JPS6224501U - - Google Patents
Info
- Publication number
- JPS6224501U JPS6224501U JP1986114466U JP11446686U JPS6224501U JP S6224501 U JPS6224501 U JP S6224501U JP 1986114466 U JP1986114466 U JP 1986114466U JP 11446686 U JP11446686 U JP 11446686U JP S6224501 U JPS6224501 U JP S6224501U
- Authority
- JP
- Japan
- Prior art keywords
- microcircuit
- substrate
- shielding means
- enclosure
- coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W44/20—
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- H10W76/15—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H10W72/884—
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- H10W90/754—
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Waveguide Connection Structure (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75952785A | 1985-07-25 | 1985-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6224501U true JPS6224501U (index.php) | 1987-02-14 |
Family
ID=25055989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986114466U Pending JPS6224501U (index.php) | 1985-07-25 | 1986-07-25 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0209642A3 (index.php) |
| JP (1) | JPS6224501U (index.php) |
| CA (1) | CA1240409A (index.php) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4899118A (en) * | 1988-12-27 | 1990-02-06 | Hughes Aircraft Company | Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4810904B1 (index.php) * | 1969-03-12 | 1973-04-09 | ||
| US3946428A (en) * | 1973-09-19 | 1976-03-23 | Nippon Electric Company, Limited | Encapsulation package for a semiconductor element |
| US4242157A (en) * | 1979-04-20 | 1980-12-30 | Rockwell International Corporation | Method of assembly of microwave integrated circuits having a structurally continuous ground plane |
| US4276558A (en) * | 1979-06-15 | 1981-06-30 | Ford Aerospace & Communications Corp. | Hermetically sealed active microwave integrated circuit |
| FR2538618B1 (fr) * | 1982-12-28 | 1986-03-07 | Inf Milit Spatiale Aeronaut | Boitier pour composant electronique comportant un element fixant l'humidite |
| JPS607741A (ja) * | 1983-06-27 | 1985-01-16 | Nec Corp | 混成集積回路装置 |
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1986
- 1986-04-15 EP EP86105160A patent/EP0209642A3/en not_active Withdrawn
- 1986-05-13 CA CA000509029A patent/CA1240409A/en not_active Expired
- 1986-07-25 JP JP1986114466U patent/JPS6224501U/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0209642A3 (en) | 1987-04-15 |
| EP0209642A2 (en) | 1987-01-28 |
| CA1240409A (en) | 1988-08-09 |