CA1204588A - Method for doping tin oxide - Google Patents
Method for doping tin oxideInfo
- Publication number
- CA1204588A CA1204588A CA000429357A CA429357A CA1204588A CA 1204588 A CA1204588 A CA 1204588A CA 000429357 A CA000429357 A CA 000429357A CA 429357 A CA429357 A CA 429357A CA 1204588 A CA1204588 A CA 1204588A
- Authority
- CA
- Canada
- Prior art keywords
- sno2
- dispersion
- inorganic binder
- metal
- finely divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 title claims abstract description 164
- 238000000034 method Methods 0.000 title claims abstract description 37
- 229910001887 tin oxide Inorganic materials 0.000 title abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 157
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical compound O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 150000001875 compounds Chemical class 0.000 claims abstract description 16
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000012071 phase Substances 0.000 claims description 72
- 239000011230 binding agent Substances 0.000 claims description 61
- 239000006185 dispersion Substances 0.000 claims description 46
- 239000002245 particle Substances 0.000 claims description 42
- 239000007787 solid Substances 0.000 claims description 42
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 41
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 29
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 24
- 239000012298 atmosphere Substances 0.000 claims description 23
- 230000000694 effects Effects 0.000 claims description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 229910001634 calcium fluoride Inorganic materials 0.000 claims description 22
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 21
- 238000010304 firing Methods 0.000 claims description 21
- 238000002360 preparation method Methods 0.000 claims description 21
- 238000005245 sintering Methods 0.000 claims description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 17
- 229910011255 B2O3 Inorganic materials 0.000 claims description 15
- 239000000377 silicon dioxide Substances 0.000 claims description 15
- 235000012239 silicon dioxide Nutrition 0.000 claims description 15
- 229910052681 coesite Inorganic materials 0.000 claims description 14
- 229910052906 cristobalite Inorganic materials 0.000 claims description 14
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052682 stishovite Inorganic materials 0.000 claims description 14
- 229910052905 tridymite Inorganic materials 0.000 claims description 14
- 229910001512 metal fluoride Inorganic materials 0.000 claims description 13
- 239000007791 liquid phase Substances 0.000 claims description 12
- 229910052783 alkali metal Inorganic materials 0.000 claims description 11
- 150000001340 alkali metals Chemical class 0.000 claims description 11
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 11
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(II) oxide Inorganic materials [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims 10
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 10
- DDSPUNTXKUFWTM-UHFFFAOYSA-N oxygen(2-);tin(4+) Chemical compound [O-2].[O-2].[Sn+4] DDSPUNTXKUFWTM-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011521 glass Substances 0.000 description 51
- 239000000463 material Substances 0.000 description 23
- 239000010955 niobium Substances 0.000 description 19
- 239000000758 substrate Substances 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 239000007788 liquid Substances 0.000 description 10
- 229910052758 niobium Inorganic materials 0.000 description 10
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 238000003801 milling Methods 0.000 description 7
- 229910052715 tantalum Inorganic materials 0.000 description 7
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical group CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000005862 Whey Substances 0.000 description 3
- 102000007544 Whey Proteins Human genes 0.000 description 3
