on mounts
    • H01S5/0237Fixing laser chips on mounts by soldering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/06226Modulation at ultra-high frequencies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
CA000521619A 1985-10-28 1986-10-28 Stripline mount for semiconductor lasers Expired CA1254294A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/792,055 US4761788A (en) 1985-10-28 1985-10-28 Stripline mount for semiconductor lasers
US792,055 1985-10-28

Publications (1)

Publication Number Publication Date
CA1254294A true CA1254294A (en) 1989-05-16

Family

ID=25155658

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000521619A Expired CA1254294A (en) 1985-10-28 1986-10-28 Stripline mount for semiconductor lasers

Country Status (5)

Country Link
US (1) US4761788A (https=)
EP (1) EP0252094B1 (https=)
JP (1) JPS63501187A (https=)
CA (1) CA1254294A (https=)
WO (1) WO1987002834A1 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073907B2 (ja) * 1987-07-03 1995-01-18 株式会社日立製作所 デュアルインラインパッケ−ジ形半導体レ−ザモジュ−ル
JPH0817260B2 (ja) * 1987-12-18 1996-02-21 株式会社日立製作所 駆動回路内蔵半導体レーザモジユール
JPH0714102B2 (ja) * 1988-01-28 1995-02-15 三菱電機株式会社 光結合装置
US4937660A (en) * 1988-12-21 1990-06-26 At&T Bell Laboratories Silicon-based mounting structure for semiconductor optical devices
JP2654988B2 (ja) * 1989-06-09 1997-09-17 松下電器産業株式会社 半導体レーザ装置
NL8901523A (nl) * 1989-06-16 1991-01-16 Philips Nv Laserdiode module.
US5264392A (en) * 1990-07-05 1993-11-23 At&T Bell Laboratories Fabrication technique for silicon-based optical subassemblies
US5113404A (en) * 1990-07-05 1992-05-12 At&T Bell Laboratories Silicon-based optical subassembly
DE4110378A1 (de) * 1991-03-28 1992-10-01 Standard Elektrik Lorenz Ag Einrichtung mit einem traegerteil, einem halbleiterlaser und kontaktierungen
FR2696603B1 (fr) * 1992-10-05 1995-01-06 France Telecom Tête laser perfectionnée.
US5444564A (en) * 1994-02-09 1995-08-22 Hughes Aircraft Company Optoelectronic controlled RF matching circuit
JPH07288351A (ja) * 1994-04-19 1995-10-31 Fujitsu Ltd ペルチェ制御回路及びその素子構造
JP3553222B2 (ja) * 1995-09-20 2004-08-11 三菱電機株式会社 光変調器モジュール
KR0171374B1 (ko) * 1995-11-17 1999-05-01 양승택 광집속렌즈를 포함하는 레이저 모듈 및 그 렌즈 고정방법
US5982793A (en) * 1996-05-20 1999-11-09 Matsushita Electric Industrial Co., Ltd. Semiconductor laser module with internal matching circuit
EP0961372B1 (de) * 1998-05-26 2002-07-10 Infineon Technologies AG Hochfrequenz-Lasermodul und Verfahren zur Herstellung desselben
US6320706B1 (en) 2000-02-24 2001-11-20 Lightwave Electronics Method and apparatus for positioning and fixating an optical element
CN100428592C (zh) * 2001-03-05 2008-10-22 富士施乐株式会社 发光元件驱动装置和发光元件驱动系统
DE60101308T2 (de) 2001-03-30 2004-08-26 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Laserdiodenanpassungsschaltung und Impedanzanpassungsverfahren dafür
US7049759B2 (en) * 2001-12-06 2006-05-23 Linear Technology Corporation Circuitry and methods for improving the performance of a light emitting element
EP1389812A1 (en) * 2002-08-13 2004-02-18 Agilent Technologies Inc A mounting arrangement for high frequency electro-optical components
KR101473650B1 (ko) 2012-11-30 2014-12-17 (주) 빛과 전자 온도 조절이 가능한 고속 전송용 레이저 다이오드
US9859680B2 (en) 2013-12-17 2018-01-02 Lasermax, Inc. Shock resistant laser module
CN111969397B (zh) * 2020-08-17 2023-10-24 索尔思光电股份有限公司 一种包边封装的tosa及光模块

