CA1151277A - Method of anchoring optical fiber in the hermetic laser package - Google Patents
Method of anchoring optical fiber in the hermetic laser packageInfo
- Publication number
- CA1151277A CA1151277A CA000370663A CA370663A CA1151277A CA 1151277 A CA1151277 A CA 1151277A CA 000370663 A CA000370663 A CA 000370663A CA 370663 A CA370663 A CA 370663A CA 1151277 A CA1151277 A CA 1151277A
- Authority
- CA
- Canada
- Prior art keywords
- electro
- thermoelectric device
- package
- fusible alloy
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000013307 optical fiber Substances 0.000 title claims abstract description 15
- 238000004873 anchoring Methods 0.000 title claims abstract description 8
- 238000000034 method Methods 0.000 title claims abstract description 6
- 239000000835 fiber Substances 0.000 claims abstract description 29
- 229910000743 fusible alloy Inorganic materials 0.000 claims abstract description 23
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 230000002441 reversible effect Effects 0.000 claims description 3
- 230000005679 Peltier effect Effects 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 8
- 239000000956 alloy Substances 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
METHOD OF ANCHORING OPTICAL FIBER
IN THE HERMETIC LASER PACKAGE
Abstract of the Disclosure An electro-optic package incorporating a semiconductor laser requires a temperature sensor for controlling an electrically operated cooler. An optical fiber end portion is anchored close to the laser to receive light from it. Usually the fiber is anchored by a mass of cured epoxy. This invention proposes using a mass of fusible alloy which is melted and solidified using a cooler in which the polarity of drive current is reversed to convert the cooler into a heater. The temperature sensor is used to maintain the temperature in the package below the alloy melting point while the fiber is positioned.
- i -
IN THE HERMETIC LASER PACKAGE
Abstract of the Disclosure An electro-optic package incorporating a semiconductor laser requires a temperature sensor for controlling an electrically operated cooler. An optical fiber end portion is anchored close to the laser to receive light from it. Usually the fiber is anchored by a mass of cured epoxy. This invention proposes using a mass of fusible alloy which is melted and solidified using a cooler in which the polarity of drive current is reversed to convert the cooler into a heater. The temperature sensor is used to maintain the temperature in the package below the alloy melting point while the fiber is positioned.
- i -
Description
~lslm This invention relates to laser and LED packages for use in fiber optic communication systems. A typical package for use in a fiber optic system basically comprises a laser diode of the double heterostructure type, mounted within a housing. High temperature resulting from normal laser operation both accelerates aging and causes fluctuation of light output. To retard aging, the laser has a heat sink which is mounted upon, and cooled by, a thermoelectric cooler. Also housed within such a package are a temperature sensor for monitoring the temperature of the heat sink and an avalanche photodiode for monitoring output from the laser. Electrical outputs from the sensor and the photodetector control the drive current applied to the cooler and the laser respectively. Leads to electrical elements within the housing are taken through a housing wall at hermetic feedthroughs. In addition, an optical fiber also mounted in a hermetic feedthrough in the housing wall has a bared end portion anchored in a mass of cured epoxy resin in a position and orientation in which the fiber end receives light from the laser front facet.
Epoxy resin is not an ideal material for anchoring an optical fiber. For one thing, the room temperature curing time is long;
furthermore, the curing reaction is irreversible. Consequently, to remove the fiber it must be broken out of the cured resin with the attendant risk of leaving detritus on both the fiber and laser. Fusible alloys represent a possible alternative material for anchoring a bared fiber, such material offering one advantage that it can be melted and solidified repeatedly.
Fusible alloys are, however, not ideal for this purpose since, to melt the alloy heat must be applied so very close to the fiber and other elements inside the package that damage may result. Thus if a soldering iron is ~151Z77 used and contacts the fiber it can cause breakage and contamination.
Moreover, it is difficult to control the temperature of miniature, heat sensitive parts such as the laser near a soldering iron tip.