- 108010046377 Whey Proteins Proteins 0.000 description 3
- 238000000498 ball milling Methods 0.000 description 3
- 239000010953 base metal Substances 0.000 description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 239000012153 distilled water Substances 0.000 description 3
- 229920001249 ethyl cellulose Polymers 0.000 description 3
- 235000019325 ethyl cellulose Nutrition 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- 239000013008 thixotropic agent Substances 0.000 description 3
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000004279 X-ray Guinier Methods 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000004031 devitrification Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 239000003981 vehicle Substances 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- RUJPNZNXGCHGID-UHFFFAOYSA-N (Z)-beta-Terpineol Natural products CC(=C)C1CCC(C)(O)CC1 RUJPNZNXGCHGID-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 1
- ZUXNHFFVQWADJL-UHFFFAOYSA-N 3,4,5-trimethoxy-n-(2-methoxyethyl)-n-(4-phenyl-1,3-thiazol-2-yl)benzamide Chemical compound N=1C(C=2C=CC=CC=2)=CSC=1N(CCOC)C(=O)C1=CC(OC)=C(OC)C(OC)=C1 ZUXNHFFVQWADJL-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 241000931526 Acer campestre Species 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241000283986 Lepus Species 0.000 description 1
- 229910019704 Nb2O Inorganic materials 0.000 description 1
- 241001387976 Pera Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940037003 alum Drugs 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000006105 batch ingredient Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- CMHXYXQNKLCTDV-UHFFFAOYSA-N boric acid;silicon Chemical compound [Si].OB(O)O CMHXYXQNKLCTDV-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 208000037516 chromosome inversion disease Diseases 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000010908 decantation Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000011363 dried mixture Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005816 glass manufacturing process Methods 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 239000001035 lead pigment Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N nickel(II) oxide Inorganic materials [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- HCTVWSOKIJULET-LQDWTQKMSA-M phenoxymethylpenicillin potassium Chemical compound [K+].N([C@H]1[C@H]2SC([C@@H](N2C1=O)C([O-])=O)(C)C)C(=O)COC1=CC=CC=C1 HCTVWSOKIJULET-LQDWTQKMSA-M 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- QJVXKWHHAMZTBY-GCPOEHJPSA-N syringin Chemical compound COC1=CC(\C=C\CO)=CC(OC)=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QJVXKWHHAMZTBY-GCPOEHJPSA-N 0.000 description 1
- BSDGOJHPAHUWOO-QMHKHESXSA-N tan-67 Chemical compound C1([C@]23CCN(C[C@@H]2CC2=C(N)C4=CC=CC=C4N=C2C3)C)=CC=CC(O)=C1 BSDGOJHPAHUWOO-QMHKHESXSA-N 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 210000001550 testis Anatomy 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000002618 waking effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US38345282A | 1982-06-01 | 1982-06-01 | |
US383,452 | 1982-06-01 | ||
US06/460,572 US4548741A (en) | 1982-06-01 | 1983-01-24 | Method for doping tin oxide |
US460,572 | 1995-06-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1204588A true CA1204588A (en) | 1986-05-20 |
Family
ID=27010195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000429357A Expired CA1204588A (en) | 1982-06-01 | 1983-05-31 | Method for doping tin oxide |
Country Status (9)
Country | Link |
---|---|
US (1) | US4548741A (en, 2012) |
EP (1) | EP0095775B1 (en, 2012) |
JP (3) | JPH0636401B2 (en, 2012) |
KR (1) | KR880001308B1 (en, 2012) |
CA (1) | CA1204588A (en, 2012) |
DE (1) | DE3363035D1 (en, 2012) |
DK (1) | DK159128C (en, 2012) |
GR (1) | GR77479B (en, 2012) |
IE (1) | IE54864B1 (en, 2012) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0132810A1 (en) * | 1983-07-25 | 1985-02-13 | E.I. Du Pont De Nemours And Company | Borosilicate glass composition |