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3757259A (en) * 1972-04-28 1973-09-04 Us Army Novel mounting technique for glass package diodes
US4023198A (en) * 1974-08-16 1977-05-10 Motorola, Inc. High frequency, high power semiconductor package
JPS5137548A (en) * 1974-09-26 1976-03-29 Daiichi Denshi Kogyo Dojikugatainpiidansuhenkanpatsudoyokaadoatsuteneeta narabini dojikugatainpiidansuhenkanpatsudo
GB1487010A (en) * 1975-04-01 1977-09-28 Standard Telephones Cables Ltd Laser stud mounts
DE2737345C2 (de) * 1976-08-20 1991-07-25 Canon K.K., Tokio/Tokyo Halbleiterlaser-Vorrichtung mit einem Peltier-Element
US4297653A (en) * 1979-04-30 1981-10-27 Xerox Corporation Hybrid semiconductor laser/detectors
US4301429A (en) * 1979-06-07 1981-11-17 Raytheon Company Microwave diode with high resistance layer
NL181963C (nl) * 1979-06-26 1987-12-01 Philips Nv Halfgeleiderlaserinrichting.
JPS594145A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体装置
GB2124402B (en) * 1982-07-27 1986-01-22 Standard Telephones Cables Ltd Injection laser packages
DE3330434A1 (de) * 1983-08-19 1985-03-07 Heinrich-Hertz-Institut für Nachrichtentechnik Berlin GmbH, 1000 Berlin Stabilisationseinrichtung fuer einen halbleiter-laser

Also Published As

Publication number Publication date
US4761788A (en) 1988-08-02
WO1987002834A1 (en) 1987-05-07
EP0252094B1 (en) 1991-03-13
EP0252094A1 (en) 1988-01-13
JPS63501187A (ja) 1988-04-28
JPH0482196B2 (https=) 1992-12-25

Similar Documents

Publication Publication Date Title
CA1254294A (en) Stripline mount for semiconductor lasers
US5898211A (en) Laser diode package with heat sink
KR100575969B1 (ko) 티오-캔 구조의 광 모듈
JP6995247B2 (ja) 光モジュール
US6404042B1 (en) Subcarrier and semiconductor device
US20190052049A1 (en) Optical module implementing laser diodes
US20170117683A1 (en) Thermally conductive, current carrying, electrically isolated submount for laser diode arrays
US20150132001A1 (en) Transmitter module outputting wavelength multiplexed light
US7034641B1 (en) Substrate structure for photonic assemblies and the like having a low-thermal-conductivity dielectric layer on a high-thermal-conductivity substrate body
TWI870154B (zh) 光模組
US10084284B2 (en) Light emitting device with extended mode-hop-free spectral tuning ranges and method of manufacture
US20020121671A1 (en) Semiconductor laser device and semiconductor laser module
JP7020590B1 (ja) レーザ光源装置
CA1281115C (en) Multilayer ceramic laser package
JP2003198051A (ja) 半導体レーザ装置および半導体レーザモジュール
TW202527408A (zh) 光模組及光收發器
TW202545097A (zh) 光模組
CN117117627B (zh) 一种激光单元和激光器
JP7420621B2 (ja) 配線部材の接続構造および光学装置
KR100216523B1 (ko) 전기흡수변조기 모듈 구조 및 그 제작방법
EP1079484A2 (en) Semiconductor laser device, semiconductor laser module, and fiber module
JP2001094189A (ja) セラミックパッケージ

Legal Events

Date Code Title Description
MKEX Expiry