It is now proposed that a thermoelectric device operable in one mode as a cooler and operable in another mode as a heater be substituted for the laser cooler of prior optical source packages. The thermoelectric device can be used in its heating mode to melt the fusible alloy prior to anchoring the fiber or when removing the fiber from the package and in its cooling mode to cool the laser during normal operation.
According to one aspect of the invention there is provided an electro-optic package comprising: a housing, a thermoelectric device within the housing and, mounted to the thermoelectric device, a light emitting source and a mass of fusible alloy, the thermoelectric device operable in one mode as a heater for melting the fusible alloy and operable in another mode as a cooler for cooling the light emitting device.
Preferably a portion of an optical fiber is anchored in the mass of fusible alloy in a position in which light emitted from the light emitting device is incident on an end surface of the fiber. The fusible alloy preferably has a melting point in the range 90-100C. The alloy can have a composition containing indium to give low melting point. The light emitting device, for example a laser diode or light emitting diode, preferably has a heat sink bonded to a surface of the thermoelectric device.
Preferably the operating modes of the thermoelectric device are related to current polarity through the device.
.
, .
~5~277 The housing preferably also contains a temperature sensor forming part of a feedback circuit controlling said thermoelectric device.
According to another aspect of the invention there is provided a method for anchoring an optical fiber in an electro-optic package housing a light emitting device, the package also housing a thermoelectric device operable in a first mode as a heater and operable in a second mode as a cooler to cool a light emitting device mounted thereon, the method comprising operating the thermoelectric device in said first mode while contacting the thermoelectric device with a low melting point fusible alloy to deposit molten fusible alloy on the thermoelectric device, leading one end of an optical fiber into the housing, manipulating the end portion to obtain a predetermined positional relationship between the fiber end surface and the light emitting device with part of the fiber end portion contacting the molten fusible alloy, and then discontinuing heating by said thermoelectric device whereby to solidify the fusible alloy and anchor the fiber end portion.
An embodiment of the invention will now be described by way of example with reference to the accompanying drawings in which:-Figure 1 is a plan view of a package according to the invention;
Figure 2 is a longitudinal sectional view of the Figure 1package; and Figure 3 shows a circuit schematic drawing of the Figure l package.
Referring in detail to Figures 1 and 2, a laser package 10 has a semiconductor laser 12, for example, of the GaAlAs double heterostructure type mounted within a Kovar (RTM) housing 14. The laser - " ', '`~
1~5~277 12 is mounted on a pedestal 16 forming part of a conducting metal heat sink 18. In front of the pedestal 16 a capillary break 20 extends across the heat sink 18 and behind the pedestal a ceramic substrate 22 is bonded to the heat sink. The heat sink 18 is mounted on a thermoelectric device 24 which can be operated both to heat and cool an upper surface 26 contacting the heat sink 18. A suitable subminiature thermoelectric device 24 is available from Melcor Materials Electronic Products Corporation under the specification number FS0.6-12-06L. The device 24 ut;lizes the Peltier effect and in both its heating and cooling modes is characterized by one surface being hot and the reverse surface being cold.
The device, which measures only 0.24 inches x 0.16 inches x 0.11 inches, incorporates beryllia ceramic plates having the property of high electrical insulation with good thermal conductivity. To the ceramic substrate 22 are bonded a photodiode 28 and a temperature sensor 30 incorporating a thermistor. The photodetector 28 and the sensor 30 are addressed by contact pads 32 printed on the substrate 22. Leads 34 to all the electrical elements within the package 10 extend from pins 36 hermetically sealed into a wall 38 at feedthroughs 41. In an end wall 40 of the housing is mounted an optical fiber hermetic feedthrough 42. The feedthrough 42 and the nature of pin feedthroughs 41 are incidental to the present invention and so will not be described in detail. An end portion of an optical fiber 44, stripped of protective jacket, enters the package 10 at the optical feedthrough 42 and is anchored in place by a mass of fused alloy 46 sited on the heat sink 18 in front of the capillary break 20.
