CA1240409A - Ceramic microcircuit package - Google Patents

Ceramic microcircuit package

Info

Publication number
CA1240409A
CA1240409A CA000509029A CA509029A CA1240409A CA 1240409 A CA1240409 A CA 1240409A CA 000509029 A CA000509029 A CA 000509029A CA 509029 A CA509029 A CA 509029A CA 1240409 A CA1240409 A CA 1240409A
Authority
CA
Canada
Prior art keywords
package
microcircuit
base
feed line
feed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000509029A
Other languages
English (en)
French (fr)
Inventor
Thomas L. Read
Greg D. Pfeiffer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of CA1240409A publication Critical patent/CA1240409A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W44/20—
    • H10W76/15—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H10W72/884—
    • H10W90/754—

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Waveguide Connection Structure (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Multi-Conductor Connections (AREA)
CA000509029A 1985-07-25 1986-05-13 Ceramic microcircuit package Expired CA1240409A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US75952785A 1985-07-25 1985-07-25
US759,527 1985-07-25

Publications (1)

Publication Number Publication Date
CA1240409A true CA1240409A (en) 1988-08-09

Family

ID=25055989

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000509029A Expired CA1240409A (en) 1985-07-25 1986-05-13 Ceramic microcircuit package

Country Status (3)

Country Link
EP (1) EP0209642A3 (index.php)
JP (1) JPS6224501U (index.php)
CA (1) CA1240409A (index.php)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899118A (en) * 1988-12-27 1990-02-06 Hughes Aircraft Company Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4810904B1 (index.php) * 1969-03-12 1973-04-09
US3946428A (en) * 1973-09-19 1976-03-23 Nippon Electric Company, Limited Encapsulation package for a semiconductor element
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
US4276558A (en) * 1979-06-15 1981-06-30 Ford Aerospace & Communications Corp. Hermetically sealed active microwave integrated circuit
FR2538618B1 (fr) * 1982-12-28 1986-03-07 Inf Milit Spatiale Aeronaut Boitier pour composant electronique comportant un element fixant l'humidite
JPS607741A (ja) * 1983-06-27 1985-01-16 Nec Corp 混成集積回路装置

Also Published As

Publication number Publication date
EP0209642A3 (en) 1987-04-15
JPS6224501U (index.php) 1987-02-14
EP0209642A2 (en) 1987-01-28

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Legal Events

Date Code Title Description
MKEX Expiry