CA1123920A - Laser soldering apparatus - Google Patents

Laser soldering apparatus

Info

Publication number
CA1123920A
CA1123920A CA331,825A CA331825A CA1123920A CA 1123920 A CA1123920 A CA 1123920A CA 331825 A CA331825 A CA 331825A CA 1123920 A CA1123920 A CA 1123920A
Authority
CA
Canada
Prior art keywords
solder
chip
component
soldering
energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA331,825A
Other languages
English (en)
French (fr)
Inventor
Kevin R. Daly
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of CA1123920A publication Critical patent/CA1123920A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0619—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams with spots located on opposed surfaces of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CA331,825A 1978-08-24 1979-07-13 Laser soldering apparatus Expired CA1123920A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93667178A 1978-08-24 1978-08-24
US936,671 1978-08-24

Publications (1)

Publication Number Publication Date
CA1123920A true CA1123920A (en) 1982-05-18

Family

ID=25468940

Family Applications (1)

Application Number Title Priority Date Filing Date
CA331,825A Expired CA1123920A (en) 1978-08-24 1979-07-13 Laser soldering apparatus

Country Status (7)

Country Link
JP (1) JPS5530895A (Direct)
CA (1) CA1123920A (Direct)
DE (1) DE2934407A1 (Direct)
FR (1) FR2434002A1 (Direct)
GB (1) GB2038220B (Direct)
IT (1) IT1120489B (Direct)
NL (1) NL7906042A (Direct)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0085278A1 (en) * 1982-01-28 1983-08-10 Battelle Development Corporation Split beam method of altering material properties
JPH0347730Y2 (Direct) * 1985-04-18 1991-10-11
DE3539933A1 (de) * 1985-11-11 1987-05-14 Nixdorf Computer Ag Vorrichtung zum aufloeten elektronischer bauelemente auf eine schaltungsplatine
JPH0677811B2 (ja) * 1986-01-20 1994-10-05 株式会社ハイベツク 自動半田付け装置
JPH0783036B2 (ja) * 1987-12-11 1995-09-06 三菱電機株式会社 キヤリアテープ
JPH02138066U (Direct) * 1989-04-17 1990-11-19
US5309545A (en) * 1990-08-27 1994-05-03 Sierra Research And Technology, Inc. Combined radiative and convective rework system
US5060288A (en) * 1990-08-27 1991-10-22 Sierra Research And Technology, Inc. Infrared heater array for IC soldering
DE19833368C1 (de) * 1998-07-24 2000-02-17 Schott Glas Verfahren und Vorrichtung zur Bearbeitung von Bauteilen aus sprödbrüchigen Werkstoffen
JP2005347415A (ja) * 2004-06-01 2005-12-15 Miyachi Technos Corp 電気部品実装方法
WO2006037370A1 (de) * 2004-10-06 2006-04-13 Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg Laseranordnung
WO2006037566A1 (de) 2004-10-06 2006-04-13 Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg Laseranordnung
CN110948079B (zh) * 2019-12-24 2023-10-10 武汉嘉铭激光股份有限公司 一种双激光锡焊的组合装置及其焊接方法
CN114682948B (zh) * 2022-03-04 2023-10-31 广东风华高新科技股份有限公司 片式元器件的可焊性测试方法、装置及系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1565832A1 (de) * 1966-09-06 1970-02-12 Siemens Ag Optische Anordnung fuer Laserstrahlen
US3524046A (en) * 1968-04-26 1970-08-11 Aluminum Co Of America Apparatus and method for piercing holes in elastomeric articles
GB1371624A (en) * 1971-03-26 1974-10-23 Atomic Energy Authority Uk Optical processing of materials
JPS5539434B2 (Direct) * 1972-08-25 1980-10-11
JPS5310937B2 (Direct) * 1973-05-18 1978-04-18
JPS5148917B2 (Direct) * 1973-10-26 1976-12-23
GB1510899A (en) * 1975-11-21 1978-05-17 Boc Ltd Laser machining
JPS5297696U (Direct) * 1976-01-21 1977-07-22
US4083629A (en) * 1976-11-29 1978-04-11 Gte Laboratories Incorporated Beam splitting system for a welding laser

Also Published As

Publication number Publication date
GB2038220A (en) 1980-07-23
NL7906042A (nl) 1980-02-26
IT1120489B (it) 1986-03-26
DE2934407A1 (de) 1980-03-06
FR2434002A1 (fr) 1980-03-21
JPS6349594B2 (Direct) 1988-10-05
IT7949988A0 (it) 1979-08-07
FR2434002B1 (Direct) 1983-08-12
JPS5530895A (en) 1980-03-04
GB2038220B (en) 1982-10-20

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Legal Events

Date Code Title Description
MKEX Expiry