US4537703A (en) * | 1983-12-19 | 1985-08-27 | E. I. Du Pont De Nemours And Company | Borosilicate glass compositions |
US4536329A (en) * | 1983-12-19 | 1985-08-20 | E. I. Du Pont De Nemours And Company | Borosilicate glass compositions |
US4548742A (en) * | 1983-12-19 | 1985-10-22 | E. I. Du Pont De Nemours And Company | Resistor compositions |
US4652397A (en) * | 1984-12-17 | 1987-03-24 | E. I. Du Pont De Nemours And Company | Resistor compositions |
US4645621A (en) * | 1984-12-17 | 1987-02-24 | E. I. Du Pont De Nemours And Company | Resistor compositions |
US4810584A (en) * | 1985-03-27 | 1989-03-07 | North China Research Institute Of Electro-Optics | Lithium tantalum oxide coated tantalum articles with improved wear resistance and process for providing the same |
US4654166A (en) * | 1986-06-13 | 1987-03-31 | E. I. Du Pont De Nemours And Company | Resistor compositions |
US4966926A (en) * | 1988-08-01 | 1990-10-30 | E. I. Du Pont De Nemours And Company | Encapsulant composition |
JP2802770B2 (ja) * | 1989-03-31 | 1998-09-24 | 昭栄化学工業株式会社 | 抵抗組成物 |
US5242623A (en) * | 1991-08-13 | 1993-09-07 | E. I. Du Pont De Nemours And Company | Screen-printable thick film paste composition |
GB9321481D0 (en) * | 1993-10-18 | 1993-12-08 | Alcan Int Ltd | Tin oxide |
US5569412A (en) * | 1994-08-18 | 1996-10-29 | E. I. Du Pont De Nemours And Company | Tin oxide based conductive powders and coatings |
US5622547A (en) * | 1995-08-14 | 1997-04-22 | National Starch And Chemical Investment Holding Corporation | Vehicle system for thick film inks |
US5962865A (en) * | 1997-04-11 | 1999-10-05 | Trw Inc. | Low inductance superconductive integrated circuit and method of fabricating the same |
US6524647B1 (en) | 2000-03-24 | 2003-02-25 | Pilkington Plc | Method of forming niobium doped tin oxide coatings on glass and coated glass formed thereby |
GB0326991D0 (en) * | 2003-11-20 | 2003-12-24 | Johnson Matthey Plc | Pigments |
US20090239363A1 (en) * | 2008-03-24 | 2009-09-24 | Honeywell International, Inc. | Methods for forming doped regions in semiconductor substrates using non-contact printing processes and dopant-comprising inks for forming such doped regions using non-contact printing processes |
US20100035422A1 (en) * | 2008-08-06 | 2010-02-11 | Honeywell International, Inc. | Methods for forming doped regions in a semiconductor material |
US8053867B2 (en) * | 2008-08-20 | 2011-11-08 | Honeywell International Inc. | Phosphorous-comprising dopants and methods for forming phosphorous-doped regions in semiconductor substrates using phosphorous-comprising dopants |
US7951696B2 (en) * | 2008-09-30 | 2011-05-31 | Honeywell International Inc. | Methods for simultaneously forming N-type and P-type doped regions using non-contact printing processes |
US8518170B2 (en) * | 2008-12-29 | 2013-08-27 | Honeywell International Inc. | Boron-comprising inks for forming boron-doped regions in semiconductor substrates using non-contact printing processes and methods for fabricating such boron-comprising inks |
US8324089B2 (en) * | 2009-07-23 | 2012-12-04 | Honeywell International Inc. | Compositions for forming doped regions in semiconductor substrates, methods for fabricating such compositions, and methods for forming doped regions using such compositions |
US8629294B2 (en) | 2011-08-25 | 2014-01-14 | Honeywell International Inc. | Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants |
US8975170B2 (en) | 2011-10-24 | 2015-03-10 | Honeywell International Inc. | Dopant ink compositions for forming doped regions in semiconductor substrates, and methods for fabricating dopant ink compositions |
KR101862842B1 (ko) * | 2014-09-04 | 2018-05-30 | 비와이디 컴퍼니 리미티드 | 중합체 기재를 선택적으로 금속화시키기 위한 중합체 생성물 및 방법 |
WO2018155033A1 (ja) | 2017-02-23 | 2018-08-30 | 国立研究開発法人産業技術総合研究所 | 酸化物半導体及び半導体装置 |
KR102741316B1 (ko) * | 2018-10-31 | 2024-12-12 | 쇼에이 가가쿠 가부시키가이샤 | Ni 페이스트 및 적층 세라믹 콘덴서 |