A preferred alloy is Indalloy No. 8, having a composition of 44% indium, 42% tin and 14% cadmium. The indium content ensures a relatively low melting point of 93C.
1~51Z~7 As indicated previously the thermoelectric device can be operated as either a heater or cooler. A suitahle circuit for driving the thermoelectric device in its heating mode to melt the fusible alloy is shown in Figure 3. The package 10, indicated by a broken line, houses the thermoelectric device 24 and temperature sensor 30. The control circuit which is located outside the housing has a 5 volt supply which together with a controlling resistor R1 and voltage divider R2/R3 establishes a predetermined voltage at one terminal of a comparator 48. A variable resistor R4 and thermistor Rt determine the voltage at the other terminal of the comparator 48. An output from the comparator is amplified by emitter follower and common emitter stages 5~ and 52 respectively, and drives the thermoelectric device to heat its top surface 26. A threshold temperature in the package is set by resistor R4. The resistance of Rt increases as the temperature of surface 26 increases until the threshold is reached at which current to the thermoelectric device is stopped.
In the cooling mode the control circuit is replaced by another control circuit providing a fixed current of reverse polarity so as to cool the top surface 26. The thermistor Rt is used in a feedback circuit to regulate the current supply to the laser 12.
When anchoring the optical fiber 44 to the top surface 26 of the device 24, the thermoelectric device is heated to about 110C and the Indalloy which has a melting point of 93C is deposited onto the top surface by rubbing with a piece of solid, fusable alloy. Flux, which is usually used to obtain wetting by a fusible alloy is undesirable since, in normal laser operation at high temperature it can volatilize and contaminate the laser or other elements in the package. By maintaining current through the thermoelectric device 24 a pool of molten solder is ~lSlZ77 retained on the thermoelectric device top surface. The molten alloy is prevented from contacting the laser 12 or the fiber end face 54 by the capillary break 20.
With the optical fiber hermetic feedthrough 42 brazed onto the package wall 40, a projecting end portion of the fiber extends to just short of the laser site. The fiber end portion is then manipulated until the fiber end face 54 is at a position and orientation in which it receives a predetermined light output from the laser 12. Positioning of the fiber 44 is performed while the laser 12 is operating, light launched into the fiber from the laser being monitored at a remote end of the fiber. The temperature sensor meanwhile ensures that at no time during the heating cycle does the thermoelectric device top surface 26 reach such a high temperature that elements within the package 10 might be adversely affected or that solder used within the device 24 is melted. As soon as the fiber 44 is correctly positioned, current to the thermoelectric device is stopped to initiate cooling and subsequent alloy solidification to anchor the fiber 44 in place.
Epoxy resin is not an ideal material for anchoring an optical fiber. For one thing, the room temperature curing time is long;
furthermore, the curing reaction is irreversible. Consequently, to remove the fiber it must be broken out of the cured resin with the attendant risk of leaving detritus on both the fiber and laser. Fusible alloys represent a possible alternative material for anchoring a bared fiber, such material offering one advantage that it can be melted and solidified repeatedly.
Fusible alloys are, however, not ideal for this purpose since, to melt the alloy heat must be applied so very close to the fiber and other elements inside the package that damage may result. Thus if a soldering iron is ~151Z77 used and contacts the fiber it can cause breakage and contamination.
Moreover, it is difficult to control the temperature of miniature, heat sensitive parts such as the laser near a soldering iron tip.
It is now proposed that a thermoelectric device operable in one mode as a cooler and operable in another mode as a heater be substituted for the laser cooler of prior optical source packages. The thermoelectric device can be used in its heating mode to melt the fusible alloy prior to anchoring the fiber or when removing the fiber from the package and in its cooling mode to cool the laser during normal operation.
According to one aspect of the invention there is provided an electro-optic package comprising: a housing, a thermoelectric device within the housing and, mounted to the thermoelectric device, a light emitting source and a mass of fusible alloy, the thermoelectric device operable in one mode as a heater for melting the fusible alloy and operable in another mode as a cooler for cooling the light emitting device.
