CA1151277A - Methode de fixation d'une fibre optique dans un boitier de laser hermetique - Google Patents

Methode de fixation d'une fibre optique dans un boitier de laser hermetique

Info

Publication number
CA1151277A
CA1151277A CA000370663A CA370663A CA1151277A CA 1151277 A CA1151277 A CA 1151277A CA 000370663 A CA000370663 A CA 000370663A CA 370663 A CA370663 A CA 370663A CA 1151277 A CA1151277 A CA 1151277A
Authority
CA
Canada
Prior art keywords
electro
thermoelectric device
package
fusible alloy
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000370663A
Other languages
English (en)
Inventor
Tibor F. I. Kovats
Tibor F. Devenyi
Christopher Michael Look
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Corp
Original Assignee
Northern Telecom Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Telecom Ltd filed Critical Northern Telecom Ltd
Priority to CA000370663A priority Critical patent/CA1151277A/fr
Application granted granted Critical
Publication of CA1151277A publication Critical patent/CA1151277A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
CA000370663A 1981-02-11 1981-02-11 Methode de fixation d'une fibre optique dans un boitier de laser hermetique Expired CA1151277A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000370663A CA1151277A (fr) 1981-02-11 1981-02-11 Methode de fixation d'une fibre optique dans un boitier de laser hermetique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA000370663A CA1151277A (fr) 1981-02-11 1981-02-11 Methode de fixation d'une fibre optique dans un boitier de laser hermetique

Publications (1)

Publication Number Publication Date
CA1151277A true CA1151277A (fr) 1983-08-02

Family

ID=4119163

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000370663A Expired CA1151277A (fr) 1981-02-11 1981-02-11 Methode de fixation d'une fibre optique dans un boitier de laser hermetique

Country Status (1)

Country Link
CA (1) CA1151277A (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0196875A1 (fr) * 1985-03-29 1986-10-08 BRITISH TELECOMMUNICATIONS public limited company Montage pour composant optique
FR2582413A1 (fr) * 1985-05-23 1986-11-28 Comp Generale Electricite Procede de couplage d'une fibre optique a un composant optoelectronique sur une embase
EP0243057A1 (fr) * 1986-04-23 1987-10-28 Stc Plc Module de transmission optique
EP0264335A1 (fr) * 1986-10-17 1988-04-20 Thomson Hybrides Et Microondes Module pour le couplage entre un dispositif semiconducteur et une fibre optique, et procédé d'alignement de ce dispositif semiconducteur et de cette fibre
EP0628840A1 (fr) * 1993-04-13 1994-12-14 Corning Incorporated Méthode pour encapsuler des composants optiques et des produits fabriqués par cette méthode
EP1324088A2 (fr) * 2001-12-19 2003-07-02 Trw Inc. Soudure laser coaxiale au travers du couvercle d'un boitier photonique

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0196875A1 (fr) * 1985-03-29 1986-10-08 BRITISH TELECOMMUNICATIONS public limited company Montage pour composant optique
US4844581A (en) * 1985-04-23 1989-07-04 Stc Plc Optical transmission package
FR2582413A1 (fr) * 1985-05-23 1986-11-28 Comp Generale Electricite Procede de couplage d'une fibre optique a un composant optoelectronique sur une embase
EP0243057A1 (fr) * 1986-04-23 1987-10-28 Stc Plc Module de transmission optique
EP0264335A1 (fr) * 1986-10-17 1988-04-20 Thomson Hybrides Et Microondes Module pour le couplage entre un dispositif semiconducteur et une fibre optique, et procédé d'alignement de ce dispositif semiconducteur et de cette fibre
FR2605418A1 (fr) * 1986-10-17 1988-04-22 Thomson Semiconducteurs Module pour le couplage entre un dispositif semi-conducteur et une fibre optique, et procede d'alignement de ce dispositif semi-conducteur et de cette fibre
US4807956A (en) * 1986-10-17 1989-02-28 Thomson Hybrides Et Microondes Opto-electronic head for the coupling of a semi-conductor device with an optic fiber, and a method to align this semi-conductor device with this fiber
EP0628840A1 (fr) * 1993-04-13 1994-12-14 Corning Incorporated Méthode pour encapsuler des composants optiques et des produits fabriqués par cette méthode
US5475784A (en) * 1993-04-13 1995-12-12 Corning Incorporated Method of encapsulating optical components and products produced by that method
EP1324088A2 (fr) * 2001-12-19 2003-07-02 Trw Inc. Soudure laser coaxiale au travers du couvercle d'un boitier photonique
EP1324088A3 (fr) * 2001-12-19 2004-05-19 Northrop Grumman Corporation Soudure laser coaxiale au travers du couvercle d'un boitier photonique

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Legal Events

Date Code Title Description
MKEX Expiry
MKEX Expiry

Effective date: 20000802