CN110668808B (zh) * | 2019-10-17 | 2022-07-22 | 新疆大学 | 电力系统输电用高非线性、低残压、大通流容量的SnO2压敏电阻的制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2490825A (en) * | 1946-02-01 | 1949-12-13 | Corning Glass Works | Electrically conducting refractory compositions |
FR1483744A (fr) * | 1965-12-08 | 1967-06-09 | Electronique & Automatisme Sa | Couche résistive mince perfectionnée |
US3974107A (en) * | 1974-03-27 | 1976-08-10 | E. I. Dupont De Nemours And Company | Resistors and compositions therefor |
US4065743A (en) * | 1975-03-21 | 1977-12-27 | Trw, Inc. | Resistor material, resistor made therefrom and method of making the same |
US4129525A (en) * | 1977-12-02 | 1978-12-12 | Exxon Research & Engineering Co. | Method of making lead-rich and bismuth-rich pyrochlore compounds using an alkaline medium |
US4163706A (en) * | 1977-12-02 | 1979-08-07 | Exxon Research & Engineering Co. | Bi2 [M2-x Bix ]O7-y compounds wherein M is Ru, Ir or mixtures thereof, and electrochemical devices containing same (Bat-24) |
US4176094A (en) * | 1977-12-02 | 1979-11-27 | Exxon Research & Engineering Co. | Method of making stoichiometric lead and bismuth pyrochlore compounds using an alkaline medium |
US4302362A (en) * | 1979-01-23 | 1981-11-24 | E. I. Du Pont De Nemours And Company | Stable pyrochlore resistor compositions |
US4476039A (en) * | 1983-01-21 | 1984-10-09 | E. I. Du Pont De Nemours And Company | Stain-resistant ruthenium oxide-based resistors |
-
1983
- 1983-01-24 US US06/460,572 patent/US4548741A/en not_active Expired - Lifetime
- 1983-05-30 IE IE1280/83A patent/IE54864B1/en not_active IP Right Cessation
- 1983-05-31 DK DK246583A patent/DK159128C/da not_active IP Right Cessation
- 1983-05-31 EP EP83105384A patent/EP0095775B1/en not_active Expired
- 1983-05-31 CA CA000429357A patent/CA1204588A/en not_active Expired
- 1983-05-31 DE DE8383105384T patent/DE3363035D1/de not_active Expired
- 1983-06-01 GR GR71536A patent/GR77479B/el unknown
- 1983-06-01 KR KR1019830002438A patent/KR880001308B1/ko not_active Expired
-
1991
- 1991-04-16 JP JP3084247A patent/JPH0636401B2/ja not_active Expired - Lifetime
- 1991-04-16 JP JP3084243A patent/JPH06653B2/ja not_active Expired - Lifetime
- 1991-04-16 JP JP3084238A patent/JPH07111923B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0636401B2 (ja) | 1994-05-11 |
IE831280L (en) | 1983-12-01 |
US4548741A (en) | 1985-10-22 |
JPH07111923B2 (ja) | 1995-11-29 |
JPH0645114A (ja) | 1994-02-18 |
DE3363035D1 (en) | 1986-05-22 |
DK159128C (da) | 1991-02-04 |
IE54864B1 (en) | 1990-02-28 |
JPH06653B2 (ja) | 1994-01-05 |
KR840005265A (ko) | 1984-11-05 |
KR880001308B1 (ko) | 1988-07-22 |
DK246583A (da) | 1983-12-02 |
EP0095775B1 (en) | 1986-04-16 |
JPH0590004A (ja) | 1993-04-09 |
JPH04305021A (ja) | 1992-10-28 |
DK159128B (da) | 1990-09-03 |
EP0095775A1 (en) | 1983-12-07 |
DK246583D0 (da) | 1983-05-31 |
GR77479B (en, 2012) | 1984-09-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA1204588A (en) | Method for doping tin oxide | |
EP0718855B1 (en) | Cadmium-free and lead-free thick film paste composition | |
EP0071190B1 (en) | Thick film resistor compositions | |
EP0132810A1 (en) | Borosilicate glass composition | |
US4707346A (en) | Method for doping tin oxide | |
IE55141B1 (en) | Stain-resistant ruthenium oxide-based resistors | |
EP0185349B1 (en) | Thick film resistor compositions | |
EP0185321B1 (en) | Resistor compositions | |
US4537703A (en) | Borosilicate glass compositions | |
US4548742A (en) | Resistor compositions | |
EP0206282B1 (en) | Hexaboride resistor composition | |
EP0134037B1 (en) | Hexaboride resistor composition | |
EP0146118B1 (en) | Borosilicate glass compositions | |
US4613539A (en) | Method for doping tin oxide | |
US20040043885A1 (en) | Thick film compositions containing pyrochlore-related compounds | |
EP0563838B1 (en) | Thick film resistor composition | |
US4652397A (en) | Resistor compositions | |
JPH0422005B2 (en, 2012) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEX | Expiry |