Preferably a portion of an optical fiber is anchored in the mass of fusible alloy in a position in which light emitted from the light emitting device is incident on an end surface of the fiber. The fusible alloy preferably has a melting point in the range 90-100C. The alloy can have a composition containing indium to give low melting point. The light emitting device, for example a laser diode or light emitting diode, preferably has a heat sink bonded to a surface of the thermoelectric device.
Preferably the operating modes of the thermoelectric device are related to current polarity through the device.
.
, .
~5~277 The housing preferably also contains a temperature sensor forming part of a feedback circuit controlling said thermoelectric device.
According to another aspect of the invention there is provided a method for anchoring an optical fiber in an electro-optic package housing a light emitting device, the package also housing a thermoelectric device operable in a first mode as a heater and operable in a second mode as a cooler to cool a light emitting device mounted thereon, the method comprising operating the thermoelectric device in said first mode while contacting the thermoelectric device with a low melting point fusible alloy to deposit molten fusible alloy on the thermoelectric device, leading one end of an optical fiber into the housing, manipulating the end portion to obtain a predetermined positional relationship between the fiber end surface and the light emitting device with part of the fiber end portion contacting the molten fusible alloy, and then discontinuing heating by said thermoelectric device whereby to solidify the fusible alloy and anchor the fiber end portion.
An embodiment of the invention will now be described by way of example with reference to the accompanying drawings in which:-Figure 1 is a plan view of a package according to the invention;
Figure 2 is a longitudinal sectional view of the Figure 1package; and Figure 3 shows a circuit schematic drawing of the Figure l package.
Referring in detail to Figures 1 and 2, a laser package 10 has a semiconductor laser 12, for example, of the GaAlAs double heterostructure type mounted within a Kovar (RTM) housing 14. The laser - " ', '`~
1~5~277 12 is mounted on a pedestal 16 forming part of a conducting metal heat sink 18. In front of the pedestal 16 a capillary break 20 extends across the heat sink 18 and behind the pedestal a ceramic substrate 22 is bonded to the heat sink. The heat sink 18 is mounted on a thermoelectric device 24 which can be operated both to heat and cool an upper surface 26 contacting the heat sink 18. A suitable subminiature thermoelectric device 24 is available from Melcor Materials Electronic Products Corporation under the specification number FS0.6-12-06L. The device 24 ut;lizes the Peltier effect and in both its heating and cooling modes is characterized by one surface being hot and the reverse surface being cold.
The device, which measures only 0.24 inches x 0.16 inches x 0.11 inches, incorporates beryllia ceramic plates having the property of high electrical insulation with good thermal conductivity. To the ceramic substrate 22 are bonded a photodiode 28 and a temperature sensor 30 incorporating a thermistor. The photodetector 28 and the sensor 30 are addressed by contact pads 32 printed on the substrate 22. Leads 34 to all the electrical elements within the package 10 extend from pins 36 hermetically sealed into a wall 38 at feedthroughs 41. In an end wall 40 of the housing is mounted an optical fiber hermetic feedthrough 42. The feedthrough 42 and the nature of pin feedthroughs 41 are incidental to the present invention and so will not be described in detail. An end portion of an optical fiber 44, stripped of protective jacket, enters the package 10 at the optical feedthrough 42 and is anchored in place by a mass of fused alloy 46 sited on the heat sink 18 in front of the capillary break 20.
A preferred alloy is Indalloy No. 8, having a composition of 44% indium, 42% tin and 14% cadmium. The indium content ensures a relatively low melting point of 93C.
1~51Z~7 As indicated previously the thermoelectric device can be operated as either a heater or cooler. A suitahle circuit for driving the thermoelectric device in its heating mode to melt the fusible alloy is shown in Figure 3. The package 10, indicated by a broken line, houses the thermoelectric device 24 and temperature sensor 30. The control circuit which is located outside the housing has a 5 volt supply which together with a controlling resistor R1 and voltage divider R2/R3 establishes a predetermined voltage at one terminal of a comparator 48. A variable resistor R4 and thermistor Rt determine the voltage at the other terminal of the comparator 48. An output from the comparator is amplified by emitter follower and common emitter stages 5~ and 52 respectively, and drives the thermoelectric device to heat its top surface 26. A threshold temperature in the package is set by resistor R4. The resistance of Rt increases as the temperature of surface 26 increases until the threshold is reached at which current to the thermoelectric device is stopped.
In the cooling mode the control circuit is replaced by another control circuit providing a fixed current of reverse polarity so as to cool the top surface 26. The thermistor Rt is used in a feedback circuit to regulate the current supply to the laser 12.
When anchoring the optical fiber 44 to the top surface 26 of the device 24, the thermoelectric device is heated to about 110C and the Indalloy which has a melting point of 93C is deposited onto the top surface by rubbing with a piece of solid, fusable alloy. Flux, which is usually used to obtain wetting by a fusible alloy is undesirable since, in normal laser operation at high temperature it can volatilize and contaminate the laser or other elements in the package. By maintaining current through the thermoelectric device 24 a pool of molten solder is ~lSlZ77 retained on the thermoelectric device top surface. The molten alloy is prevented from contacting the laser 12 or the fiber end face 54 by the capillary break 20.
With the optical fiber hermetic feedthrough 42 brazed onto the package wall 40, a projecting end portion of the fiber extends to just short of the laser site. The fiber end portion is then manipulated until the fiber end face 54 is at a position and orientation in which it receives a predetermined light output from the laser 12. Positioning of the fiber 44 is performed while the laser 12 is operating, light launched into the fiber from the laser being monitored at a remote end of the fiber. The temperature sensor meanwhile ensures that at no time during the heating cycle does the thermoelectric device top surface 26 reach such a high temperature that elements within the package 10 might be adversely affected or that solder used within the device 24 is melted. As soon as the fiber 44 is correctly positioned, current to the thermoelectric device is stopped to initiate cooling and subsequent alloy solidification to anchor the fiber 44 in place.
Claims (12)
OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. An electro-optic package comprising:-a housing, a thermoelectric device within the housing and, mounted to the thermoelectric device, a light emitting source and a mass of fusible alloy, the thermoelectric device operable in one mode as a heater for melting the fusible alloy and operable in another mode as a cooler for cooling the light emitting device.
2. An electro-optic package as claimed in claim 1, in which a portion of an optical fiber is anchored in said mass of fusible alloy in a position in which light emitted from the light emitting device is incident on an end surface of the fiber.
3. An electro-optic device as claimed in claim 1, in which the fusible alloy has a melting point in the range 85°C to 100°C.
4. An electro-optic package as claimed in claim 3, in which the fusible alloy contains indium.
5. An electro-optic package as claimed in claim 1, in which the light emitting device is one of the group consisting of a laser diode and a light emitting diode (LED).
6. An electro-optic package as claimed in claim 1, in which the thermoelectric device operates in said one mode when a voltage of one polarity is applied thereto and operates in the other mode when a voltage of reverse polarity is applied thereto.
7. An electro-optic device as claimed in claim 6, in which the thermoelectric device operates on the Peltier effect.
8. An electro-optic device as claimed in claim 1, in which the housing also contains a temperature sensor.
9. An electro-optic package as claimed in claim 8, in which the temperature sensor includes a thermistor contacting said thermoelectric device surface.
10. An electro-optic package as claimed in claim 8, in which the temperature sensor is one element of an electrical sensing circuit, the electrical sensing circuit having an output controlling the thermoelectric device.
11. An electro-optic package as claimed in claim 1, in which the housing is hermetically sealed.
12. A method for anchoring an optical fiber in an electro-optic package housing a light emitting device, the package also housing a thermoelectric device operable in a first mode as a heater and operable in a second mode as a cooler to cool a light emitting device mounted thereon, the method comprising:-operating the thermoelectric device in said first mode and contacting the thermoelectric device with a low melting point fusible alloy to deposit molten fusible alloy on the thermoelectric device, leading one end portion of an optical fiber into the housing, manipulating the end portion to obtain a predetermined positional relationship between the fiber end surface and the light emitting device with part of the fiber end portion contacting the molten fusible alloy, and then discontinuing heating by said thermoelectric device whereby to solidify the fusible alloy and anchor the fiber end portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000370663A CA1151277A (en) | 1981-02-11 | 1981-02-11 | Method of anchoring optical fiber in the hermetic laser package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000370663A CA1151277A (en) | 1981-02-11 | 1981-02-11 | Method of anchoring optical fiber in the hermetic laser package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1151277A true CA1151277A (en) | 1983-08-02 |
Family
ID=4119163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000370663A Expired CA1151277A (en) | 1981-02-11 | 1981-02-11 | Method of anchoring optical fiber in the hermetic laser package |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA1151277A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0196875A1 (en) * | 1985-03-29 | 1986-10-08 | BRITISH TELECOMMUNICATIONS public limited company | Optical component mounting |
| FR2582413A1 (en) * | 1985-05-23 | 1986-11-28 | Comp Generale Electricite | Method for coupling an optical fibre to an optoelectronic component on a base |
| EP0243057A1 (en) * | 1986-04-23 | 1987-10-28 | Stc Plc | Optical transmission package |
| EP0264335A1 (en) * | 1986-10-17 | 1988-04-20 | Thomson Hybrides Et Microondes | Coupling module for a semiconductor laser with an optical fibre, and alignment method for this semiconductor device and this fibre |
| EP0628840A1 (en) * | 1993-04-13 | 1994-12-14 | Corning Incorporated | A method of encapsulating optical components and products produced by that method |
| EP1324088A2 (en) * | 2001-12-19 | 2003-07-02 | Trw Inc. | Coaxial laser weld through the lid of a photonics package |
-
1981
- 1981-02-11 CA CA000370663A patent/CA1151277A/en not_active Expired
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0196875A1 (en) * | 1985-03-29 | 1986-10-08 | BRITISH TELECOMMUNICATIONS public limited company | Optical component mounting |
| US4844581A (en) * | 1985-04-23 | 1989-07-04 | Stc Plc | Optical transmission package |
| FR2582413A1 (en) * | 1985-05-23 | 1986-11-28 | Comp Generale Electricite | Method for coupling an optical fibre to an optoelectronic component on a base |
| EP0243057A1 (en) * | 1986-04-23 | 1987-10-28 | Stc Plc | Optical transmission package |
| EP0264335A1 (en) * | 1986-10-17 | 1988-04-20 | Thomson Hybrides Et Microondes | Coupling module for a semiconductor laser with an optical fibre, and alignment method for this semiconductor device and this fibre |
| FR2605418A1 (en) * | 1986-10-17 | 1988-04-22 | Thomson Semiconducteurs | MODULE FOR COUPLING BETWEEN A SEMICONDUCTOR DEVICE AND AN OPTICAL FIBER, AND METHOD FOR ALIGNING SAID SEMICONDUCTOR DEVICE AND FIBER |
| US4807956A (en) * | 1986-10-17 | 1989-02-28 | Thomson Hybrides Et Microondes | Opto-electronic head for the coupling of a semi-conductor device with an optic fiber, and a method to align this semi-conductor device with this fiber |
| EP0628840A1 (en) * | 1993-04-13 | 1994-12-14 | Corning Incorporated | A method of encapsulating optical components and products produced by that method |
| US5475784A (en) * | 1993-04-13 | 1995-12-12 | Corning Incorporated | Method of encapsulating optical components and products produced by that method |
| EP1324088A2 (en) * | 2001-12-19 | 2003-07-02 | Trw Inc. | Coaxial laser weld through the lid of a photonics package |
| EP1324088A3 (en) * | 2001-12-19 | 2004-05-19 | Northrop Grumman Corporation | Coaxial laser weld through the lid of a photonics package |
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